Ultra-low thermal-resistance heat-conducing silicon grease and preparation method thereof

A technology of resisting heat conduction and ultra-low heat, applied in the field of ultra-low thermal resistance heat-conducting silicone grease and its preparation, which can solve the problems of easy leakage of silicone oil, poor heat transfer effect, pollution of other components, etc., and achieve good electrical insulation performance and dielectric performance. , The effect of good high temperature resistance and high thermal conductivity

Active Publication Date: 2013-07-10
NICHE TECH KAISER SHANTOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] (1) Simply pursuing high thermal conductivity, while ignoring the contact thermal resistance between the hot and cold surfaces. Although the thermal conductivity reaches 5.0W/(m K), its contact thermal resistance is as high as 0.2-0.4 K cm2/W (pressure 40psi), the heat transfer effect is poor;
[0005] (2) Metal fillers are used to improve thermal condu...

Method used

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  • Ultra-low thermal-resistance heat-conducing silicon grease and preparation method thereof

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Experimental program
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Effect test

Embodiment 1

[0028] First of all, pretreatment of raw materials, including: (a) drying aluminum oxide and zinc oxide at a drying temperature of 120°C and a drying time of 100 minutes to remove moisture; (b) drying polydimethylsiloxane Alkanes (viscosity 500mPa·S (25°C)) are added to the double planetary mixer with heating jacket and vacuum equipment, and then 150°C heating oil is passed into the heating jacket, and the vacuum equipment is started to clean the inside of the double planetary mixer. Vacuumize (the absolute pressure inside the dual planetary mixer is 500Pa after vacuuming), and stir (stirring speed is 200 rpm, stirring time is 60 minutes), and cool to 25°C after stirring.

[0029] Then, follow the steps below to prepare ultra-low thermal resistance thermal grease:

[0030] (1) By weight, take 100 parts of polydimethylsiloxane, 20 parts of polyphenylmethylsiloxane (its viscosity is 50 mPa·S (25°C)), 1000 parts of alumina, 20 parts of oxide Zinc (the median particle size D50 is...

Embodiment 2

[0037] First of all, pretreatment of raw materials, including: (a) drying aluminum oxide and zinc oxide at a drying temperature of 120°C and a drying time of 80 minutes to remove moisture; (b) drying polydimethylsiloxane Alkanes (with a viscosity of 50mPa·S (25°C)) are added to the double planetary mixer with heating jacket and vacuum equipment, and then 150°C heating oil is passed into the heating jacket, and the vacuum equipment is started to adjust the double planetary mixer. Vacuumize inside (the absolute pressure inside the double planetary mixer is 200Pa after vacuuming), and stir (stirring speed is 400 rpm, stirring time is 60 minutes), and cool to 30°C after stirring.

[0038] Then, follow the steps below to prepare ultra-low thermal resistance thermal grease:

[0039] (1) By weight, take 100 parts of polydimethylsiloxane, 40 parts of polyphenylmethylsiloxane (with a viscosity of 50 mPa·S (25°C)), 2600 parts of alumina, 20 parts of oxide Zinc (the median particle size...

Embodiment 3

[0046] First, carry out raw material pretreatment, including: (a) drying aluminum oxide and zinc oxide at a drying temperature of 110°C and a drying time of 100 minutes to remove moisture; (b) drying polydimethylsiloxane Alkanes (with a viscosity of 200mPa·S (25°C)) are added to the double planetary mixer with heating jacket and vacuum equipment, and then 140°C heating oil is passed into the heating jacket, and the vacuum equipment is started to adjust the double planetary mixer. Vacuumize inside (the absolute pressure inside the double planetary mixer is 300Pa after vacuuming), and stir (stirring speed is 300 rpm, stirring time is 80 minutes), and cool to 20°C after stirring.

[0047] Then, follow the steps below to prepare ultra-low thermal resistance thermal grease:

[0048] (1) By weight, take 100 parts of polydimethylsiloxane, 20 parts of polyphenylmethylsiloxane (with a viscosity of 200 mPa·S (25°C)), 1600 parts of alumina, 40 parts of oxide Zinc (the median particle si...

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Abstract

The invention discloses ultra-low thermal-resistance heat-conducing silicon grease. The silicon grease is prepared by the following raw materials according to parts by weight: 100 parts of polydimethylsiloxane, 10-40 parts of polyphenylmethylsiloxane, 1000-2600 parts of aluminum oxide, 20-60 parts of zinc oxide and 1-10 parts of a coupling agent. Furthermore, the invention discloses a preparation method of the ultra-low thermal resistant heat-conducing silicon grease. The heat-conducting silicon grease has the following advantages that the silicon grease has a high heat-conducting coefficient and ultra-low contact thermal resistance, and the contact thermal resistance is lower than 0.06K.cm<2>/W (pressure 40psi); and the silicon grease is stable to store at room temperature, free from oil seepage, good in high-temperature resistance, free from drying after long-time use at high temperature, and excellent in both electric insulating and dielectric performances.

Description

technical field [0001] The invention relates to a composition of polymer substances, in particular to an ultra-low thermal resistance thermal conductive silicone grease and a preparation method thereof. Background technique [0002] In the application of electronic components, for some high-power electronic components (such as CPU, high-power LED, high-power transistor, etc.), the heat sink in contact with the electronic components is usually used to dissipate the heat of the electronic components faster , to reduce the temperature of electronic components. Due to the uneven microscopic surface of the interface between the electronic component and the radiator, there is a gap between the interface between the electronic component and the radiator, and there is air in the gap, and the thermal conductivity of the air is very low (generally 0.025W / ( m·K)), which will affect the overall cooling effect of electronic components. In view of the above problems, the usual solution ...

Claims

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Application Information

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IPC IPC(8): C08L83/04C08K7/18C08K3/22C08K5/5425C08K5/5419C08G77/34
Inventor 周振基周博轩石逸武许喜銮罗永祥
Owner NICHE TECH KAISER SHANTOU
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