Heat conductive silicone grease composition
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- SHENZHEN BORNSUN INDAL
- Publication Date
- 2008-10-29
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Abstract
Description
technical field
[0001] The invention relates to a high-temperature-resistant heat-conducting silicone grease composition. Background technique
[0002] With the continuous increase of power consumption and power density of microelectronics technology, heat dissipation has become the key to the progress of PCB board technology. The operating temperature of a single electronic component increases by 10°C, and the reliability is reduced by 50%. CPU failure due to overheating accounts for CPU failure The proportion of the total is 55%. As a result, many heat dissipation technologies and heat dissipation materials have been developed. Among them, thermal interface materials have been widely used because they can effectively reduce the interface thermal resistance between heat sources and heat sinks, and many varieties have been derived. Thermal grease is one of them. According to different application environments, silicone grease is divided into conductive and thermal conducti...