Scaling powder for nickel-plating alloy soft soldering tin wire core and preparation method of scaling powder

Abstract

The invention discloses a scaling powder for a nickel-plating alloy soft soldering tin wire core and the preparation method of the scaling powder. The weight formula of the scaling powder comprises the following components by weight percent: 60-90% of resin, 0.1-20% of organic acid, 0.1-10% of organic amine, 0.1-20% of metal salt, 0.1-2.0% of active strengthening agent, 0.1-2.0% of surfactant, 0.1-1.0% of corrosion inhibitor and 0.1-1.0% of antioxidant. The scaling powder disclosed by the invention is suitable for producing lead-containing or non-lead solder tin wire containing scaling powder and can be used for automatically welding or manually welding nickel-plate alloy; and when in use, the welding time of the tin wire is short, the wettability is good and the welding residues are few, so that the scaling powder belongs to environment-friendly scaling powder, and the tensile strength of the welding point joint is high and the insulating resistance is large. The tin wire prepared by the invention is very suitable for soft soldering of nickel-plate alloy and is suitable for soft soldering of chromium plating, gold plating, copper and copper alloy.

Description

technical field

[0001] The invention relates to a nickel-plated layer soldering flux, in particular to a nickel-plated layer alloy soldering flux core and a preparation method thereof. Background technique

[0002] Due to the high hardness, good wear resistance and good anti-electromagnetic interference performance of the electroless nickel alloy layer and the electroplated nickel-phosphorus alloy layer, the demand for the nickel-plated alloy layer has increased sharply in recent years, and has been widely used. In the automotive industry, aerospace and electronic instrument industry and other fields. The invention is based on the nickel plated alloy plate. The coating structure is amorphous, so it is non-magnetic, so it is widely used in the electrical and electronic industry due to its advantages. In the electroless nickel plating industry, sodium hypophosphite is widely used in nickel plating formulations, so the phosphorus content in the plating is also high. Studies ...

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