Scaling powder for nickel-plating alloy soft soldering tin wire core and preparation method of scaling powder

A nickel-plated layer and flux technology, which is applied in the field of flux and its preparation for nickel-plated alloy solder wire cores, can solve problems such as low insulation resistance, low welding strength, and solder joint corrosion, and achieve surface insulation High resistance value, high tensile strength value, weak corrosion effect

Inactive Publication Date: 2012-10-17
SOUTH CHINA UNIV OF TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although this type of flux has strong activity and is more suitable for stainless steel, it pollutes the solder joints near the nickel plating layer after brazing (more residues), and is not easy to clean. At the same time, the residue of flux will corrode the solder joints very seriously.
The Chinese invention patent with the notification number CN101204762 discloses a soldering flux for aluminum, claiming that it is also applicable to nickel alloys and copper and copper alloys, and it consists of the following percentages: metal salts that can be reduced

Method used

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  • Scaling powder for nickel-plating alloy soft soldering tin wire core and preparation method of scaling powder

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Composition of the present invention and component weight percentage content thereof are as follows:

[0033] (1) Hydrogenated rosin 74.0%

[0034] (2) Water-white rosin 7.0%

[0035] (3) Glutaric acid 2.0%

[0036] (4) Palmitic acid 4.0%

[0037] (5) Triethylenetetramine 3.0%

[0038](6) Zinc chloride 1.2%

[0039] (7) Zinc stearate 4.8%

[0040] (8) Cyclohexylamine hydrobromide hydrochloride 1.5%

[0041] (9) Octylphenol polyoxyethylene ether 0.5%

[0042] (10) Benzotriazole 1.0%

[0043] (11) 2,6-di-tert-butyl-4-methylphenol (BHT) 1.0%

[0044] Preparation method: Add powdered zinc stearate, zinc chloride, glutaric acid, palmitic acid, cyclohexylamine hydrobromide hydrochloride, benzotriazole, BHT in the reactor according to the above weight ratio, and continuously stir 15 minutes; then slowly add the above mixed powder into the molten rosin, fully and continuously stir at 140±5°C for 20 minutes to obtain a light yellow liquid; when the temperature drops to ...

Embodiment 2

[0046] Composition of the present invention and component weight percentage content thereof are as follows:

[0047] (1) Water white rosin 73.0%

[0048] (2) Hydrogenated rosin 6.0%

[0049] (3) Adipic acid 3.0%

[0050] (4) Stearic acid 5.0%

[0051] (5) Diethylenetriamine 3.0%

[0052] (6) Bismuth chloride 1.0%

[0053] (7) Copper naphthenate 5.0%

[0054] (8) Dibromobutene ethanol 1.2%

[0055] (9) Alkylphenol polyoxyethylene ether 0.8%

[0056] (10) Imidazole 1.0%

[0057] (11) 2,6-di-tert-butyl-4-methylphenol (BHT) 1.0%

[0058] Preparation method: add copper naphthenate, bismuth chloride, adipic acid, stearic acid, bismuth chloride, dibromobutene alcohol, imidazole, BHT into the reactor according to the above weight ratio, and continuously stir for 20 minutes, then Slowly add the above mixed powder into the molten rosin, and stir continuously at 140±5°C for 20 minutes to obtain a light yellow liquid; when the temperature drops to 110°C, add diethylenetriamine an...

Embodiment 3

[0060] Composition of the present invention and component weight percentage content thereof are as follows:

[0061] (1) Water white rosin 66.0%

[0062] (2) Disproportionated rosin 9.8%

[0063] (3) Succinic acid 3.0%

[0064] (4) Lauric acid 7.0%

[0065] (5) Triethanolamine 3.5%

[0066] (6) Nickel chloride 0.8%

[0067] (7) Copper stearate 5.5%

[0068] (8) Hexadecyltrimethylammonium bromide 0.9%

[0069] (9) FC-4430 0.5%

[0070] (10) Piperazine 1.0%

[0071] (11) 2,6-di-tert-butyl-4-methylphenol (BHT) 1.0%

[0072] Preparation method: Add copper stearate, nickel chloride, succinic acid, lauric acid, piperazine, cetyltrimethylammonium bromide, and BHT into the reactor according to the above weight ratio, and continuously stir for 15 minutes; Then slowly add the above mixed powder into the molten rosin, fully and continuously stir at 140±5°C for 15 minutes to obtain a light green liquid; when the temperature drops to 110°C, then add triethanolamine and FC-4430 and...

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Abstract

The invention discloses a scaling powder for a nickel-plating alloy soft soldering tin wire core and the preparation method of the scaling powder. The weight formula of the scaling powder comprises the following components by weight percent: 60-90% of resin, 0.1-20% of organic acid, 0.1-10% of organic amine, 0.1-20% of metal salt, 0.1-2.0% of active strengthening agent, 0.1-2.0% of surfactant, 0.1-1.0% of corrosion inhibitor and 0.1-1.0% of antioxidant. The scaling powder disclosed by the invention is suitable for producing lead-containing or non-lead solder tin wire containing scaling powder and can be used for automatically welding or manually welding nickel-plate alloy; and when in use, the welding time of the tin wire is short, the wettability is good and the welding residues are few, so that the scaling powder belongs to environment-friendly scaling powder, and the tensile strength of the welding point joint is high and the insulating resistance is large. The tin wire prepared by the invention is very suitable for soft soldering of nickel-plate alloy and is suitable for soft soldering of chromium plating, gold plating, copper and copper alloy.

Description

technical field [0001] The invention relates to a nickel-plated layer soldering flux, in particular to a nickel-plated layer alloy soldering flux core and a preparation method thereof. Background technique [0002] Due to the high hardness, good wear resistance and good anti-electromagnetic interference performance of the electroless nickel alloy layer and the electroplated nickel-phosphorus alloy layer, the demand for the nickel-plated alloy layer has increased sharply in recent years, and has been widely used. In the automotive industry, aerospace and electronic instrument industry and other fields. The invention is based on the nickel plated alloy plate. The coating structure is amorphous, so it is non-magnetic, so it is widely used in the electrical and electronic industry due to its advantages. In the electroless nickel plating industry, sodium hypophosphite is widely used in nickel plating formulations, so the phosphorus content in the plating is also high. Studies ...

Claims

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Application Information

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IPC IPC(8): B23K35/36
Inventor 张新平王超叶桥生张辉黄守友
Owner SOUTH CHINA UNIV OF TECH
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