Low-silver electro vacuum brazing filler metal used for sealing weld of electronic device

An electronic device, silver-electric technology, applied in the field of low-silver-electric vacuum solder, can solve the problems of melting point, atomic radius, solid solubility and crystal structure difference, increased brazing temperature, and high price

Inactive Publication Date: 2011-04-27
常熟市双华电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, for the Ag-Cu-Sn(In) ternary alloy, the projection of the eutectic line does not coincide with the contour line of Ag and Cu content in the composition triangle, but deviates greatly
Therefore, this design idea will inevitably lead to high content of tin and indium in the solder, and deterioration of the alloy's plastic workability
[0012] (3) Although the action mechanism of Sn and In elements on Ag-Cu alloy is basically the same, there are big differences between them in terms of melting point, atomic radius, solid solubility and crystal structure, etc., especially indium is a noble metal, and the price is as high as tin 20 times as much
If the temperature is low, the brazing temperature will increase, and if it is high, the solder will be difficult to form.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] The chemical composition is by mass percentage: 41% Ag, 52.85% Cu, 4% Sn, 2% In and 0.15% Ni.

[0026] The solidus temperature of the low-silver electric vacuum solder (foil) used for sealing and soldering of electronic devices obtained from the above-mentioned composition ratio is about 30 μm to 50 μm, the solidus temperature is 690 ° C, the liquidus line is 766 ° C, and the temperature interval is 32 ℃. The gas discharge secondary tube is sealed and welded by using the low-silver electric vacuum brazing filler metal foil. The welding method is: see figure 1 , the foil material 1 is clamped between the ceramic tube 2 to be welded and the Kovar sheet 3, assembled into a lap joint and then placed in a vacuum brazing machine with a vacuum port 6, an air inlet 7 and a vacuum gauge 8 On the stage 5 in the furnace 4, the furnace cover is closed again. like figure 1 shown, by vacuuming the vacuum port 6 to 10 -3 After Pa, reverse charge A through air inlet 7 r Gas to 5 ...

Embodiment 2

[0028] The chemical composition is by mass percentage: 41.5% of Ag, 52.4% of Cu, 4.5% of Sn, 1.5% of In and 0.10% of Ni.

[0029] The low-silver electric vacuum brazing material (foil material) used for sealing and soldering of electronic devices obtained from the above-mentioned composition ratio with a thickness of about 35 μm to 50 μm. The solidus temperature is 692°C, the liquidus is 765°C, and the temperature interval is 32°C. The low-silver electric vacuum alloy solder foil is used to seal and weld electric vacuum devices (gas discharge diodes). The welding method is: see figure 1 Firstly, the foil material 1 is sandwiched between the ceramic tube 2 to be welded and the Kovar sheet 3, assembled into a lap joint and then placed in a vacuum brazing machine with a vacuum port 6, an air inlet 7 and a vacuum gauge 8 On the stage 5 in the furnace 4, the furnace cover is closed again. like figure 1 shown, by vacuuming the vacuum port 6 to 10 -3 After Pa, reverse charge A thr...

Embodiment 3

[0031] The chemical composition is by mass percentage: 42% Ag, 51.8% Cu, 4% Sn, 2% In and 0.2% Ni.

[0032] The solidus temperature of the low-silver electric vacuum solder (foil) used for sealing and soldering of electronic devices obtained from the above-mentioned composition ratio is about 34 μm to 50 μm, the solidus temperature is 693°C, the liquidus line is 762°C, and the temperature interval is 90°C. ℃. The low-silver electric vacuum alloy solder foil is used to seal and weld electric vacuum devices (gas discharge diodes). please see figure 1 , the welding method is: first clamp the foil material 1 between the ceramic tube 2 to be welded and the Kovar alloy sheet 3, assemble it into a lap joint and place it with a vacuum port 6, an air inlet 7 and a vacuum gauge 8 On the stage 5 in the vacuum brazing furnace 4 of the vacuum brazing furnace 4, close the furnace cover again. like figure 1 As shown, vacuum the vacuum port 6 to 10 -3 After Pa, reverse charge A through a...

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Abstract

The invention relates to a low-silver electro vacuum brazing filler metal used for sealing weld of an electronic device, which belongs to the technical field of brazing materials. The low-silver electro vacuum brazing filler metal comprises the following chemical compositions in percentage by mass: 41 to 43 percent of silver (Ag), 51 to 53 percent of copper (Cu), 4 to 6 percent of stannum (Sn), less than or equal to 2 percent of indium (In) and less than or equal to 0.4 percent of nickel (Ni). The low-silver electro vacuum brazing filler metal has the advantages of: contributing to reducing the silver content so as to save resources and reduce cost, and contributing to guaranteeing a proper melting point, high plasticity and high machinability so as to replace Ag72Cu brazing filler metal.

Description

technical field [0001] The invention belongs to the technical field of brazing materials, and relates to a low-silver electric vacuum brazing material used for sealing and welding of electronic devices. Background technique [0002] Silver-based electric vacuum solder is one of the main structural materials for manufacturing vacuum electronic devices. It is widely used in the sealing and welding of metals and ceramics and metals and glass of electronic devices, vacuum switch tubes, gas discharge tubes and circuit breakers. The quality of the pros and cons depends largely on the performance of the solder. [0003] According to the use characteristics of vacuum electronic devices, the electric vacuum solder has the following strict requirements: (1) does not contain high vapor pressure elements such as Zn, Bi, Mg, Pb and / or Cd, etc., to prevent the device from being manufactured and Device leakage and sealing failure caused by element evaporation during use; (2) does not cont...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/30
Inventor 戴卫刚徐锦锋翟秋亚
Owner 常熟市双华电子有限公司
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