Preparation method of metal polymer composite material

A metal polymer and composite material technology, applied in the field of the preparation of metal polymer composite materials, can solve the problems of precise control of the thickness of the modified layer, difficulty in dielectric, thermal conductivity, mechanics, etc. wide range of effects

Active Publication Date: 2014-03-26
FUDAN UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

But so far, it is still difficult to precisely control the thickness of the modified layer through a simple process, and then adjust the insulation, the recombination and thermal conductivity

Method used

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  • Preparation method of metal polymer composite material
  • Preparation method of metal polymer composite material
  • Preparation method of metal polymer composite material

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Embodiment Construction

[0048]In order to make the object, technical solution and advantages of the present invention clearer, various embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings. However, those of ordinary skill in the art can understand that, in each implementation manner of the present invention, many technical details are provided for readers to better understand the present application. However, even without these technical details and various changes and modifications based on the following implementation modes, the technical solution claimed in each claim of the present application can be realized.

[0049] The first embodiment of the present invention relates to a method for preparing a metal-polymer composite material. Contains the following steps:

[0050] Add metal particles and monomer dopamine to the prepared activation solution;

[0051] placing the mixed solution composed of the activation solution, metal partic...

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Abstract

The invention relates to the field of an electronic material, and discloses a preparation method of a metal polymer composite material. The method comprises the following steps: firstly, adding metal grains and monomer dopamine to a prepared activated solution, and then putting a mixed solution composed of the activated solution, the metal grains and monomer dopamine into an oxygen environment, so as to form polydopamine-modified metal grains; mixing the polydopamine-modified metal grains with a polymer or a monomer of the polymer; finally solidifying a mixture composed of the polydopamine-modified metal grains and the polymer or the monomer of the polymer, so as to form a metal polymer composite material. Compared with the prior art, by adopting the metal polymer composite material prepared by the method, the requirements of high dielectric constant, heat conduction and insulation can be simultaneously met, meanwhile, the binding power between the metal grains and a matrix is improved by the metal grain surface-modified polydopamine, and improvement of the shear strength of the composite material is facilitated.

Description

technical field [0001] The invention relates to the field of electronic materials, in particular to a preparation method of metal-polymer composite materials. Background technique [0002] Metal-polymer composite materials, especially silver-polymer composite materials, are a class of materials commonly used in the electronics field, such as conductive adhesives, thermally conductive materials, high dielectric materials, etc. In the traditional preparation process, the metal particles (such as silver flakes, etc.) are directly mixed with polymer monomers, the coating film is formed, and cured. The compatibility between the silver flakes and some polymers is not very good, and the shear strength of the composite material is biased. Low. Secondly, taking the composite material of silver flakes and epoxy resin as an example, the addition of conductive filler micron silver flakes improves the electrical and thermal conductivity of the material. In polymer composite materials, ...

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Application Information

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IPC IPC(8): C08L63/00C08K9/10C08K3/08
Inventor 金云霞肖斐
Owner FUDAN UNIV
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