Ultra-low thermal-resistance heat-conducing silicon grease and preparation method thereof

Abstract

The invention discloses ultra-low thermal-resistance heat-conducing silicon grease. The silicon grease is prepared by the following raw materials according to parts by weight: 100 parts of polydimethylsiloxane, 10-40 parts of polyphenylmethylsiloxane, 1000-2600 parts of aluminum oxide, 20-60 parts of zinc oxide and 1-10 parts of a coupling agent. Furthermore, the invention discloses a preparation method of the ultra-low thermal resistant heat-conducing silicon grease. The heat-conducting silicon grease has the following advantages that the silicon grease has a high heat-conducting coefficient and ultra-low contact thermal resistance, and the contact thermal resistance is lower than 0.06K.cm<2> / W (pressure 40psi); and the silicon grease is stable to store at room temperature, free from oil seepage, good in high-temperature resistance, free from drying after long-time use at high temperature, and excellent in both electric insulating and dielectric performances.

Description

technical field [0001] The invention relates to a composition of polymer substances, in particular to an ultra-low thermal resistance thermal conductive silicone grease and a preparation method thereof. Background technique [0002] In the application of electronic components, for some high-power electronic components (such as CPU, high-power LED, high-power transistor, etc.), the heat sink in contact with the electronic components is usually used to dissipate the heat of the electronic components faster , to reduce the temperature of electronic components. Due to the uneven microscopic surface of the interface between the electronic component and the radiator, there is a gap between the interface between the electronic component and the radiator, and there is air in the gap, and the thermal conductivity of the air is very low (generally 0.025W / ( m·K)), which will affect the overall cooling effect of electronic components. In view of the above problems, the usual solution ...

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Problems solved by technology

[0004] (1) Simply pursuing high thermal conductivity, while ignoring the contact thermal resistance between the hot and cold surfaces. Although the thermal conductivity reaches 5.0W / (m K), its contact thermal resistance is as high as 0.2-0.4 K cm2 / W (pressure 40psi), the heat transfer effect is poor;

[0005] (2) Metal fillers are used to improve thermal conductivity and reduce thermal resistance, but lead to poor electrical insulation performance, dielectric performance and weather resistance;

[0006] (3) Poor oil seepage resistance, silicone oil is easy to seep out during use and pollute other parts;

[0007] (4) Poor heat resistance, cannot be used at high temperature for a long time, and it is easy to dry out during use

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