Alloy brazing filler metal of brazing-flux-free brazing foamed aluminum core veneer and preparation method thereof
A technology of alloy brazing filler metal and aluminum alloy material, which is applied in the field of alloy brazing filler metal for brazing foamed aluminum core board without flux and its preparation field, can solve the problems of foamed aluminum core board corrosion, poor welding performance, poor fusion, etc., and achieve high Strong welding, low melting point, good fluidity
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Embodiment 1
[0013] A multi-component aluminum alloy material, which is an Al-Si-Cu-Mg alloy, wherein the mass percentage of Si is 8%, the mass percentage of Cu is 10%, the mass percentage of Mg is 10%, Al The mass percentage content is 72%; the melting point temperature range is 450-600°C. Ingredients should use high-purity metals. (The purity of Al is not lower than 99.00%, crystalline silicon of 4mm is used for Si, the purity of Mg is not lower than 99.50%, and the purity of Cu is not lower than 99.70%). in the dependent claims
[0014] The preparation of above-mentioned Al-Si-Cu-Mg alloy solder:
[0015] 1). The solder is weighed using a photosensitive analytical balance with an accuracy of not less than 0.001 grams. In order to ensure the accuracy of the solder composition, the batching error is controlled below 0.005 grams during use, and the total weight of the solder prepared in each furnace is 500 grams. The mass percentage of Si is 40 grams, the mass percentage of Cu is 50 g...
Embodiment 2
[0021] A multi-element aluminum alloy material, it is Al-Si-Cu-Mg alloy, Al-Si-Cu-Mg alloy, wherein the mass percentage content of Si is 8%, the mass percentage content of Cu is 15%, the mass percentage content of Mg The mass percentage is 10%, and the mass percentage of Al is 62%; the melting point temperature range is 450-600°C. Ingredients should use high-purity metals. (The purity of Al is not lower than 99.00%, crystalline silicon of 4mm is used for Si, the purity of Mg is not lower than 99.50%, and the purity of Cu is not lower than 99.70%).
[0022] The preparation of above-mentioned Al-Si-Cu-Mg alloy solder:
[0023] 1). The solder is weighed using a photosensitive analytical balance with an accuracy of not less than 0.001 grams. In order to ensure the accuracy of the solder composition, the batching error is controlled below 0.005 grams during use, and the total weight of the solder prepared in each furnace is 500 grams. The mass percentage of Si is 40 grams, the ...
Embodiment 3
[0029] A multi-component aluminum alloy material, which is Al-Si-Cu-Mg alloy, Al-Si-Cu-Mg alloy, Al-Si-Cu-Mg alloy, wherein the mass percentage of Si is 10%, and the mass percentage of Cu The percentage content is 10%, the mass percentage content of Mg is 10%, and the mass percentage content of Al is 70%; the melting point temperature range is 450-600°C. Ingredients should use high-purity metals. (The purity of Al is not lower than 99.00%, crystalline silicon of 4mm is used for Si, the purity of Mg is not lower than 99.50%, and the purity of Cu is not lower than 99.70%).
[0030] The preparation of above-mentioned Al-Si-Cu-Mg alloy solder:
[0031] 1). The solder is weighed using a photosensitive analytical balance with an accuracy of not less than 0.001 grams. In order to ensure the accuracy of the solder composition, the batching error is controlled below 0.005 grams during use, and the total weight of the solder prepared in each furnace is 500 grams. The mass percentage...
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