The invention discloses a bump measurement method and device,
electronic equipment, a computer readable storage medium and a program product, and the measurement method comprises the steps: obtaining the initial three-dimensional
point cloud data of a
wafer bump through a three-dimensional measurement module, and dynamically evaluating the confidence of the initial three-dimensional
point cloud data; when the confidence coefficient comparison result meets a triggering condition, triggering a re-collection strategy, adjusting the relative
pose of the measurement module and the
wafer to carry out supplementary collection, and screening high-confidence-coefficient data from the measurement module and the
wafer; and performing
pose compensation on the screened high-confidence data, and performing
data integration on the initial three-dimensional
point cloud data to generate a complete three-dimensional shape. According to the scheme, structural shielding and optical interference are avoided through multi-
pose acquisition, high-confidence data are screened to integrate
original data, data missing and precision limitation of traditional
single measurement can be overcome without greatly increasing hardware investment, high-precision and high-efficiency measurement support is provided for high-density bumps, and the measurement efficiency is improved. And the method has significant economic value for
quality monitoring and yield improvement of the advanced
semiconductor packaging process.