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A kind of high-performance solder wire flux for automatic soldering and preparation method thereof

A technology of flux and solder wire, applied in welding equipment, welding medium, manufacturing tools, etc., can solve problems such as difficult to ensure smooth welding, difficult to achieve rapid wetting, intermittent flux distribution, etc., to achieve no solder joint residues White, stable solder joint residue, empty soldering and low soldering rate

Active Publication Date: 2018-07-17
SHENZHEN XINGHONGTAI TIN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Adding a linear polymer to the flux effectively solves the problem of discontinuous and uneven flux distribution in the solder wire. Although a halogenated activator is used, the selected active material has low activity and is not easy to be used in the automatic soldering process. Achieve rapid wetting, difficult to ensure smooth welding

Method used

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  • A kind of high-performance solder wire flux for automatic soldering and preparation method thereof
  • A kind of high-performance solder wire flux for automatic soldering and preparation method thereof
  • A kind of high-performance solder wire flux for automatic soldering and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] A high-performance solder wire flux for automatic soldering, the components of the flux raw materials are as follows by weight percentage:

[0028]

[0029] Preparation method: put 80.0 grams of tetrahydrofurfuryl alcohol, 50.0 grams of polyethylene glycol 2000 and 757.0 grams of hydrogenated rosin into a reaction kettle and mix them, heat to 130°C, stir for 30 minutes to fully dissolve; then add 13.0 grams of oxalic acid, 25.0 grams of hydroxysuccinic acid, 20.0 grams of cyclohexylamine hydrobromide, 25.0 grams of hydrazine hydrochloride, 12.0 grams of FC-4330, 8.0 grams of methyl benzotriazole, 10.0 grams of quinone. The heating temperature was maintained at 135°C, and stirred for 35 minutes to make it all melt into the rosin. Pour the obtained flux into the rosin barrel of the extruder (the temperature is stable at 133°C), and use the Sn0.3Ag0.7Cu solder alloy barrel for drawing. After rolling, medium and small drawing, the wire diameter is 0.8mm. Automatic tin s...

Embodiment 2

[0031] A high-performance solder wire flux for automatic soldering, each component in the flux is as follows by weight percentage:

[0032]

[0033]Preparation method: Put 95.0 grams of tetrahydrofurfuryl alcohol, 50.0 grams of polyethylene glycol 2000 and 772.0 grams of hydrogenated rosin into the reaction kettle and mix them, heat to 135°C, stir for 30 minutes to fully dissolve; add 10.0 grams of malonic acid, 5.0 grams of hexane Diacid, 5.0 g glutaric acid, 5.0 g 5-chlorosalicylic acid, 20.0 g diethylamine hydrobromide, 10.0 g diphenylguanidine hydrobromide, 4.0 g cetyltrimethylammonium bromide , 6.0 grams of 2-octylphenol polyoxyethylene ether TX-10, 8.0 grams of methyl benzotriazole, 10.0 grams of catechol. The heating temperature is maintained at 138°C, and stirred for 30 minutes to make it all melt into the rosin. Pour the obtained flux into the rosin barrel of the extruder (the temperature is stabilized at 133°C), use the Sn0.3Ag0.7Cu solder alloy barrel for drawin...

Embodiment 3

[0035] A high-performance solder wire flux for automatic soldering, each component in the flux is as follows by weight percentage:

[0036]

[0037]

[0038] Preparation method: Put 50.0 grams of glycerol, 20.0 grams of polyethylene glycol 4000 and 825.0 grams of water-white hydrogenated rosin into the reaction kettle and mix, heat to 140°C, stir for 20 minutes to fully dissolve; then add 20.0 grams of 2, 3-Dihydroxysuccinic acid, 25.0 grams of 2,3-dibromosuccinic acid, 30.0 grams of diethylamine hydrobromide, 15.0 grams of hydrazine bromide, 5.0 grams of cetylpyridinium bromide, 5.0 grams of 2,3 -Dibromo-1,4-butenediol, 10.0 grams of benzotriazole, 5.0 grams of 2,6-di-tert-butyl-p-cresol. The heating temperature is maintained at 130°C, and stirred for 40 minutes to make it all melt into the rosin. Pour the obtained flux into the rosin barrel of the extruder (the temperature is stabilized at 133°C), use the Sn0.3Ag0.7Cu solder alloy barrel for drawing, and finally obtai...

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Abstract

The invention relates to a high-performance tin wire soldering flux for automatic tin soldering and a preparation method of the high-performance tin wire soldering flux. The high-performance tin wire soldering flux is prepared from the following components in percentage by weight: 2.0-7.0% of an organic acid active agent, 1.0-5.5% of an activity enhancer, 7.0-15.0% of a solubilizer, 0.1-1.5% of a surfactant, 0.1-1.5% of an inhibitor, 0.5-1.5% of an antioxidant, and the balance being modified rosin. A tin wire made by adopting the soldering flux disclosed by the invention has the characteristics of high tin plating speed, good spreadability, low empty soldering and false soldering rate, high insulation resistance after soldering, and the like; the soldering flux is particularly suitable for automation tin soldering for assembling of electronic parts and components in specific structures, printed circuit boards in specific structures and the like, and can be widely applied for the automatic tin soldering of batteries, instruments, meters and various in-home electric appliances in the electronic / electrical industry; the production efficiency is easy to improve, and the production cost is reduced.

Description

technical field [0001] The invention relates to a flux for solder wire, in particular to a flux for automatic soldering solder wire core and a preparation method thereof. The solder wire is not only suitable for manual soldering iron welding, but also can be used for automatic soldering. It can be widely used in the automatic soldering of batteries, instruments and meters, and various household appliances in the electrical and electronic industry. It is easy to improve production efficiency and reduce production costs. , and improve the quality of products manufactured by soldering. technical background: [0002] With the rapid development of electronic manufacturing and packaging technology, traditional manual soldering iron soldering can no longer meet the increasing product manufacturing efficiency and low cost requirements, and there is an urgent need to replace traditional manual soldering iron soldering with automated soldering. Automated soldering can not only improv...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/363B23K35/40
CPCB23K35/3612B23K35/362B23K35/40
Inventor 邢璧元张新平周敏波王寿银丘富顺马骁
Owner SHENZHEN XINGHONGTAI TIN
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