Low-filling-capacity and high-heat-conductivity graphene/silicone grease composite material and preparation method thereof

Abstract

The invention discloses a low-filling-capacity and high-heat-conductivity graphene / silicone grease composite material and a preparation method thereof. Heat-conductive silicone grease is prepared by filling functional reduction-oxidation graphene sheet with silicone oil. The preparation method of the composite material comprises the following steps: preparing the functional reduction-oxidation graphene sheet as heat-conductive filler; sufficiently mixing the modified heat-conductive filler and dimethicone matrix in a double-roller open mill to uniformly disperse the functional reduction-oxidation graphene sheet in the silicone oil matrix. The heat-conductive silicone grease provided by the invention can be used for effectively avoiding the contacting gap between a high-power electronic component heating element and a heat radiation device, so that the interface contact thermal resistance can be reduced, a high-efficiency heat radiation passage is formed, and heat transfer is accelerated; the silicone grease is beneficial to encapsulation and radiation of the high-power electronic components, can be used for improving the reliability of the electronic component products and prolonging the service life of the products, and is simple in preparation process.

Description

technical field [0001] The invention relates to a graphene / silicon grease composite material with low filling amount and high thermal conductivity used for encapsulating and dissipating heat of high-power electronic components and a preparation method thereof. Background technique [0002] Thermally conductive silicone grease, also known as thermally conductive paste, is a high thermally conductive silicone material that can maintain the grease state during use at a temperature of -50°C to 300°C for a long time. In the application of heat dissipation and heat conduction, even two planes with very smooth surfaces will have gaps when they are in contact with each other, and the air in the gaps is a poor conductor of heat, which will hinder the conduction of the heat emitted by the heating element to the heat sink. Use thermal conductive silicone grease to fill the contact interface between heating elements of high-power electronic components (LED chips, computer CPUs, high-pow...

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Problems solved by technology

The thermal conductivity of the thermally conductive silicone grease prepared by this method is relatively low, generally only 0.6-0.9W / (m·K), and the product performance is relatively poor

On the other hand, due to the relatively low thermal conductivity of metal oxides, the filling amount of fillers in the prepared silicone grease is relatively large (100-1000 parts), which affects the fluidity of the silicone grease and ultimately affects its use. Actual heat dissipation effect when packaged

In addition, the compatibility of metal oxides and silicone oil is poor, resulting in a large thermal resistance between the matrix and the filler in the thermally conductive silicone grease, which ultimately affects the thermal conductivity of the thermally conductive silicone grease

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