Scaling powder for nickel-plating alloy soft soldering tin wire core and preparation method of scaling powder

Abstract

The invention discloses a scaling powder for a nickel-plating alloy soft soldering tin wire core and the preparation method of the scaling powder. The weight formula of the scaling powder comprises the following components by weight percent: 60-90% of resin, 0.1-20% of organic acid, 0.1-10% of organic amine, 0.1-20% of metal salt, 0.1-2.0% of active strengthening agent, 0.1-2.0% of surfactant, 0.1-1.0% of corrosion inhibitor and 0.1-1.0% of antioxidant. The scaling powder disclosed by the invention is suitable for producing lead-containing or non-lead solder tin wire containing scaling powder and can be used for automatically welding or manually welding nickel-plate alloy; and when in use, the welding time of the tin wire is short, the wettability is good and the welding residues are few, so that the scaling powder belongs to environment-friendly scaling powder, and the tensile strength of the welding point joint is high and the insulating resistance is large. The tin wire prepared by the invention is very suitable for soft soldering of nickel-plate alloy and is suitable for soft soldering of chromium plating, gold plating, copper and copper alloy.

Description

technical field [0001] The invention relates to a nickel-plated layer soldering flux, in particular to a nickel-plated layer alloy soldering flux core and a preparation method thereof. Background technique [0002] Due to the high hardness, good wear resistance and good anti-electromagnetic interference performance of the electroless nickel alloy layer and the electroplated nickel-phosphorus alloy layer, the demand for the nickel-plated alloy layer has increased sharply in recent years, and has been widely used. In the automotive industry, aerospace and electronic instrument industry and other fields. The invention is based on the nickel plated alloy plate. The coating structure is amorphous, so it is non-magnetic, so it is widely used in the electrical and electronic industry due to its advantages. In the electroless nickel plating industry, sodium hypophosphite is widely used in nickel plating formulations, so the phosphorus content in the plating is also high. Studies ...

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Problems solved by technology

Although this type of flux has strong activity and is more suitable for stainless steel, it pollutes the solder joints near the nickel plating layer after brazing (more residues), and is not easy to clean. At the same time, the residue of flux will corrode the solder joints very seriously.

The Chinese invention patent with the notification number CN101204762 discloses a soldering flux for aluminum, claiming that it is also applicable to nickel alloys and copper and copper alloys, and it consists of the following percentages: metal salts that can be reduced by aluminum 12- 13%, film remover 28-30%, wetting agent 15%, halide salt activator 5%, surfactant 2-5%, corrosion inhibitor 4-5%, carrier balance; this flux is suitable for nickel plating The expansion rate of the layer alloy is good, and the flux is paste at room temperature rather than solid, which is suitable for the inner core of solder wire, but this flux is not suitable for nickel-plated layer alloys, because there are too many residues, the welding strength is very low, and the corrosion is too strong , and the insulation resistance is very low

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