Single-component epoxy resin conductive silver adhesive composition and preparation method thereof

A technology of epoxy resin and conductive silver glue, which is applied in the direction of epoxy resin glue, conductive adhesive, adhesive, etc., can solve the problems that hinder the development and application of conductive glue, inconvenient use, short pot life, etc., and achieve room temperature storage Good stability, long pot life, and stable electrical performance

Active Publication Date: 2014-09-03
江苏矽时代材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the one-component conductive silver adhesive currently on the market has high viscosity (the viscosity of the commercially available single-component conductive silver adhesive ranges from 100,000 to hundreds of thousands of cPs, which is sticky and thick, and is very inconvenient to use), easy to lay...

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0053] A one-component epoxy resin conductive adhesive composition contains the following components in parts by weight:

[0054] 10 parts of bisphenol A type epoxy resin;

[0055] 2 parts of n-butyl glycidyl ether;

[0056] Carboxyl-terminated liquid nitrile rubber 0.5 part;

[0057] Nano silicon dioxide 0.1 part;

[0058] 0.2 parts of toluene;

[0059] 0.1 parts of γ-aminopropyltriethoxysilane;

[0060] 0.1 parts of 2-hydroxy-4-n-octyloxybenzophenone;

[0061] 1 part of dicyandiamide;

[0062] 0.1 part of 2,4,6-tris(dimethylaminomethyl)phenol;

[0063] 85.9 parts of 2~6μm flake silver powder;

[0064] Preparation method: under the condition of 20-35 ℃, fully mix other components except silver powder, then add a measured amount of silver powder, and then fully mix evenly, and vacuum defoaming under stirring conditions to obtain the finished epoxy resin conductive adhesive combination things.

[0065] The viscosity of the co...

Embodiment 2

[0067] A one-component epoxy resin conductive adhesive composition contains the following components in parts by weight:

[0068] 15 parts of bisphenol F type epoxy resin;

[0069] 1.5 parts of allyl glycidyl ether;

[0070] 1 part of hydroxyl-terminated liquid polybutadiene rubber;

[0071] 0.2 parts of nano-titanium dioxide;

[0072] 0.3 part of ethyl acetate;

[0073] 0.1 part of γ-(ethylenediamino)propyltrimethoxysilane;

[0074] 0.1 part of 2-(2'-hydroxy-5-methylphenyl)benzotriazole;

[0075] Sebacic acid dihydrazide 1 part;

[0076] 0.2 parts of tetramethylguanidine;

[0077] 80.6 parts of 10-15 μm flake silver powder;

[0078] Preparation method: under the condition of 20-35 ℃, fully mix other components except silver powder, then add a measured amount of silver powder, and then fully mix evenly, and vacuum defoaming under stirring conditions to obtain the finished epoxy resin conductive adhesive combination things.

...

Embodiment 3

[0081] A one-component epoxy resin conductive adhesive composition contains the following components in parts by weight:

[0082] 10 parts of bisphenol A type epoxy resin;

[0083] 10 parts of 663 polyether epoxy resin;

[0084] 1 part of resorcinol diglycidyl ether;

[0085] 1 part liquid polyurethane;

[0086] 0.3 parts of nano-alumina;

[0087] 0.2 parts of methylcyclohexane;

[0088] 0.1 part of isopropyl tris(dodecylbenzenesulfonyl) titanate;

[0089] 0.1 part of 2-(2'-hydroxy-3,5'-di-tert-butylphenyl)-5-chlorobenzotriazole;

[0090] 0.5 part of boron trifluoride-monoethylamine complex;

[0091] 0.1 part of adipate salt of 2-ethyl-4-methylimidazole;

[0092] 76.7 parts of 10-15μm subspherical silver powder;

[0093] Preparation method: under the condition of 20-35 ℃, fully mix other components except silver powder, then add a measured amount of silver powder, and then fully mix evenly, and vacuum defoaming under ...

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Abstract

The invention belongs to the technical field of epoxy resin adhesives, and particularly discloses a single-component epoxy resin conductive silver adhesive composition and a preparation method thereof. The composition contains the following components in parts by weight: 10-25 parts of epoxy resin, 1-5 parts of diluter, 0.5-3 parts of toughening agent, 0.5-3 parts of enhancer, 0.5-3 parts of solvent, 0.5-3 parts of coupling agent, 0.5-3 parts of anti-aging agent, 1-5 parts of curing agent, 0.2-1 part of accelerator and 30-35 parts of silver powder. The preparation method of the composition comprises the following steps: thoroughly and uniformly mixing all the components except silver powder at 20-35 DEG C, adding the silver powder, thoroughly and uniformly mixing, and carrying out vacuum degassing under stirring conditions to obtain the finished epoxy resin conductive adhesive composition product. The composition has the advantages of low viscosity, favorable condensate strength, high adhesive force, low volume resistivity, high heat conductivity, long shelf life, favorable long-term weather resistance and stable electric properties, and can be widely used in electronic industry and other conductive adhesive industries.

Description

technical field [0001] The invention relates to the technical field of adhesives, in particular to a one-component epoxy resin conductive silver adhesive composition and a preparation method thereof. Background technique [0002] At present, due to the miniaturization of electronic components and the development of lead-free electronic products, traditional high-temperature soldering is difficult to meet the installation of micro components and the connection of complex circuits. Therefore, conductive adhesives have become an indispensable new material in the electronics industry. At present, the most commonly used conductive adhesive is epoxy resin conductive adhesive because of its good bonding force and mechanical strength. The most commonly used conductive filler is metallic silver powder. Conductive silver glue includes two-component conductive silver glue and single-component conductive silver glue. Among them, the bubbles generated during the mixing process of two-co...

Claims

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Application Information

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IPC IPC(8): C09J163/02C09J163/00C09J175/04C09J109/00C09J9/02C09J11/04C09J11/06
Inventor 程芳文柯明新
Owner 江苏矽时代材料科技有限公司
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