Preparation method of high-thermal conductivity graphene-Sn-Ag composite brazing filler metal

A technology of high thermal conductivity graphite and composite brazing filler metal, applied in manufacturing tools, welding equipment, metal processing equipment, etc., can solve problems such as graphene floating, improve wettability and thermal conductivity, good brazing and service performance , the effect of improving stability

Active Publication Date: 2015-03-11
HARBIN INST OF TECH
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  • Claims
  • Application Information

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Problems solved by technology

[0005] The purpose of the present invention is to reduce the large density difference between graphene and Sn-Ag based solder matrix by graphene metallization, thereby solving the problem of graphene floating and agglomeration during the preparation and use of composite solder, and simultaneously making graphite Graphene is more uniformly dispersed in the solder matrix, and the addition of graphene improves the thermal conductivity of the composite solder, thereby improving the reliability of packaging and brazing

Method used

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  • Preparation method of high-thermal conductivity graphene-Sn-Ag composite brazing filler metal
  • Preparation method of high-thermal conductivity graphene-Sn-Ag composite brazing filler metal
  • Preparation method of high-thermal conductivity graphene-Sn-Ag composite brazing filler metal

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specific Embodiment approach 1

[0020] Specific embodiment one: In this embodiment, a kind of high thermal conductivity graphene--Sn-Ag series composite solder is composed of metal-coated graphene and Sn-Ag series solder; the high thermal conductivity graphene--Sn-Ag series composite The mass fraction of metal-coated graphene in the solder is 0.1%~1%; when the lead-free solder is Sn-Ag-Cu, Sn-Ag-Cu-Bi, Sn-Bi-Ag-Cu alloy The metal-coated graphene is silver-coated graphene or copper-coated graphene; when the lead-free solder is a Sn-Ag alloy, the metal-coated graphene is silver-coated graphene.

[0021] In this embodiment, graphene is used as a reinforcing phase, and its excellent mechanical, electrical and thermal properties are used to improve the performance of the lead-free solder prepared in the prior art.

[0022] This embodiment adopts graphene metal plating, which reduces the density difference between graphene and lead-free solder, and solves the problem of graphene floating and agglomeration caused b...

specific Embodiment approach 2

[0024]Embodiment 2: This embodiment differs from Embodiment 1 in that: the mass fraction of metal-coated graphene in the high thermal conductivity graphene-Sn-Ag composite solder is 0.2%. Others are the same as the first embodiment.

specific Embodiment approach 3

[0025] Embodiment 3: This embodiment differs from Embodiment 1 or Embodiment 2 in that: the mass fraction of metal-coated graphene in the high thermal conductivity graphene-Sn-Ag composite solder is 0.4%. Others are the same as those in Embodiment 1 or 2.

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Abstract

The invention discloses a preparation method of a high-thermal conductivity graphene-Sn-Ag composite brazing filler metal, ad relates to a preparation method of a high-thermal conductivity composite brazing filler metal. The preparation method has the following purposes: the problem of graphene floating and agglomeration in the preparation and application process of the composite brazing filler metal is solved by reducing a greater density difference between graphene and an Sn-Ag brazing filler metal matrix through plating a metal on the graphene; meanwhile, the graphene is dispersed more uniformly in the brazing filler metal matrix; and the reliability of sealing and brazing is improved by improving the heat conductivity of the composite brazing filler metal through adding the graphene. The method comprises the following steps: (1) the metal is plated on the graphene; and (2) the ball milling, the mixing and the medium-temperature smelting are performed for the metal-plated graphene and the Sn-Ag brazing filler metal to obtain the high-thermal conductivity composite brazing filler metal. The prepared composite brazing filler metal is high in thermal conductivity, has a higher wettability compared with a traditional Sn-Ag brazing filler metal, and is a composite brazing filler metal accordant with the present development tendency of an electronic industry as a connecting material of traditional large-scale integrated circuits.

Description

technical field [0001] The invention relates to a method for preparing high thermal conductivity graphene-Sn-Ag composite solder. Background technique [0002] Traditional lead-containing solder has good process and mechanical properties, and at the same time, the use process is mature, and the supporting flux system is complete, and it is widely used in microelectronic packaging and other fields. But lead is one of the toxic elements that endanger human health and the environment. With the rise of the green movement, people pay more and more attention to the harm of lead to human beings and the environment. Many countries have introduced relevant laws to prohibit the use of lead in the electrical and electronic fields. Therefore, there is an urgent need to develop new lead-free solders to replace traditional leaded solders. The currently researched lead-free solder is mainly based on metal Sn, in which one or more metals such as Ag, Cu, Zn, Sb, Bi, In are added. So far,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/40
CPCB23K35/262
Inventor 修子扬武高辉黄亦龙陈国钦张强姜龙涛于海洋芶华松
Owner HARBIN INST OF TECH
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