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Tin zinc copper leadless solder alloy

A lead-free solder and alloy technology, applied in metal processing equipment, welding/cutting media/materials, welding media, etc., to achieve excellent structural stability, low price, and good mechanical properties

Inactive Publication Date: 2004-12-22
DALIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Its tensile strength is greater than 50Mpa, although the plasticity has decreased, it still has an elongation and a reduction of area of ​​more than 15%.

Method used

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  • Tin zinc copper leadless solder alloy

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Embodiment

[0023] The following chemical composition (%) is selected: (7-9) Zn; (0.05-0.15) RE; (0.5-2) Bi; (4-6) Cu, and the balance is Sn. The above-mentioned raw materials prepared according to the composition are put into an industrial vacuum induction furnace for smelting. Under normal pressure, the temperature is kept at 600°C for 4 to 6 hours, and then the solder alloy can be obtained by pouring. The brazing powder is prepared by spraying, and the brazing flux is added. , the solder paste is obtained. Can be used for reflow soldering.

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Abstract

A low-smelting-point lead-free alloy solder contains Zn, Cu, RE chosen from La, Ce, Pr and Nd, Bi and Sn. Its advantages are high wetting power and mechanical performance, no poison and pollution, and low cost.

Description

technical field [0001] The invention belongs to the technical field of metal materials, relates to electronic packaging brazing material technology, in particular to a lead-free solder alloy suitable for brazing electronic components without causing thermal damage. Background technique [0002] Since the traditional tin-lead solder contains lead element which is extremely harmful to the human body and the environment, the development of lead-free solder has become an urgent task for current materials scientists. The United States, Japan and other countries are actively enacting laws to prohibit the use of lead. According to the directive on the waste of electrical and electronic products and machinery, the European Union will completely prohibit the use of toxic and harmful elements such as lead and cadmium in the electronics industry from July 1, 2006. use in . Therefore, in order to eliminate lead pollution, there is an urgent need for lead-free solder to replace Sn-Pb so...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26C22C13/00
Inventor 赵杰于大全马海涛韩双起黄明亮王来
Owner DALIAN UNIV OF TECH
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