High-entropy alloy brazing filler metal and preparation method thereof

A technology of high-entropy alloy and brazing material, which is applied in metal processing equipment, manufacturing tools, welding equipment, etc., can solve the problems of high melting point of brazing material, corrosion of base metal, high melting point, etc., achieve simple and easy control of the process, and reduce production Effect of improving cost and heat resistance

Active Publication Date: 2021-01-15
AVIC BEIJING INST OF AERONAUTICAL MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the main elements in the base metal, such as Cr, Ti, Ni, Co, and Fe, have high melting points, which may lead to a high melting point of the solder, which in turn inc

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] The steps of preparing the high-entropy alloy solder method for brazing TiAl and nickel-based superalloys according to the present invention are as follows:

[0024] Step 1, the atomic percentage of the high-entropy alloy solder is Al: 20%, Cu: 20%, Co: 15%, Fe: 10%, Ni: 10%, Cr: 10%, Si: 10%, B: 5 % is converted into mass percentage, and the elemental aluminum, copper, cobalt, iron, nickel, chromium, silicon and boron are weighed according to the mass percentage, and the raw materials after mixing are obtained

[0025] Step 2: Put the prepared raw materials above into the crucible, and use the vacuum arc melting method for melting, repeat the melting 4 times, and obtain the high-entropy alloy brazing filler metal ingot.

[0026] Step 3, using the vacuum quenching and rapid solidification technology, the above-mentioned brazing material ingot is prepared into a high-entropy alloy amorphous foil strip, and the TiAl alloy and the nickel-based superalloy are brazed under v...

Embodiment 2

[0028] The difference between this embodiment and the first embodiment is that in the first step, the atomic percentage of the high-entropy alloy solder is Al: 20%, Cu: 20%, Co: 12.5%, Fe: 12.5%, Ni: 12.5%, Cr : 12.5%, Si: 5%, B: 5%; in step 2, the smelting method used is arc smelting under argon protective atmosphere. Others are the same as in Embodiment 1.

Embodiment 3

[0030] The difference between this embodiment and Example 1 is that in step 1, elemental B is added in the form of Ni-17B (wt.%) master alloy, that is, the required Ni-17B (wt.%) is determined according to the amount of elemental B required. .%) of the master alloy, and calculate the quantity of elemental Ni that needs to be added in addition, then weigh and obtain the raw materials after proportioning respectively; in step 2, the melting method used is vacuum induction melting. Others are the same as in Embodiment 1.

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PUM

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Abstract

The invention discloses high-entropy alloy brazing filler metal and a preparation method thereof. The high-entropy alloy brazing filler metal comprises the following chemical components in atomic percent: 10-20% of Al, 10-20% of Cu, 10-20% of Co, 10-20% of Fe, 10-20% of Ni, 10-20% of Cr, 4-12% of Si and 4-12% of B. The preparation method comprises the following steps: weighing raw materials required for smelting according to the components of the brazing filler metal; smelting the raw materials to obtain a high-entropy alloy brazing filler metal ingot; and preparing a high-entropy alloy amorphous foil belt by utilizing a vacuum quenching rapid solidification technology, or preparing high-entropy alloy brazing filler metal powder by adopting a vacuum gas atomization technology. The high-entropy alloy brazing filler metal has very high mixed entropy, the structure of the high-entropy alloy brazing filler metal is mainly a solid solution structure, the high-entropy alloy brazing filler metal can be used for brazing connection between two extremely different materials, namely TiAl alloy and nickel-based high-temperature alloy, and can keep good compatibility with the two welded base materials simultaneously, and high connection strength is obtained.

Description

technical field [0001] The invention relates to a high-entropy alloy solder and a preparation method thereof, belonging to the technical field of welding. The high-entropy alloy solder is used for brazing connection of two extremely different materials, TiAl alloy and nickel-based superalloy. Background technique [0002] TiAl alloy has low density, high specific strength, good high temperature oxidation resistance, and creep resistance. It is a very promising lightweight and high temperature resistant structural material. Substitute materials for titanium alloys and high-temperature alloys have good application prospects in aviation, aerospace, nuclear industry, weapons, automobiles and other fields. [0003] For TiAl alloy, in order to expand its engineering application range, welding technology will be very important, especially the connection between TiAl alloy and other metals. For example, in the field of aviation, the metal thermal protection structure of hypersonic ...

Claims

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Application Information

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IPC IPC(8): B23K35/28B23K35/30B23K35/40
CPCB23K35/286B23K35/302B23K35/3046B23K35/3053B23K35/3033B23K35/40
Inventor 任海水尚泳来熊华平任新宇冯洪亮
Owner AVIC BEIJING INST OF AERONAUTICAL MATERIALS
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