High-strength, high-conductivity and high-extensibility rare earth copper alloy and preparation method thereof

A high-extensibility, high-conductivity technology, applied in high-conductivity, high-extensibility rare-earth copper alloys and their preparation, copper-based alloys and their preparation, and high-strength fields, can solve the problems of poor comprehensive performance of copper-based alloys and achieve improved comprehensive performance. properties, improving alloy properties, and improving production efficiency

Inactive Publication Date: 2013-11-13
HENAN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the technical problem of poor comprehensive performance of copper-based alloys in the prior art, the present

Method used

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  • High-strength, high-conductivity and high-extensibility rare earth copper alloy and preparation method thereof

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Experimental program
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preparation example Construction

[0026] (1) Preparation of master alloy: Put copper and rare earth elements into a vacuum non-consumable electrode arc melting furnace for melting, and vacuumize until the pressure in the furnace is 5×10 -2 Pa, then fill in nitrogen until the pressure in the furnace is 0.05MPa, control the smelting current to 400~500A, and the smelting voltage is 20~40V to obtain a Cu-rare earth master alloy for future use;

[0027] (2) Melting and mold casting: put copper, chromium, zirconium, nickel, titanium, manganese and the Cu-rare earth master alloy prepared in step (1) into a high-frequency vacuum melting furnace for melting, and vacuumize until the pressure in the furnace is 5×10 -2 Pa, then fill the furnace with nitrogen until the pressure in the furnace is 0.05MPa, control the melting temperature to 1200-1300°C, pour into the casting mold after melting, and form an ingot, and the pouring temperature is controlled at 1100-1200°C;

[0028] (3) Casting and forging: heating the ingot ob...

Embodiment 1

[0036] The specific preparation method is:

[0037] (1) Preparation of master alloy: Put copper and rare earth elements into a vacuum non-consumable electrode arc melting furnace for melting, and vacuumize until the pressure in the furnace is 5×10 -2 Pa, then charge into nitrogen until the pressure in the furnace is 0.05MPa, control the smelting current to 450A, and the smelting voltage is 30V, to obtain Cu-rare earth master alloy, for subsequent use;

[0038] (2) Melting and mold casting: put copper, chromium, zirconium, nickel, titanium, manganese and the Cu-rare earth master alloy prepared in step (1) into a high-frequency vacuum melting furnace for melting, and vacuumize until the pressure in the furnace is 5×10 -2 Pa, then fill the furnace with nitrogen until the pressure in the furnace is 0.05MPa, control the melting temperature to 1200°C, pour into the casting mold after melting, and form an ingot, and the pouring temperature is controlled at 1100°C;

[0039] (3) Cast...

Embodiment 2

[0046] The specific preparation method is:

[0047] (1) Preparation of master alloy: Put copper and rare earth elements into a vacuum non-consumable electrode arc melting furnace for melting, and vacuumize until the pressure in the furnace is 5×10 -2 Pa, then charge nitrogen into the furnace until the pressure is 0.05MPa, control the smelting current to 450A, and the smelting voltage is 35V, to obtain a Cu-rare earth master alloy for subsequent use;

[0048] (2) Melting and mold casting: put copper, chromium, zirconium, nickel, titanium, manganese and the Cu-rare earth master alloy prepared in step (1) into a high-frequency vacuum melting furnace for melting, and vacuumize until the pressure in the furnace is 5×10 -2 Pa, then fill the furnace with nitrogen until the pressure in the furnace is 0.05MPa, control the melting temperature to 1250°C, pour into the casting mold after melting, and form an ingot, and the pouring temperature is controlled at 1150°C;

[0049] (3) Castin...

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Abstract

A high-strength, high-conductivity and high-extensibility rare earth copper alloy and a preparation method thereof are disclosed. The alloy is composed of following components in percentage by weight: 0.5 to 1.5% of chromium, 0.3 to 0.5% of zirconium, 0.1 to 0.3% of nickel, 0.2 to 0.5% of titanium, 0.2 to 0.4% of manganese, 0.02 to 0.15% of rare earth elements and the balance of copper and inevitable impurity elements, wherein the rare earth elements are one or two elements of erbium and lanthanum. The preparation method comprises following steps: preparing intermediate alloy, smelting, moulding, casting, treating solid solution, drawing to deform, performing an aging treatment, and a cold rolling treatment. The components and the ratio of the components are limited to let each component have a combined action, thus the comprehensive properties of the alloy material are prominently improved: the extension strength is larger than 630 MPa, the hardness is larger than 190 HV, the ductility is larger than 10%, the conductivity is larger than 80%IACS, and the softening temperature is larger than 520 DEG C; and the rare earth copper alloy can satisfy the requirements of materials in the electronic industry such as lead frame on copper alloy performances.

Description

technical field [0001] The invention relates to a copper-based alloy and a preparation method thereof, in particular to a high-strength, high-conductivity, high-extensibility rare earth copper alloy and a preparation method thereof, belonging to the technical field of copper alloy materials. Background technique [0002] Cu-Cr-Zr alloys are a class of high-strength and high-conductivity alloys that are widely used. They are currently widely used in lead frames for large-scale integrated circuits, contact wires for trams and electric locomotives, and electrode alloys. The main feature of this type of alloy is its high electrical conductivity, but its strength is generally low. Lead frame is the main material of semiconductor components and integrated circuit packaging, which plays the role of supporting chips, transmitting information and dissipating heat. Therefore, lead frame occupies an extremely important position in integrated circuit devices and various assembly process...

Claims

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Application Information

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IPC IPC(8): C22C9/00C22C1/03C22F1/08
Inventor 张毅李瑞卿许倩倩柴哲田保红刘勇龙永强刘平
Owner HENAN UNIV OF SCI & TECH
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