67results about How to "Strong process compatibility" patented technology

The invention relates to an array type multi-parameter wind sensor chip substrate, which relates to the field of wind sensors. The invention solves the problems of single measurement function, large thermal field influence, instability and long thermal equilibrium time in the prior art. The array multi-parameter wind sensor chip substrate is composed of a substrate, n heating elements, m thermal elements and several heat insulation grooves, where n is a natural number greater than or equal to 2, m=n+1, and the substrate is circular Or a regular polygonal non-conductive flat plate, on the back of the substrate, fix n heating elements symmetrical to the center point, between each two adjacent heating elements, engraved with a thermal insulation groove, on the front of the substrate, and n heating elements The position of the element corresponds to fixing n heat-sensitive elements, one heat-sensitive element is fixed in the center of the front of the substrate, and a heat-insulation groove is engraved between every two adjacent heat-sensitive elements. The array type multi-parameter wind sensor chip substrate of the present invention can be applied to wind sensors and wind parameter measurement systems.

The invention relates to a high-performance tin wire soldering flux for automatic tin soldering and a preparation method of the high-performance tin wire soldering flux. The high-performance tin wire soldering flux is prepared from the following components in percentage by weight: 2.0-7.0% of an organic acid active agent, 1.0-5.5% of an activity enhancer, 7.0-15.0% of a solubilizer, 0.1-1.5% of a surfactant, 0.1-1.5% of an inhibitor, 0.5-1.5% of an antioxidant, and the balance being modified rosin. A tin wire made by adopting the soldering flux disclosed by the invention has the characteristics of high tin plating speed, good spreadability, low empty soldering and false soldering rate, high insulation resistance after soldering, and the like; the soldering flux is particularly suitable for automation tin soldering for assembling of electronic parts and components in specific structures, printed circuit boards in specific structures and the like, and can be widely applied for the automatic tin soldering of batteries, instruments, meters and various in-home electric appliances in the electronic / electrical industry; the production efficiency is easy to improve, and the production cost is reduced.

The invention discloses a two-dimensional material detector based on asymmetric integration of an optical microstrip antenna. The two-dimensional material detector structurally comprises a metal reflecting surface, a dielectric spacer layer, a two-dimensional active material layer and a drain electrode integrated by a top layer source electrode and a metal grid bar. The self-driven response of themetal optical detection structure of the metal two-dimensional active photosensitive material comes from a Schottky junction between the two-dimensional material and metal contact, the asymmetry integration of the optical microstrip antenna breaks the symmetry, the light absorption of the contact junction region of the two-dimensional material is greatly enhanced through the efficient coupling ofthe optical microstrip antenna and the light field local area. the boundary of the contact junction is prolonged, the light absorption of the two-dimensional material at the other electrode is inhibited by the metal bottom surface which is very close to the two electrodes, and the light response contrast ratio near the two electrodes is as high as more than one hundred times. Under floodlight irradiation, the responsivity of the optical microstrip antenna integrated two-dimensional material is higher than that of a traditional metal grating integrated two-dimensional material by more than oneorder of magnitude.

The invention discloses a method for restraining tin whisker growing based on a micro-nano cone structure. The method comprises the following steps that a conductive matrix is selected and cleaned; after the matrix is cleaned, a micro-nano cone structure layer grows on the conductive matrix; then the micro-nano cone structure layer is cleaned, and a surface oxide layer is removed; and finally, tin-based welding flux grows on the micro-nano cone structure layer. According to the method, the pressure stress in a tin cladding layer is released by utilizing the fact that the micro-nano cone structure layer has a large specific surface area and a unique geometrical shape, driving force for tin cladding layer tin cladding layer is reduced, and formation of tin whisker is restrained; the method is suitable for growing of various types of tin layer thin films and has the advantages that the preparation method is simple, the temperature is low, compatibility of the technique is high, stability is high, and growing of tin whiskers can be effectively restrained.

The invention discloses a high-efficiency and energy-saving resistance heating coupled electric transport oxidant delivery device and method for repairing organic polluted soil, comprising a heating unit, an extraction unit, a monitoring unit and a ground treatment unit. Simply using resistance heating requires a long heating time, and simply using chemical oxidation cannot effectively transport the oxidant to the polluted area. Resistance heating can activate oxidants, increase the vapor pressure and solubility of pollutants, and promote their volatilization and dissolution, thereby improving oxidation efficiency and enhancing the contact ability with pollutants, shortening the repair period and reducing repair costs. At the same time, the oxidant can improve the efficiency of resistance heating repair, and the electric transport of oxidant can transport the oxidant to the target contaminated area to enhance precise repair, reduce the energy consumption required for resistance heating, and have strong process compatibility with resistance heating equipment. The invention can be installed according to the specific conditions of local polluted areas, has low investment cost, is suitable for repairing soil polluted by organic non-heavy metals, and has great popularization value.

The present invention discloses an ion implantation method capable of preventing a silicon edge on the boundary of an ion implantation region from peeling off. The method comprises the following steps of: firstly, performing processing on the surface of a silicon chip, so that an oxide layer is generated on the surface of the silicon chip; then coating the silicon chip with a photoresist; then performing ion implantation on the silicon chip; and finally removing the photoresist on the surface of the silicon chip. According to the present invention, by performing processing on the surface of the silicon chip, an ultrathin oxide layer is generated on the surface of the silicon chip to prevent the silicon chip from generating the silicon edge in the photoresist-removing process, thereby avoiding the silicon peeling problem, reducing surface defects and improving the rate of finished products.