The invention provides a SIP (
System In
Package) module partition
electromagnetic shielding package method. The method comprises the steps of: providing a substrate, mounting a
flip chip and a passiveelement at the first working surface of the substrate, wherein manufactured grounding bonding pads are arranged at the periphery of the
chip mounting position of the first working surface of the substrate; performing
plasma surface cleaning for the substrate, performing thin film plastic
package for the first working surface of the substrate to form a plastic
package film covering the first working surface of the substrate; employing a
laser to perform slotting around the
chip requiring partition shielding to
expose the corresponding grounding bonding pads; performing
sputtering for the firstworking surface of the whole substrate to form an inner
metal shielding layer and achieve
chip partition shielding; performing
plasma cleaning for the substrate after
sputtering, and performing plastic package for the first surface of the substrate to form an outer package body; and
cutting the whole substrate to form each single SIP module. The SIP module partition
electromagnetic shielding package method facilitates reduction of the module size, improves the reliability and improves the production efficiency.