Radiating structure of electronic assemblies

Abstract

The invention relates to a radiating structure of electronic assemblies, which comprises a radiating fin, an aluminum radiating base arranged on the radiating fin and at least one electronic assembly arranged on the aluminum radiating base, wherein at least one copper column heat conductor is arranged on the aluminum radiating base via a mold in a forcibly-pressed manner with the position corresponding thereto, so that heat conduction for the electronic assemblies can be realized, thus achieving the advantages of low manufacturing cost, fast production, reduced manufacturing procedures, good environmental friendliness and high radiating efficiency.

Description

technical field [0001] The present invention provides a heat dissipation structure, especially a heat dissipation structure of an electronic component with low manufacturing cost, rapid production, reduced manufacturing process, environmental protection and high heat dissipation efficiency. Background technique [0002] Press, because the light-emitting diode (Light Emitting Diode, LED) uses the principle of directly converting electrical energy into light energy, and applies a voltage to the positive and negative terminals in the semiconductor. When the current passes through, the electrons and holes are combined, and the remaining energy It is released in the form of light, and depending on the material used, the photon energy can be used to generate light of different wavelengths according to its energy level. It is widely used because of its advantages of high brightness, power saving, and long life. In all kinds of technology and daily life, it has become an indispensab...

AI Technical Summary

Problems solved by technology

The main purpose of the present invention is: the aluminum heat sink system on the heat dissipation structure is connected with a heat dissipation fin, and the aluminum heat sink body is provided with at least one copper column for heat conduction by means of mold closing and forcing. The body is arranged on it, and several electronic components are respectively arranged on the relative positions of the copper pillar heat conductors, so that when the electronic components start to operate and generate heat energy, through the relative position of the copper pillar heat conductors Setting, effectively exporting heat quickly, with the above-mentioned technology, it can be aimed at the improvement of the heat dissipation module of conventional LED lamps. The existing heat dissipation method is that it is necessary to punch holes on the aluminum heat dissipation base to form a concave hole, and then Then put the heat-conducting copper pillar into the concave hole. This method is not only time-consuming and labor-intensive, but also not cost-effective. There is an additional concave hole process in the process, and the cost and production schedule will be consumed and delayed. Therefore, the industrial competitiveness is not good. Moreover, because this conventional technology requires pre-drilling, it is easy to cause the concave hole to be too large or too small. Due to poor adhesion (gaps are created around), the heat dissipation effect is reduced, and because of the gaps, impurities are easily generated in the gaps, which affects the heat dissipation effect. In addition, the heat dissipation module adopts the principle of thermal expansion and contraction. The problem of not only time-consuming but also consumables in the manufacturing process has been broken through, so that the copper column heat conductor can be placed on the aluminum heat dissipation base by stamping or closed force, and it corresponds to the electronic components that generate heat, so that it can be improved. The heat conduction effect reduces the manufacturing cost, the rapid production, the reduction of the manufacturing process and the practical progress of environmental protection

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