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Heat conductive silicone grease composition and cured product thereof
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A technology of thermally conductive silicone grease and composition, which can be used in lubricating compositions, semiconductor/solid-state device parts, electrical solid-state devices, etc. The effect of thermal conductivity and good reliability
Inactive Publication Date: 2008-01-16
SHIN ETSU CHEM IND CO LTD
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However, these treatment agents will age through hydrolysis under high-temperature and high-humidity conditions, resulting in deterioration of the performance of thermally conductive materials
Also, although these thermally conductive materials exhibit good fluidity as described above, they tend to have problems of oil leakage when used over a long period of time.
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preparation example Construction
[0141] [Preparation of the composition of the present invention]
[0142] The thermally conductive silicone grease composition of the present invention can be obtained by a preparation method comprising the following steps:
[0143] (a) group (A), component (B)), component (C), component (E) and component (H) (if used) preferably at 40-120 ° C, more preferably 50-100 kneaded together at a temperature of °C, thereby preparing a homogeneous mixture, and
[0144] (b) Add component (D), component (F), component (G) and any other optional components (if used) to the homogeneous mixture, then preferably at 10-60°C, even more preferably Kneading is carried out at a temperature of 20-50° C. to prepare a homogeneous mixture.
[0145] In the above steps, kneading may be performed using a mixing-kneading device such as a conditioning mixer or a planetary mixer, which is equipped with a heating device and may further include a cooling device as necessary.
[0146] Step (b) is preferabl...
Embodiment
[0169] The present invention is described in more detail below using a series of examples and comparative examples, although the present invention is not limited by these examples in any way.
[0170] First, the following components required to form the composition of the present invention are prepared.
[0171]
[0172] -(A-1) Dimethylpolysiloxane having both ends of the molecular chain terminated by dimethylvinylsiloxy groups having a thickness of 600 mm at 25° C. 2 / s kinematic viscosity.
[0173] -(A-2) Dimethylpolysiloxane whose molecular chain both ends are terminated by dimethylvinylsiloxy groups, which has a thickness of 30,000mm at 25°C 2 / s kinematic viscosity.
[0174]
[0175] -(B-1) The organopolysiloxane represented by the structural formula shown below (having a thickness of 35mm at 25°C) 2 / s kinematic viscosity).
[0176]
[0177]
[0178] -(C-1) An alkoxysilane represented by the following formula.
[0179] C 10 h 21 Si(OCH 3 ) 3
[0180] -...
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Abstract
Provided is a heat conductive silicone grease composition, including: an organopolysiloxane containing 2 or more alkenyl groups bonded to silicon atoms within each molecule, an organopolysiloxane with a specific structure and with a kinematic viscosity at 25 DEG C of 10 to 10,000 mm 2 / s, an alkoxysilane containing specific substituent groups, an organohydrogenpolysiloxane containing 2 or more SiH groups within each molecule, a heat conductive filler, a platinum-based catalyst, and an addition reaction retarder. The heat conductive silicone grease composition exhibits high thermal conductivity, has excellent fluidity prior to curing and therefore exhibits favorable workability, is capable of filling fine indentations and therefore reduces contact resistance, and is also able to prevent oil separation and bleeding of the heat conductive material following curing, meaning the composition exhibits excellent heat radiation performance and reliability. Also, the heat conductive silicone grease composition exhibits improved durability under conditions of high temperature and high humidity, and thereby exhibits further improved reliability during actual use.
Description
technical field [0001] The present invention relates to a thermally conductive silicone grease composition, which maintains good fluidity and good handling properties even when filled with a large amount of thermally conductive filler to provide excellent thermal conductivity, and also exhibits excellent performance under high temperature and high humidity conditions durability and reliability. The present invention also relates to a method of curing the composition, a cured product of the composition, an electronic device including the cured product, and a method of forming a heat-conducting member between an electronic component and a heat-dissipating member. Background technique [0002] Electronic components (including IC packages such as CPU) mounted on a printed circuit board will increase in temperature due to heating of the components during operation, thereby degrading the performance of the components or even making the components fail. Therefore, a thermally cond...
Claims
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