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High-entropy brazing filler metal for brazing non-oxide ceramics and non-oxide ceramic composite material and preparation method of brazing filler metal

A non-oxide and composite material technology, applied in the direction of welding/cutting media/materials, welding equipment, welding media, etc., can solve the problems of unreliable performance of high-temperature solder, and achieve improved compatibility, low cost, and suitable melting point Effect

Active Publication Date: 2012-09-26
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the present invention is to solve the problem of unreliable performance of brazing filler metals at high temperatures above 500°C for the existing welding of non-oxide ceramics and their composite materials, and to provide a high-entropy method for brazing non-oxide ceramics and their composite materials. Solder and its preparation method

Method used

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  • High-entropy brazing filler metal for brazing non-oxide ceramics and non-oxide ceramic composite material and preparation method of brazing filler metal
  • High-entropy brazing filler metal for brazing non-oxide ceramics and non-oxide ceramic composite material and preparation method of brazing filler metal

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specific Embodiment approach 1

[0015] Specific implementation mode one: a kind of high-entropy solder for brazing non-oxide ceramics and its composite materials in this embodiment is composed of 18-24 parts by weight of Ni, 14.3-19 parts of Cr, 16.8-22.5 parts Parts of Co, 15.9~21 parts of Fe, 10.1~13.5 parts of Cu and 0~24.9 parts of Ti or TiH 2 composition.

[0016] This embodiment realizes direct brazing of non-oxide ceramics and their composite materials themselves or with metals, without any modification treatment on the surface of ceramics or composite materials before welding. The high-entropy solder of this embodiment has a suitable melting point and good wettability for brazing non-oxide ceramics and their composite materials and various high-temperature alloys, and can meet the requirements for brazing joints at 800°C. Moreover, the brazing filler metal of this embodiment does not contain precious metals such as Ag and Pd, and the cost is low. When the high-entropy solder used in this embodiment...

specific Embodiment approach 2

[0017] Specific embodiment two: the difference between this embodiment and specific embodiment one is: the purity of Ni is 99.0%~99.9%, the purity of Cr is 99.0%~99.9%, the purity of Co is 99.0%~99.9%, and the purity of Fe is 99.0%~99.9%. 99.0%~99.9%, Cu purity 99.0%~99.9% and Ti purity 99.0%~99.9% or TiH 2 It is 99.0%~99.9%. Others are the same as in the first embodiment.

specific Embodiment approach 3

[0018] Embodiment 3: This embodiment is different from Embodiments 1 to 2 in that Ni, Cr, Co, Fe, Cu and Ti are metal powders or foils. Others are the same as the specific embodiment 1 to 2.

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Abstract

The invention relates to a high-entropy brazing filler metal and a preparation method thereof, and particularly relates to a high-entropy brazing filler metal for brazing non-oxide ceramics and the composite material of the non-oxide ceramics and the preparation method of the brazing filler metal, aiming to solve the problem that the brazing filler metal at the joint of the non-oxide ceramics and the ceramic composite material which are soldered together is unreliable in performance at a temperature higher than 500 DEG C in the prior art. The brazing filler metal comprises the following components in parts by weight: 18 to 24 parts of Ni, 14.3 to 19 parts of Cr, 16.8 to 22.5 parts of Co, 15.9 to 21 parts of Fe, 10.1 to 13.5 parts of Cu, and 0 to 24.9 parts of Ti or TiH2. The preparation method comprises the following steps of: carrying out vacuum melting on the weighed components at the temperature of 1200 to 1800 DEG C, performing linear cutting and carrying out foiling or composite tabletting on the components, so as to obtain the brazing filler metal; or the preparation method comprises the following steps of: carrying out ball-milling on the components in a ball material mass ratio of (12-16):1, and then tabletting and cleaning the components to obtain the brazing filler metal. The strength of the alloy joint obtained by using the method reaches 35 to 71 MPa, and the strength retention of the alloy joint at a high temperature of 800 DEG C exceeds 67%.

Description

technical field [0001] The invention relates to a high-entropy solder and a preparation method thereof. Background technique [0002] SiC, Si 3 N 4 , ZrB 2 Non-oxide ceramics are important ultra-high temperature structural materials in the aerospace field. C / SiC composite materials, ZSC composite materials, etc., further improve the mechanical properties and high temperature oxidation resistance of the materials by adding a certain volume fraction of C fibers or other ceramic particles (graphite) reinforcement phases to the single-phase ceramic matrix. Due to the limitations of the preparation and forming methods of these non-oxide ceramics and their composites, realizing their connection with themselves or with other materials is the key to ensure their wide application in the above fields. [0003] The currently reported connection methods for non-oxide ceramics and ceramic matrix composites include: mechanical connection, diffusion welding and brazing. However, there...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/30B23K35/40
Inventor 张丽霞李宏伟石俊秒田晓羽亓钧雷冯吉才
Owner HARBIN INST OF TECH
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