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Array type multi-parameter wind sensor chip substrate and producing method thereof

A technology of a wind sensor and a manufacturing method, applied in the field of sensors, can solve the problems of single measurement function, long thermal balance time, and large thermal field influence, and achieve the effects of high measurement accuracy, fast response speed, and small size

Inactive Publication Date: 2007-08-22
HARBIN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] The purpose of the present invention is to solve the problems existing in the prior art such as single measurement function, large thermal field influence, instability, and long thermal equilibrium time.

Method used

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  • Array type multi-parameter wind sensor chip substrate and producing method thereof
  • Array type multi-parameter wind sensor chip substrate and producing method thereof
  • Array type multi-parameter wind sensor chip substrate and producing method thereof

Examples

Experimental program
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Embodiment Construction

[0026] The array type multi-parameter wind sensor chip substrate of this embodiment is composed of a substrate 1, n heating elements 2, m thermal sensitive elements 4 and several heat insulation grooves 3, wherein n is a natural number greater than or equal to 2, m=n+1, the substrate 1 is a circular or regular polygonal non-conductive flat plate, and n heating elements 2 symmetrical to the center point are fixed on the back of the substrate 1, and in the middle of every two adjacent heating elements 2, Engraved with a thermal insulation groove 3, on the front of the substrate 1, n thermosensitive elements 4 are fixed corresponding to the positions of n heating elements 2, and a thermosensitive element 4 is fixed on the center of the front of the substrate 1, and each adjacent Between the two thermosensitive elements 4, a thermal insulation groove 3 is engraved.

[0027] When in use, the n heating elements 2 on the sensor chip are connected in parallel, and then connected to th...

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PUM

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Abstract

The invention relates to an array multiparameter wind sensor chip substrate and the making method thereof, relating to the wind sensor field. And it comprises a substrate, n heating components, m thermosensitive components and several heat insulation grooves, where n is natural number not less than 2, m=n+1, the substrate is a circular or regular polygonal nonconductive plate, n centrosymmetric heating components are fixed on the back of the substrate, a heat insulation groove is made between every two adjacent heating components, n thermosensitive components corresponding to the n heating components are fixed on the obverse side of the substrate, a thermosenstive component is fixed in the center of the obverse side of the substrate, and a heat insulation groove is made between every two adjacent thermosensitive components. And it can apply to wind sensors and wind parameter measuring systems.

Description

technical field [0001] The invention relates to the field of sensors, in particular to a wind parameter measurement sensor and a manufacturing method thereof. Background technique [0002] The measurement of wind parameters is a measurement of important parameters, including wind temperature, wind volume, wind speed, wind direction and other parameters. In the purification of the environment, industrial hygiene, indoor cleaning systems, meteorology, biomedicine, navigation, aviation, fishery and agriculture, as well as wind power stations and sports venues, as well as automobiles, exhaust fans, blowers, air-conditioning equipment, etc. Measurement of air flow. For some fields, only the measurement of one or several parameters is required, and in most cases, the measurement of multiple wind parameters is still required, including wind temperature, wind volume, wind speed, wind direction and other parameters, but the existing wind parameter sensors have not yet Sensors that ...

Claims

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Application Information

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IPC IPC(8): G01W1/02G01F1/56G01K7/16G01P5/08G01P13/02
Inventor 施云波郭建英张洪泉丁喜波冯侨华时强
Owner HARBIN UNIV OF SCI & TECH
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