Phase change heat-conducting thermal silicone grease composition for central processing unit (CPU) radiating and preparation method thereof

Abstract

The invention discloses a phase change heat-conducting thermal silicone grease composition for central processing unit (CPU) radiating. The phase change heat-conducting thermal silicone grease composition is prepared from the following raw materials in parts by weight: 5-10 parts of base oil, 5-10 parts of paraffin, 1-3 parts of vinyl trimethoxy silane, 80-90 parts of heat-conducting filler. The method for preparing the phase change heat-conducting thermal silicone grease composition for CPU radiating comprises the following steps: 1) performing particle size distribution on the heat-conducting filler; 2) mixing the compounded heat-conducting filler and vinyl trimethoxy silane in ethanol, regulating the pH of the solution to be 3-4, heating to the temperature of 70-80 DEG C, stirring for 2-4 hours, removing ethanol, and obtaining a modified inorganic filler; and 3) heating 5-10 parts by weight of paraffin to be melted, adding 5-10 parts by weight of base oil and the modified inorganic filler prepared in the previous step, and fully mixing to prepare the phase change heat-conducting thermal silicone grease composition. The phase change heat-conducting thermal silicone grease is high in heat-conducting coefficient and high in heat transfer capacity, and the excessive heat of the CPU can be rapidly derived, so that the service life of the CPU is prolonged, and the preparation process is simple.

Description

technical field [0001] The invention relates to a phase-change heat-conducting silicone grease composition for CPU heat dissipation and a preparation method thereof. Background technique [0002] In recent years, with the development of science and technology, the densification and miniaturization of integrated circuits has become higher and higher, electronic components have become smaller and run at faster speeds, and the power density has continued to increase. More heat will be generated inside. According to statistics, CPU failures caused by overheating account for 55% of the total number of CPU failures, and every 10% increase in operating temperature reduces reliability by 50%. It can be seen that heat dissipation is an important issue affecting the progress of PCB board technology. The ideal state for the heat sink to exert the best heat dissipation effect is to be in close contact with the heat source, but due to the limitation of machining accuracy, there are actu...

AI Technical Summary

Problems solved by technology

According to statistics, CPU failures caused by overheating account for 55% of the total number of CPU failures, and for every 10% increase in operating temperature, the reliability will decrease by 50%. It can be seen that heat dissipation is an important issue affecting the progress of PCB technology.

The ideal state for the heat sink to exert the best heat dissipation effect is to be in close contact with the heat source, but due to the limitation of machining accuracy, there are actually many gaps between the contact surfaces of the two

Due to the high thermal resistance of the air filling these gaps, the heat dissipation effect will be greatly reduced

[0003] At present, a variety of heat dissipation materials and thermal interface materials have been developed. At the beginning, thermal conductive silicone grease with good fluidity was used to fill the gap between the CPU and the heat sink. However, the thermal conductive silicone grease is easy to flow, which will pollute the circuit board. Cause short circuit and other faults, and because the thermal conductive silicone grease will dry out and lose after many cycles of cold and heat, the thermal resistance will increase accordingly