Array type multi-parameter wind sensor chip substrate
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A wind sensor and multi-parameter technology, applied in the field of sensors, can solve problems such as single measurement function, long thermal equilibrium time, and large thermal field influence, and achieve high measurement accuracy, fast response speed, and small size.
Inactive Publication Date: 2009-12-09
HARBIN UNIV OF SCI & TECH
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[0008] The purpose of the present invention is to solve the problems existing in the prior art such as single measurement function, large thermal field influence, instability, and long thermal equilibrium time.
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[0026] The array type multi-parameter wind sensor chip substrate of this embodiment is composed of a substrate 1, n heating elements 2, m heat sensitive elements 4, and a plurality of thermal insulation grooves 3, wherein n is a natural number greater than or equal to 2, m=n+1, the substrate 1 is a circular or regular polygonal non-conducting flat plate, and n heating elements 2 symmetrical about the center are fixed on the back of the substrate 1, in the middle of every two adjacent heating elements 2, Engraved with a thermal insulation groove 3, on the front of the substrate 1, n heat sensitive elements 4 are fixed corresponding to the positions of the n heating elements 2, and a heat sensitive element 4 is fixed at the center of the front surface of the substrate 1. Between the two heat-sensitive elements 4, a heat-insulating groove 3 is engraved.
[0027] When in use, the n heating elements 2 on the sensor chip are connected in parallel, and then connected to the heating circu...
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Abstract
The invention relates to an array type multi-parameter wind sensor chip substrate, which relates to the field of wind sensors. The invention solves the problems of single measurement function, large thermal field influence, instability and long thermal equilibrium time in the prior art. The array multi-parameter wind sensor chip substrate is composed of a substrate, n heating elements, m thermal elements and several heat insulation grooves, where n is a natural number greater than or equal to 2, m=n+1, and the substrate is circular Or a regular polygonal non-conductive flat plate, on the back of the substrate, fix n heating elements symmetrical to the center point, between each two adjacent heating elements, engraved with a thermal insulation groove, on the front of the substrate, and n heating elements The position of the element corresponds to fixing n heat-sensitive elements, one heat-sensitive element is fixed in the center of the front of the substrate, and a heat-insulation groove is engraved between every two adjacent heat-sensitive elements. The array type multi-parameter wind sensor chip substrate of the present invention can be applied to wind sensors and wind parameter measurement systems.
Description
Technical field [0001] The invention relates to the field of sensors, in particular to sensors for measuring wind parameters. Background technique [0002] The measurement of wind parameters is a measurement of important parameters, including wind temperature, air volume, wind speed, wind direction and other parameters. In terms of environmental purification, industrial hygiene, indoor cleaning systems, meteorology, biomedicine, navigation, aviation, fisheries and agriculture, wind power stations and sports venues, as well as automobiles, exhaust fans, blowers, air-conditioning equipment, etc., multiple points are required. Measurement of air flow. For some fields, only one or a few parameters are needed. In most cases, the measurement of multiple wind parameters is needed, including wind temperature, air volume, wind speed, wind direction and other parameters, but the existing wind parameter sensors do not yet Sensors that can measure these kinds of parameters at the same time, ...
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