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Biodegradable sanitary towel with polylactic acid as main component
PendingCN119280452AStable physical propertiesreduce absorptionSanitary towelsBaby linensPolymer scienceSuper absorbent
The invention discloses a biodegradable sanitary towel with polylactic acid as a main component. The biodegradable sanitary towel comprises a degradable core body, and the degradable core body comprises a surface layer, an absorption core layer and a bottom layer; the surface layer is a polylactic acid fiber non-woven fabric; the polylactic acid fiber non-woven fabric is a polylactic acid fiber spunlace non-woven fabric, a polylactic acid fiber hot air non-woven fabric or a polylactic acid spunbond non-woven fabric; the absorption core layer comprises an upper layer, a middle layer and a lower layer; the upper layer and the lower layer are made of polylactic acid fiber non-woven fabrics, and the middle layer is a mixture composed of polylactic acid two-component fibers and super absorbent resin. And the bottom layer is a degradable impermeable film which is a PHA modified polylactic acid film. The composite material has natural weak acidity and natural antibacterial activity, can create a weak-acidity antibacterial microenvironment for people, is skin-friendly, environment-friendly and healthy, and is an ideal selected material for disposable hygienic products. The natural antibacterial agent has the functions of natural bacteriostasis, weak acidity and the like, and is biodegradable.
Owner:CHANGSHU GOLD SPRING CHEM FIBERS & KNITTINGS +1
Bulk phase passivation perovskite light absorption layer, solar cell and preparation method
PendingCN119300617Areduce defectsReduce defect concentrationPhotovoltaic energy generationPerovskite solar cellElectrical battery
The invention relates to the technical field of perovskite solar cell preparation, in particular to a bulk phase passivation perovskite light absorption layer, a solar cell and a preparation method, the bulk phase passivation perovskite light absorption layer is prepared by adopting a perovskite layer prefabricated liquid, the perovskite layer prefabricated liquid comprises (FA 0.95 MA0.05) 0.95 Cs0.05 Pb (I 0.95 Br0.05) 3 and m-F-PEACl, the molar concentration ratio of the (FA 0.95 MA0.05) 0.95 Cs0.05 Pb (I 0.95 Br0.05) 3 to the m-F-PEACl is 1.5: (0.1-1), m-F-PEACl and (FA < 0.95 > MA0. 05) < 0.95 > Cs0. 05Pb (I < 0.95 > Br0. 05) 3 are matched to form a bulk phase passivated perovskite layer, so that organic cations in the m-F-PEACl interact with uncoordinated lead ions or other defect sites in the (FA < 0.95 > MA0. 05) < 0.95 > Cs0. 05Pb (I < 0.95 > Br0. 05) 3 to form a stable complex or compound, the defect concentration in perovskite is reduced, comprehensive and effective passivation is realized, and the performance of the perovskite is improved. Therefore, the photoelectric property and the stability of the perovskite material are improved. The problem that comprehensive and effective passivation cannot be achieved through a perovskite thin film passivation method in the prior art is solved.
Owner:HUANENG CLEAN ENERGY RES INST +1
Preparation process and application of wear-resistant and high-temperature-resistant cable
PendingCN119463339AImprove thermal conductivityHigh mechanical strengthClimate change adaptationInsulated cablesPolyesterMaterials processing
The invention discloses a preparation process and application of a wear-resistant and high-temperature-resistant cable, and belongs to the technical field of cable material processing. In order to solve the technical problem that in the prior art, the wear resistance, heat resistance and heat conduction performance of cable materials for high-speed trains need to be further improved, the preparation technology of the wear-resistant and high-temperature-resistant cable comprises the following steps that a plurality of cable cores are arranged in the length direction of a hemp rope with the hemp rope as the axis, and rubber strips are filled among the cable cores; and then a polyester tape and cable core mixture is wrapped outside the plurality of cable cores and the filling strips. The composite graphene, polysiloxane and modified magnesia are used as reinforcing materials to reinforce a polyethylene base material, so that the mechanical strength and wear resistance of the cable material are effectively improved, and the flame retardant property, heat resistance and heat-conducting property of the cable material are also improved.
Owner:GUANGZHOUZHUJIANG CABLE CO LTD
Spotlight radiator and spotlight
ActiveCN222578191Uavoid accumulationspeed up exportLighting heating/cooling arrangementsSemiconductor devices for light sourcesMechanical engineeringHeat spreader
Owner:ZHONGSHAN DIANWOYOU TECHNOLOGY CO LTD
Lithium battery protection system for preventing overcharge
InactiveCN119134574Aspeed up chemical reactionsavoid damageBatteries circuit arrangementsEmergency protective circuit arrangementsElectrical batteryControl engineering
The invention belongs to the technical field of battery protection, and particularly discloses a lithium battery protection system for preventing overcharge, which comprises a battery module, a switch unit, a logic control circuit and a state detection circuit, the switch unit is connected in a charging path of the battery module, one end of the switch unit is connected with the charging circuit, and the other end of the switch unit is connected with the logic control circuit. The state detection circuit comprises a voltage monitoring module, a current monitoring module and a temperature monitoring module which are connected and is used for detecting the state of the battery module and generating a state signal, the state signal is used for indicating the state of the battery module, and the logic control circuit receives the state signal from the state detection circuit and sends the state signal to the battery module. The switch unit is controlled according to the state signal to open and close the charging circuit; the state detection circuit is arranged to monitor the state of the battery module in real time, once it is detected that the battery is to be overcharged, the logic control circuit will close the switch unit to close the charging circuit, and the problem of explosion caused by overcharge of the battery module is avoided.
Owner:GUANGDONG JINHONG ELECTRONIC TECHNOLOGY CO LTD
E-shaped magnetic core convenient for heat dissipation
ActiveCN222653729Uspeed up exportImprove cooling effectTransformers/inductances coolingTransformers/inductances coils/windings/connectionsMechanical engineeringMechanics
The E-shaped magnetic core comprises an E-shaped magnetic core body, the E-shaped magnetic core body comprises a base, two side columns and a middle column, the middle column is provided with a heat dissipation channel and a plurality of heat conduction channels communicated with the heat dissipation channel, the heat conduction channels are located on the surface of a middle column body, and the heat conduction channels are evenly distributed around the middle column. The magnetic core has the advantages that the heat dissipation effect of the middle column is improved, the situation that heat cannot be dissipated in time due to the fact that the temperature is too high, and the performance of the magnetic core is affected is avoided, and the magnetic core is not prone to being damaged due to the fact that heat dissipation is not conducted in time. And the coils can be limited according to the number of coils wound on the middle column, the situation that the use effect of the magnetic core is affected due to the fact that the number of coils wound on the middle column is too small and the coils are prone to loosening is avoided, and practicability is improved.
Owner:TONGXIANG YUTONG ELECTRONIC TECH CO LTD
A method for preparing a diamond microchannel heat sink with high thermal conductivity and low fluid resistance
ActiveCN114758996Bspeed up exportImprove cooling effectPolycrystalline material growthAfter-treatment detailsCarbon filmEtching
The invention discloses a method for preparing a high thermal conductivity and low fluid resistance diamond microchannel heat sink, firstly, a dielectric layer film is deposited on the surface of a cleaned polished single crystal silicon wafer substrate, a groove structure with a microchannel frame is formed on the surface of the dielectric layer film by etching using a mask plate with microchannel gate holes; diamond polycrystalline film is epitaxially grown multiple times on the surface of the dielectric layer film with the groove structure, the groove is filled and the dielectric film is covered, and the growth surface of the diamond polycrystalline film is thinned and polished to be flat; the single crystal silicon wafer substrate and the dielectric layer film are removed by pickling or etching, and the nucleation layer of the diamond polycrystalline film is treated by plasma active etching to obtain a diamond wafer with a microchannel structure; finally, a layer of super-hydrophobic amorphous carbon film is deposited on the surface of the diamond microchannel, thereby obtaining a diamond microchannel heat sink with high thermal conductivity and low fluid resistance. The invention comprehensively utilizes the advantages of high thermal conductivity of diamond and super-hydrophobic amorphous carbon-based film, and has significant significance for improving the heat dissipation performance of high-power semiconductor lasers and large-scale integrated circuits.
Owner:TAIYUAN UNIVERSITY OF TECHNOLOGY
Positive pressure sealing cavity structure for vertical laser and receiver
The invention discloses a vertical laser and receiver positive pressure sealing cavity structure, and relates to the technical field of optical laser and receiver protection cavity structures needing positive pressure sealing. According to the invention, a positive pressure sealing cavity comprising a laser and a receiver is adopted, and the window glass and the flange are integrated by adopting a high-temperature sintering process, so that excellent sealing performance is ensured. And a real-time temperature monitoring and heating system is designed and integrated, so that the influence of window atomization on laser signal receiving is prevented, the heat dissipation effect is enhanced, an air inlet system is simplified, and the overall stability and the use efficiency of equipment are improved. Compared with the prior art, the LED lamp has obvious advantages in sealing performance, heat dissipation performance and maintenance convenience.
Owner:JIUJIANG PRECISION MEASURING TECH RES INST
Novel camera module heat transfer structure, camera module and mobile terminal
The utility model relates to a novel camera module heat transfer structure, a camera module and a mobile terminal. The novel camera module heat transfer structure comprises a copper sheet arranged on the back surface of an RFPC rigid-flex board; the heat dissipation copper piece is used for carrying out heat dissipation on the photosensitive chip; at least one first through hole is formed in the position, corresponding to the photosensitive chip, of the RFPC rigid-flex board; a first connecting part extending downwards is arranged at the position, corresponding to the first through hole, of the heat dissipation copper piece, and / or a second connecting part extending upwards is arranged at the position, corresponding to the first through hole, of the copper sheet; and the heat dissipation copper piece is in contact with the copper sheet through the first connecting part and / or the second connecting part. According to the utility model, heat at the bottom of the photosensitive chip can be quickly conducted out.
Owner:CHONGQING TIANSHI PRECISION TECH CO LTD
Labor-saving type nozzle material ejection mechanism
The utility model discloses a laborsaving type nozzle material ejection mechanism, which relates to the field of plastic moulds and comprises a mould base, a top cover plate is inserted into the inner wall of the top of the mould base, a filling port is formed in the inner wall of the top of the top cover plate, an insertion groove is formed in the inner wall of the side surface of the mould base, and two groups of telescopic rods are mounted on the inner wall of the side surface of the insertion groove. Inserting pieces are arranged on the sides, close to the telescopic rods, of the inner walls of the inserting grooves, oblique-angle blades are installed on the outer walls of the side faces of the inserting pieces, heat insulation plates are installed on the sides, away from the oblique-angle blades, of the outer walls of the side faces of the inserting pieces, ejection pieces are inserted into the inner wall of the bottom of the mold base, and hydraulic rods are installed on the inner wall of the bottom of the mold base and close to the bottoms of the ejection pieces. And multiple groups of heat dissipation holes are formed in the bottom inner wall, close to the bottom of the telescopic rod, of the insertion groove. The ejection efficiency of the device can be improved, the forming speed is high, and the practicability is improved.
Owner:SUZHOU XINGSIDA MOULD CO LTD
Automatic proportioning equipment and method for pneumatic liquid injection pump
PendingCN119455720Amix thoroughlyspeed up exportShaking/oscillating/vibrating mixersRotary stirring mixersSlurryMechanical engineering
The invention belongs to the technical field of pneumatic liquid injection pumps, and particularly relates to automatic proportioning equipment for a pneumatic liquid injection pump, the automatic proportioning equipment comprises a pump body and a mixing tank connected with the pump body, the pump body comprises a cylinder barrel, two working cylinders are arranged at the two ends of the cylinder barrel, and a main piston is slidably arranged in the cylinder barrel; an auxiliary piston is arranged in the working cylinder in a sliding manner; the using method of the automatic proportioning equipment for the pneumatic liquid injection pump comprises the following steps of adjusting the size of the slurry outlet, discharging slurry components, mixing, pumping slurry and discharging the slurry. The working cylinders are arranged at the two ends of the cylinder barrel, so that slurry discharging and sucking on the two sides are alternately carried out, slurry component discharging control is achieved through rotation of the matching barrel, vibration caused by rotation of the matching barrel can avoid blockage and accelerate component guiding-out, and when the mixing blades rotate, the mixing blades are combined with extrusion of vertical movement of the extrusion disc, so that the mixing efficiency is improved. The shearing and stirring effects are enhanced, so that all the components are quickly and uniformly mixed.
Owner:JIAOZUO TEGUANG LIGHTING EQUIP
LED lamp bead testing device
The utility model belongs to LED lamp test technical field especially, a kind of LED lamp pearl testing device, in view of the problem that the existing test lamp pearl testing device lacks special heat dissipation mechanism, present and propose the following scheme, including integrating sphere and computer, the inside fixedly connected with spectrometer of integrating sphere, support seat is fixedly connected at the inside bottom of integrating sphere, electric appliance box is bonded in the top of support seat, heat dissipation mechanism is arranged between the both sides of two supports for the heat dissipation of the test lamp pearl of test, the heat dissipation mechanism includes the heat dissipation plate fixedly connected between the both sides of two supports, the top of two supports is fixedly connected with same fan, in the utility model, the heat generated when testing test lamp pearl is quickly absorbed by copper heat-conducting block excellent heat-conducting performance, the heat dissipation area of multiple copper heat-dissipating fins on its surface is greatly expanded, forced convection is formed by cooperating fan, heat export is accelerated, the influence caused by test lamp pearl heating during testing is avoided.
Owner:DONGGUAN TENGLI TECHNOLOGY CO LTD
Gallium nitride module and semiconductor device
ActiveCN222338278UImprove thermal conductivityspeed up exportSemiconductor/solid-state device detailsSolid-state devicesDevice materialHeat sink
The utility model relates to a gallium nitride module and a semiconductor device, and belongs to the technical field of gallium nitride. The heat dissipation structure comprises a first PCB and a copper clamp arranged on the first surface of the first PCB, the surface of the copper clamp is provided with a heat dissipation sheet, and the heat dissipation sheet is used for clamping a gallium nitride chip between the copper clamp and the first surface of the first PCB and carrying out heat dissipation on the gallium nitride chip; the gallium nitride chip can be connected with the PCB without wire bonding, and heat generated in the operation process of the gallium nitride chip can be rapidly conducted out through the good heat conduction performance of the copper clamp. Meanwhile, the radiating fins are arranged on the surface of the copper clamp, the radiating surface area is further increased, the radiating efficiency is improved, when the gallium nitride module works, heat generated by the gallium nitride chip is conducted to the surrounding environment through the radiating fins on the surface of the copper clamp, performance reduction or overheating damage of the gallium nitride chip is prevented, and the radiating performance of the gallium nitride module is improved.
Owner:NANJING X-IPM TECH CO LTD
Efficient heat transfer tube for evaporator
ActiveCN119223039Aspeed up importspeed up exportEvaporators/condensersStationary tubular conduit assembliesGas bubbleHeat transfer tube
The invention relates to the technical field of evaporators, in particular to an efficient heat transfer tube for an evaporator, which comprises a U-shaped tube, connecting ends arranged at two ends of the U-shaped tube and a fixing frame used for connecting the U-shaped tube and the connecting ends, and the U-shaped tube comprises long straight parts on two sides and a bent part connected between the two long straight parts; rotating assemblies are arranged between the two ends of the U-shaped pipe and the two connecting ends respectively and connected between the U-shaped pipe and the connecting ends. The rotating assembly comprises a rotating pipe, and the rotating pipe is rotationally connected between the end of the U-shaped pipe and the connecting end. A flow guide assembly is arranged on the outer side of the rotating pipe, the rotating pipe drives the flow guide assembly to rotate, the flow guide assembly comprises flow guide plates, and the multiple flow guide plates are annularly arranged on the outer side of the long straight part. Bubbles can be rapidly led out, liquid can be rapidly replaced, and therefore the heat exchange effect of the heat transfer pipe is improved.
Owner:JIANGSU HUADONG POWER & METALLURGICAL MASCH FACTORY
A high-efficiency dc-dc power module for a tractor
The application provides a kind of high efficiency DC-DC power module of power saving type for tractor, it is related to power module technical field, including substrate, DC-DC power module, top plate, air-cooled heat sink and at least one heat conducting piece.The application, by setting heat conducting piece between the heat generating element of DC-DC power module and top plate, the equivalent thermal conductivity of the heat conducting piece from first end (heat source end) to second end (top plate end) shows decreasing trend;It is realized that the equivalent thermal conductivity is high near the heat generating element, the heat can be quickly exported from heat source, avoid heat accumulation to cause element junction temperature too high;With the heat transfer along the heat conducting piece to top plate direction, the equivalent thermal conductivity gradually reduces, and the heat flow transmission capacity weakens, to make heat more dissipate through the side wall of heat conducting piece to the surrounding environment (especially the airflow driven by air-cooled heat sink).
Owner:HEFEI RUIANFEI TECHNOLOGY CO LTD
Fry domestication box with residual feed filtering device
ActiveCN224111947URealize zoned feedingachieve regulationClimate change adaptationPisciculture and aquariaHydraulic cylinderFishery
The utility model discloses a fish fry domestication box with a residual feed filtering device, which comprises a base, a domestication piece for fish fry domestication is arranged on the upper side of the base, and the domestication piece comprises a storage frame, a feeding device and a feeding device, the switching piece is installed on the storage frame and used for partition and area switching processing of the fry, and the switching piece comprises a rotating seat rotationally connected to the middle of the storage frame. According to the fry domestication box with the residual feed filtering device, a switching piece and an impurity removing piece are arranged in the device, and a storage frame, a first motor, a rotating seat, a hydraulic cylinder, a connecting frame, a partition plate, an air cylinder assembly, a limiting frame, a rotating ring, an extension rod, an adjusting plate and a vibration motor are matched with one another, so that partition feeding of fries is achieved, and the positions of the fries fed in the partition mode are adjusted; the fish fry repelling function is achieved, and it is avoided that due to the fact that the fish fries stay in corresponding areas, the residual feed is guided out.
Owner:GUANGDONG DERUI AQUATIC PRODUCTS CO LTD
Cooling and heat dissipation mechanism for plastic mold processing
The utility model relates to the technical field of mold processing, in particular to a cooling heat dissipation mechanism for plastic mold processing. Comprising a frame body, a connecting guide plate is fixedly arranged on one side of the frame body, connecting lug plates are fixedly arranged on the two sides of the connecting guide plate, fastening bolts are arranged on the connecting lug plates in a penetrating mode, a heat conduction container is fixedly connected to the center of the frame body, a cavity is formed in the heat conduction container, and the cavity is filled with cooling liquid; a plurality of evenly-arranged cooling fins are fixedly arranged on one side of the heat conduction container, the top end and the bottom end of the frame body are each fixedly provided with a pair of connecting arms, and a rectangular open groove is formed in one end of each connecting arm. The utility model aims to solve the technical problem that the maintenance operation is influenced due to the fact that a mould frame is easily overheated in the processing process of a plastic mould.
Owner:DONGGUAN GESHANG PLASTIC MOLD CO LTD
Heat conduction structure and photoelectric conversion module
InactiveCN119535694Aavoid overall overheatingEasy to operateCoupling light guidesModifications by conduction heat transferThermodynamicsPhotoelectric conversion
The invention provides a heat conduction structure which comprises a heat absorption wall, a heat conduction wall and two side walls, the heat absorption wall, the heat conduction wall and the two side walls form a containing space in a surrounding mode, the heat absorption wall, the heat conduction wall and the two side walls are formed by bending a single-piece material, the heat absorption walls are formed at the two ends of the single-piece material, and the heat conduction wall is formed at the two ends of the single-piece material. And a gap exists between two ends of the single-sheet material on the plane where the heat absorption wall is located. The invention further provides a photoelectric conversion module which comprises a photoelectric conversion circuit board and the heat conduction structure, the photoelectric conversion circuit board is arranged in the containing space, and at least two heating elements in the multiple heating elements of the photoelectric conversion circuit board are located on the two sides of the gap respectively. The heat conduction structure and the photoelectric conversion module solve the problem that an existing electronic element is poor in heat conduction efficiency, and the heat interference effect of a plurality of heat sources can be reduced to the maximum extent.
Owner:DONGGUAN CLOUD LIGHT TECH LTD
A computing device with heat dissipation on both the front and back.
ActiveCN224287473UEven heat dissipationSolve local heat accumulation problemsDigital data processing detailsHeat spreaderHigh heat
This invention provides a computing device with heat dissipation on both sides, relating to the field of heat dissipation technology for high-heat computing devices. Addressing the problem of high heat generation and poor single-sided heat dissipation in existing computing devices due to highly integrated chips, this device includes a chassis, a computing board, and a heat sink. The chassis has ventilation holes and an intake fan and an exhaust fan on its front and rear panels, respectively. The computing board integrates a computing chip on its front side, with an upper heat-conducting plate and a lower heat-conducting plate fixed to its front and back sides, respectively. The back of the upper heat-conducting plate contacts the chip, and the front side has multiple upper heat sinks extending forward and backward (arranged alternately). The back of the lower heat-conducting plate covers the back of the computing board, and the front side has multiple lower heat sinks extending forward and backward (arranged alternately). The upper heat-conducting plate, computing board, and lower heat-conducting plate are suspended above the chassis bottom plate and located between the intake fan and the exhaust fan. This structure, through double-sided heat conduction, matching the heat sink with the airflow direction, and the suspended design, effectively improves heat dissipation efficiency and ensures the reliability of device operation.
Owner:SHANGHAI INTCHAINS TECH CO LTD
Transformer lead structure and transformer device thereof
ActiveCN119480373AEasy to installEasy to disassembleTransformers/inductances coolingTransformers/inductances coils/windings/connectionsTransformerStructural engineering
The invention relates to the technical field of transformer lead structures, and discloses a transformer lead structure and a transformer device thereof.The transformer lead structure is characterized in that an electric wire is sleeved with insulating rubber, a connecting frame is arranged on the outer wall of the insulating rubber, the three pieces of insulating rubber are connected through the connecting frame, and a shell is rotationally connected to the outer wall of one end of the insulating rubber; the shell is located outside the connecting assembly. Through the arrangement of the connecting assembly, when disassembly needs to be carried out, the connecting frame is controlled, insulating rubber and a wire are driven to move, a U-shaped block is adjusted, a round hole block extrudes a second rotating block, and the second rotating block rotates towards the outer side of the U-shaped block, so that disassembly is carried out, and then a torsional spring resets the second rotating block.
Owner:DAWEI ELECTRIC CO LTD
Multi-chip stacked package solid state disk with integrated cooling fins
ActiveCN119650531ASolve the cooling problemImprove seismic performanceSemiconductor/solid-state device detailsNon-rotating vibration suppressionHeat sinkChip stacking
The invention discloses a multi-chip stacked package solid state disk with integrated cooling fins, and belongs to the technical field of solid state disks. The multi-chip stacked packaging solid state disk with the integrated cooling fins comprises a bottom plate, an integrated cooling cover and a circuit board, the bottom plate covers the integrated cooling cover, the integrated cooling cover and the bottom plate define a packaging external structure, the circuit board is arranged between the bottom plate and the integrated cooling cover, and a plurality of vertically stacked NAND flash memory chips are arranged on the circuit board. According to the multi-chip stacked packaging solid state disk with the integrated cooling fins, the first cooling fins are arranged at the tops of the NAND flash memory chips, and the chip side heat dissipation structures are arranged on the side faces of the NAND flash memory chips, so that multi-directional heat dissipation design is achieved, it is ensured that heat can be rapidly conducted out from multiple directions, the overall heat dissipation efficiency is improved, and the service life of the solid state disk is prolonged. The heat dissipation problem of the multi-chip stacked packaging solid state disk is solved.
Owner:SHENZHEN MICRO INNOVATION IND CO LTD
Composite porous circuit board
ActiveCN224097893UQuick cooling operationspeed up exportPrinted circuit detailsCircuit arrangements on support structuresElectrical and Electronics engineeringChassis
Owner:SHENZHEN SENYONGSHENG TECHNOLOGY CO LTD
Laser radar TOF module convenient for heat dissipation
The utility model provides a laser radar TOF module convenient for heat dissipation, comprising a circuit board, the front surface of the circuit board is provided with a TOF module, the back surface of the circuit board is provided with a control module, the control module is electrically connected with the TOF module, the back surface of the circuit board is also provided with a heat conduction insulation part, and the heat conduction insulation part is electrically connected with the control module. And the heat-conducting insulating part is coated on an electronic component on the back surface of the circuit board. According to the utility model, the arrangement structure of internal components of the laser radar TOF module is improved, and the back surface of the circuit board is provided with the heat conduction insulation part, thereby improving the heating distribution of the module, reducing the internal heating source of the module, accelerating the heat conduction, improving the heat dissipation performance of the laser radar TOF module, and improving the service life of the laser radar TOF module. And the overall stability of the laser radar TOF module is facilitated.
Owner:SHENZHEN ADAPS PHOTONICS TECH CO LTD
High-strength rod-shaped porcelain insulator and preparation method thereof
ActiveCN119390463AImprove compactnesshigh strengthInsulatorsCeramic materials productionFiberMullite
The invention provides a high-strength rod-shaped porcelain insulator and a preparation method thereof. The high-strength rod-shaped porcelain insulator is prepared from the following raw materials in parts by weight: 50 to 70 parts of alumina, 20 to 30 parts of feldspar powder, 10 to 20 parts of mullite powder, 20 to 40 parts of alumina powder, 5 to 20 parts of silicon dioxide micro powder, 5 to 15 parts of boron nitride powder, 10 to 20 parts of tourmaline powder, 5 to 10 parts of semi-carbonized straw fiber and 5 to 10 parts of diethyl succinate. The semi-carbonized straw fibers are obtained by carrying out pyrolysis treatment on straws under an anaerobic condition. The high-strength rod-shaped porcelain insulator provided by the invention has excellent strength performance, and can maintain relatively good working stability in atrocious weather.
Owner:JIANGXI KUNBIDA ELECTRIC POWER CO LTD
Heat-dissipation dustproof intelligent virtual robot structure
The utility model discloses a heat dissipation dustproof intelligent virtual robot structure which comprises a base and a robot body installed on the base, the robot body comprises an outer shell, a heat dissipation support is arranged on the rear portion of the outer shell, the heat dissipation support is installed on the base, and a strip-shaped opening is formed in the heat dissipation support. The strip-shaped opening is covered with a heat dissipation metal sheet. A plurality of heat dissipation fins perpendicular to the integrated circuit board are arranged on one face of the integrated circuit board in the robot body, and a heat conduction piece is attached to the surface of the battery pack. On one hand, the heat dissipation metal sheets are used for conducting passive heat dissipation on the interior of the robot to meet a certain heat dissipation effect, on the other hand, the heat dissipation metal sheets cover the strip-shaped openings, the dustproof and waterproof functions are achieved, interference of the external environment to the interior of the robot is reduced, and stable operation of electronic components in the robot body is guaranteed; the service life is prolonged; and the maintenance cost is reduced.
Owner:SHENZHEN KIM DAI INTELLIGENCE INNOVATION TECHNOLOGY CO LTD
Semiconductor laser packaging structure
PendingCN119581991Aspeed up exportFast and even heat dissipationLaser detailsSemiconductor lasersGainErbium lasers
The invention relates to the technical field of laser devices, in particular to a semiconductor laser device packaging structure which comprises a gain chip, a semiconductor laser device and a semiconductor laser device, the gain chip is arranged on one surface, arranged in the thickness direction, of the heat sink, and the thickness direction of the gain chip is parallel to the thickness direction of the heat sink; the heat dissipation base comprises an installation area, a first extension area and a second extension area, the first extension area and the second extension area are located on the two sides of the installation area, the side, away from the gain chip, of the heat sink is arranged on the installation area, and a water cooling pipe is arranged in the heat dissipation base and sequentially penetrates through the first extension area, the installation area and the second extension area; the pipe diameter of the water cooling pipe is gradually decreased from the first extension area to the mounting area, and the pipe diameter of the water cooling pipe is gradually increased from the mounting area to the second extension area. The invention is at least beneficial to improving the temperature stability of the pumping area of the gain chip.
Owner:CHANGCHUN INST OF OPTICS FINE MECHANICS & PHYSICS CHINESE ACAD OF SCI
Snakelike liquid cooling energy storage battery PACK based on large-surface fitting
PendingCN121964937AImprove structural strengthDistribute local stressSecondary cellsThermodynamicsElectrical battery
The invention discloses a snakelike liquid cooling energy storage battery PACK based on large-surface fitting. The PACK comprises a box body, and a battery module and a liquid cooling module which are arranged in the box body. The battery module is formed by arranging a plurality of battery cells; the liquid cooling module comprises a plurality of snakelike heat exchange plates which are arranged in parallel, and the large surfaces of the battery cells are attached to the snakelike heat exchange plates. A liquid through hole is formed in the snake-shaped heat exchange plate, and the two ends of the snake-shaped heat exchange plate are connected with a liquid inlet and outlet pipe with partitions and a reversing pipe to form a cooling liquid reciprocating flow path; the liquid inlet / outlet branch pipe is connected with the main pipe, and rapid external butt joint is achieved through the male plug. According to the invention, the heat exchange area is greatly increased through large-surface fitting, the heat conduction path is shortened, turbulence and temperature uniformity are promoted in combination with the snakelike back-and-forth flow channels, the problems of large thermal resistance and obvious temperature difference of a traditional bottom cooling or side cooling scheme are effectively solved, and the heat dissipation efficiency, temperature consistency and system reliability in a high-rate charging and discharging scene are obviously improved.
Owner:FUJI HEAVY IND (SHAOXING) ENERGY STORAGE SYSTEM CO LTD
Raw material storing and discharging mechanism of anti-sticking hydraulic incense making machine
The utility model discloses an anti-sticking hydraulic incense making machine raw material storing and discharging mechanism which comprises a storage tank, a sealing cover is arranged at the top end of the storage tank in a clamped mode, an operation box is fixedly arranged at the top end of the sealing cover, a wind-up roller is rotationally arranged in the operation box, and two pulling ropes are arranged on the surface of the wind-up roller in a wound mode. According to the anti-sticking raw material storing and discharging mechanism for the hydraulic incense making machine, the winding roller is driven by the motor to rotate clockwise, so that the two pulling ropes are unwound, the winding roller is driven by the motor to rotate clockwise, and the raw materials are stored in the storage tank, so that the raw materials are stored in the storage tank, and the raw materials are stored in the storage tank. According to the storage tank, the weight block moves downwards under the action of the gravity of the weight block, guiding-out of the raw materials can be accelerated, meanwhile, the cleaning soft cushion is arranged so that the raw materials adhering to the inner wall of the storage tank can be conveniently cleaned, and the situation that follow-up cleaning is inconvenient and raw material waste is caused due to the fact that the raw materials adhere to the inner wall of the storage tank is avoided.
Owner:FUJIAN BAIXUAN FRAGRANCE CO LTD
LED lamp bead structure with stability and refractive index
ActiveCN222459251UIncrease lighting brightnessImprove light uniformitySemiconductor devices for light sourcesRefractive indexEngineering
The LED lamp bead structure with the stability and the refractive index comprises a base, a positive conductive column, a negative conductive column, stabilizing frames and an LED light-emitting element, the LED light-emitting element is fixed to the upper side face of the base, the positive conductive column and the negative conductive column are fixed to the lower side face of the base respectively, and the stabilizing frames are installed on the outer side face of the positive conductive column and the outer side face of the negative conductive column; the base comprises a buckling plate, a base plate, a first reflecting plate and a second reflecting plate, the first reflecting plate is fixed on the base plate, and an LED light-emitting element is arranged on the first reflecting plate; the lower end of the buckling plate is fixed with the base plate; and a second reflecting plate is fixed on the inner wall of the buckling plate. Due to the arrangement of the base and the stabilizing frame, during use, the stability and the refractive index of the LED light-emitting element can be improved, the single-color LED light-emitting element can be fixed, the double-color LED light-emitting element can also be fixed, and meanwhile heat between the LED light-emitting element and a circuit board can be rapidly conducted out.
Owner:SHENZHEN CHENG XING ELETRONIC TECH LTD
Thermal buffer for enhancing melting heat absorption of phase-change material by using elastic potential energy
PendingCN121772183AIncrease heat absorption ratetight deliveryCooling/ventilation/heating modificationsHeat managementEndotherm
The invention relates to the technical field of electronic equipment thermal management, in particular to an electronic equipment thermal buffer device suitable for missile-borne, spacecraft and other environments facing extreme high thermal load and severe temperature fluctuation. Comprising a packaging base body and a phase-change material, a partition plate is fixedly installed in the packaging base body and on one side of the phase-change material, a pressing plate is arranged on one side of the partition plate, and a spring winding type wire pulling device is arranged on the other side of the partition plate; the clockwork spring winding type wire pulling device comprises a reel for winding a pulling wire, a first bevel gear fixedly mounted on the reel, and a clockwork spring in transmission connection with the first bevel gear; a through hole is formed in the center of the phase change material, and a pulley is arranged on the inner wall of the packaging substrate corresponding to one end, far away from the pressing plate, of the through hole; the pull wire penetrates through the partition plate, the pressing plate and the through hole and bypasses the pulley, and the tail end of the pull wire is fixedly connected to the pressing plate. The device operates completely based on the mechanical energy storage principle, the transmission mechanism is efficient and stable, the heat conduction efficiency and the interface heat exchange capacity are high, and the heat dissipation performance consistency is good.
Owner:CHINA UNIV OF PETROLEUM (EAST CHINA)