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High-heat-conduction diamond/copper composite material and manufacturing method of high-heat-conduction diamond/copper composite material

A composite material and diamond technology, which is applied in the field of high thermal conductivity diamond/copper composite material and its preparation, can solve the problems of high brittleness, low thermal expansion coefficient and high cost, and achieves reduced interface thermal resistance, good thermal conductivity, and improved interface bonding state. Effect

Inactive Publication Date: 2015-05-20
NORTH CHINA UNIVERSITY OF SCIENCE AND TECHNOLOGY +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, if it is directly used as a heat sink material, the cost is high, the brittleness is large, and the thermal expansion coefficient is low

Method used

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  • High-heat-conduction diamond/copper composite material and manufacturing method of high-heat-conduction diamond/copper composite material
  • High-heat-conduction diamond/copper composite material and manufacturing method of high-heat-conduction diamond/copper composite material
  • High-heat-conduction diamond/copper composite material and manufacturing method of high-heat-conduction diamond/copper composite material

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Experimental program
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Effect test

Embodiment 1

[0020] Put titanium-coated diamond particles with an average particle size of 130 μm into a small metal cup, and cover the diamond particles with a pure copper sheet. Then put the large metal cup on the small cup for assembly. The assembled cup was placed in a vacuum furnace at 550 °C for 2 h under vacuum, and then the cup was assembled in a pyrophyllite block for ultra-high pressure sintering.

[0021] The ultra-high pressure sintering process adopts the mode of first pressurizing and then heating up. The pressure is raised to 5GPa and then the temperature is raised. The sintering temperature is 1200°C for 5 minutes, and then the pressure is released after cooling down. The synthesized samples were machined to 12.7 x 3.5 mm. The resulting composite has a density of 3.99 g / cm 3 , the relative density is 99.46%, and the thermal conductivity is 647W / (m·K).

Embodiment 2

[0023] Put titanium-coated diamond particles with an average particle size of 160 μm into a small metal cup, and cover the diamond particles with a pure copper sheet. Then put the large metal cup on the small cup for assembly. Put the assembled cup into a vacuum furnace for 2 hours at 550°C for vacuum treatment, then assemble the cup into a pyrophyllite block for ultra-high pressure sintering. The sintering process is as follows: sintering temperature is 1200°C, pressure is 3GPa, holding time for 5min. The resulting composite had a density of 3.64 g / cm 3 , the relative density is 99.71%, and the thermal conductivity is 685W / (m·K).

Embodiment 3

[0025] Put titanium-coated diamond particles with an average particle size of 200 μm into a small metal cup, and cover the diamond particles with a pure copper sheet. Then put the large metal cup on the small cup for assembly. Put the assembled cup into a vacuum furnace for 2 hours at 550°C for vacuum treatment, then assemble the cup into a pyrophyllite block for ultra-high pressure sintering, the sintering process is: sintering temperature 1000°C, pressure 5GPa, holding time for 5min. The resulting composite has a density of 3.89 g / cm 3 , the relative density is 99.64%, and the thermal conductivity is 670W / (m·K).

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Abstract

The invention discloses a high-heat-conduction diamond / copper composite material and a manufacturing method of the high-heat-conduction diamond / copper composite material, and belongs to the field of heat sink materials. A base material of the composite material is metal copper, and a reinforcement material of the composite material is diamond particles wrapped by titanium or chrome. The manufacturing method of the composite material includes the steps that the surfaces of the diamond particles with different particle diameters are plated with the titanium or the chrome with a magnetron sputtering method, a metal copper sheet is placed on the diamond particles for assembling, and the assembly is loaded into a pyrophylite mold after vacuum heat treatment is carried out; ultrahigh-pressure infiltration sintering is carried out under different-sintering-technology condition, and the high-heat-conduction diamond / copper composite material is manufactured. By means of the high-heat-conduction diamond / copper composite material and the manufacturing method, the problem of graphitization of diamond under the high temperature condition is solved, the density of the manufactured composite material is higher than 99%, the heat conductivity of the composite material is 685 W / (m.K), and the composite material can be used as a heat sink material in the fields of electronic packaging and the like.

Description

technical field [0001] The invention belongs to the field of heat sink materials, and in particular provides a high thermal conductivity diamond / copper composite material prepared by an ultra-high pressure sintering process and a preparation method thereof. Background technique [0002] With the rapid development of modern electronic information technology and high-density assembly technology of air-core printed boards, the integration and operation speed of modern electronic components are getting higher and higher, and a large amount of heat will be generated during operation. If it is emitted, it will seriously affect the working stability, safety and reliability of electronic devices and components. At the same time, if the thermal expansion coefficient of the packaging material and the chip is too different, it is easy to cause the chip to burst due to thermal stress damage or the solder joints and welds to crack. Studies have shown that when the thermal expansion coef...

Claims

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Application Information

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IPC IPC(8): B22F7/08B22F3/14C23C14/35B22F1/02
Inventor 董桂霞刘秋香李媛媛董丽李尚劼陈惠
Owner NORTH CHINA UNIVERSITY OF SCIENCE AND TECHNOLOGY
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