LED lamp with high power

An LED lamp, high-power technology, applied in the cooling/heating device, lighting and heating equipment, electrical components and other directions of lighting devices, can solve the problems of poor product heat dissipation, not suitable for LED, poor sealing, etc., to increase the light output efficiency , The effect of sealing and protecting the chip and preventing glue from climbing

Inactive Publication Date: 2009-09-23
薛信培 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, most of the existing medium and high-power LEDs use in-line, patch, and plastic TOP bracket structures, which have poor heat dissipation, poor sealing, fast attenuation, and low light efficiency.
Not suitable for the development of LED to lighting applications

Method used

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  • LED lamp with high power
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  • LED lamp with high power

Examples

Experimental program
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Embodiment Construction

[0024] As shown in the drawings, in an embodiment of a high-power LED lamp of the present invention, it includes a thermally conductive and insulating substrate 10 and a thermally conductive base column 20 that is the same thickness as the substrate 10 and embedded in the substrate 10. The base column 20 is a cuboid, its lower surface is connected to a cooling plate 21, and the upper surface is fixed with a chip 22; the upper surface of the substrate 10 is fixed with a transparent cover 23, and the circuit and electrodes are arranged, and the through hole 11 through which the circuit passes is arranged on the edge, and the bottom of the through hole 11 The conductive electrode sheet 12 is separated from the heat dissipation plate 21 of the base column 20 to separate the heat conduction part from the conduction part, and the lens 13 is encapsulated on the transparent cover 23 of the substrate 10 .

[0025] The transparent cover 23 is an inverted conical shape with a large top an...

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PUM

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Abstract

The invention relates to an LED lamp with high power, which comprises a heat-conducting and insulating substrate and a heat conducting pillar which has the same thickness of the substrate and is embedded in the substrate; the lower surface of the pillar is connected with a heat dissipating plate, and the upper surface thereof is fixed with a chip; the upper surface of the substrate is fixed with a transparent housing and is provided with a circuit and electrodes; the periphery of the substrate is provided with a through hole used for the circuit passing through; the bottom of the through hole is connected with a conductive electrode plate; and a lens is encapsulated on the transparent housing of the substrate. The LED lamp with high power has unique structure, breaks through the design of traditional LED lamp, can improve the reliability and consistency of the products; and simultaneously, by utilizing machinery equipments for production, the production efficiency is greatly improved and the product cost is reduced.

Description

technical field [0001] The invention relates to the field of semiconductor lighting, more specifically, to a high-power LED lamp. Background technique [0002] led (Light Emitting Diode), also known as light-emitting diode, as a new type of light source, it has the advantages of small size, low energy consumption, strong applicability, high stability, short response time, no pollution to the environment, and multi-color light emission. Widely used in the field of lighting decoration. A lamp using a high-power LED as a light source has the advantages of high luminous efficiency, energy saving, and environmental protection. [0003] However, most of the existing medium and high-power LEDs adopt in-line, SMD, and plastic TOP bracket structures. The products have poor heat dissipation, poor sealing, fast attenuation, and low light efficiency. It is not suitable for the development of LED to lighting applications. Contents of the invention [0004] The technical problem to ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F21S2/00F21V29/00F21V23/00F21V17/00F21V9/10F21Y101/02F21V9/40
CPCH01L33/642H01L33/486H01L2224/49107H01L33/62H01L2224/48091
Inventor 薛信培薛信燊
Owner 薛信培
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