High-entropy alloy brazing filler metal and preparation method thereof
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- AVIC BEIJING INST OF AERONAUTICAL MATERIALS
- Publication Date
- 2021-01-15
Abstract
Description
technical field
[0001] The invention relates to a high-entropy alloy solder and a preparation method thereof, belonging to the technical field of welding. The high-entropy alloy solder is used for brazing connection of two extremely different materials, TiAl alloy and nickel-based superalloy. Background technique
[0002] TiAl alloy has low density, high specific strength, good high temperature oxidation resistance, and creep resistance. It is a very promising lightweight and high temperature resistant structural material. Substitute materials for titanium alloys and high-temperature alloys have good application prospects in aviation, aerospace, nuclear industry, weapons, automobiles and other fields.
[0003] For TiAl alloy, in order to expand its engineering application range, welding technology will be very important, especially the connection between TiAl alloy and other metals. For example, in the field of aviation, the metal thermal protection structure of hypersonic ...