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Heat-conducting silica gel and preparation method thereof

A heat-conducting silicon and gel technology, which is applied in the field of heat-conducting silicon gel and its preparation, can solve the problems of drying out and achieve the effects of simple use, guaranteed heat conduction efficiency, and outstanding durability

Inactive Publication Date: 2017-02-15
厦门安耐伟业新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The main purpose of the present invention is to provide a thermally conductive silicone gel, which aims to obtain a thermally conductive interface material with higher stability than the commonly used silicone grease, silicone paste, and thermally conductive mud in the market, and solve the problem of silicon gel commonly used in the market. Grease, silicone paste, and thermal paste will dry out after long-term use at high temperatures, thereby ensuring the thermal conductivity of thermal interface materials for long-term use

Method used

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  • Heat-conducting silica gel and preparation method thereof

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preparation example Construction

[0051] The present invention also proposes a preparation method of the aforementioned thermally conductive silicone gel, the preparation method comprising the following steps:

[0052] mixing the base polymer, filler, silane coupling agent, and plasticizer to obtain a mixture;

[0053] heating the mixture to 120-160° C. for dehydration for 1-3 hours under vacuum to obtain the base material;

[0054] cooling the base to room temperature;

[0055] Adding inhibitor, crosslinking agent and catalyst to the base material in turn, and stirring evenly under vacuum condition;

[0056] Keeping it under vacuum condition at 80-150° C. for 30-60 minutes can obtain the thermally conductive silicone gel of the present invention.

[0057] The selection of vacuum conditions in the preparation method of the thermally conductive silicone gel of the present invention can make small molecular components such as water in the preparation process of the thermally conductive silicone gel more easily...

Embodiment 1

[0061] Mix 100 parts of base polymer vinylpolymethylvinylsiloxane with a dynamic viscosity of 100mPa·s at 25°C and a vinyl content of 5%, 850 parts of aluminum oxide, 250 parts of zinc oxide, 28 parts of Layer graphene powder, 0.2 parts of polydimethylsiloxane with a dynamic viscosity of 500mPa·s at 25°C, and 2 parts of (3-acryloyloxypropyl) trimethoxysilane were added to a kneader and mixed in a vacuum Heating to 130°C for 3 hours to dehydrate under the same conditions to obtain the base material;

[0062] Cool the base material prepared in the above steps to room temperature, add 0.01 parts of dimethylhexynol, 1 part of methyl hydrogen polysiloxane with a hydrogen content of 0.10%, and 10 parts of polysiloxane with a hydrogen content of 0.10% Terminal hydrogen-containing polysiloxane, 0.1 part of platinum catalyst with a concentration of 2000 ppm, after vacuum stirring evenly, keep at 150° C. under vacuum condition for 30 minutes to obtain thermally conductive silicone gel. ...

Embodiment 2

[0064] 100 parts of base polymer vinylpolymethylvinylsiloxane with a dynamic viscosity of 400mPa·s at 25°C and a vinyl content of 2%, 700 parts of aluminum oxide, 150 parts of zinc oxide, and more than 16 parts layer graphene powder, 1 part of hydrophilic fumed silica, 0.5 part of MDT polysiloxane with a dynamic viscosity of 400 mPa·s at 25 °C, 10 parts of (3-glycidoxypropyl) trimethoxy Add the silane to the kneader and mix, then heat to 150°C for 2 hours under vacuum to dehydrate to obtain the base material;

[0065] Cool the base material prepared in the above steps to room temperature, add 0.05 parts of acetylene cyclohexanol, 3 parts of methyl hydrogen polysiloxane with a hydrogen content of 0.18%, and 3 parts of end-containing polysiloxane with a hydrogen content of 0.08% Hydrogen polysiloxane, 2 parts of platinum catalyst with a concentration of 2000ppm, after vacuum stirring evenly, keep at 100°C under vacuum condition for 40min to obtain thermally conductive silicone g...

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Abstract

The invention discloses a heat-conducting silica gel and a preparation method thereof, wherein the heat-conducting silica gel comprises the following components in parts by weight: 100 parts of a basic polymer, 0.1-10 parts of a crosslinking agent, 500-1800 parts of a filler, and 0.1-15 parts of a silane coupling agent. The technical scheme of the invention can obtain a heat-conducting interface material which has higher heat-conducting stability compared with silicone grease, silicone cream and heat-conducting mud which are generally used on market at present, and solves the problem that the silicone grease, the silicone cream and the heat-conducting mud which are generally used on market at present will become dry when used at a high temperature for a long time, thereby ensuring the heat-conducting efficiency of long-term use of the heat-conducting interface material.

Description

technical field [0001] The invention relates to the technical field of thermally conductive interface materials, in particular to a thermally conductive silicone gel and a preparation method thereof. Background technique [0002] At present, thermal interface materials such as silicone grease, silicone paste, and heat-conducting mud, which are widely used in electronic and electrical products, are filled between electronic components to be cooled and radiators or housings, and between electronic components to be cooled. It is in close contact with the radiator or shell to quickly and effectively complete the heat conduction process, reduce the temperature of electronic components, prolong the service life of electronic components, and improve the reliability of electronic components. Therefore, such thermal interface materials usually have the advantages of high thermal conductivity, low interface thermal resistance, high and low temperature resistance, weather resistance, r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/07C08L83/05C08K13/02C08K3/22C08K3/04C08K5/5425C08K3/36
CPCC08L83/04C08L2205/025C08L2205/035C08K13/02C08K2003/2227C08K2003/2296C08K3/04C08K5/5425C08K3/36
Inventor 刘洪熊巧稚曾增明阙金基
Owner 厦门安耐伟业新材料有限公司
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