A halogen-free high-activity low-spatter solder wire flux and preparation method thereof

Abstract

The invention discloses halogen-free high-activity low-splatter solder wire soldering flux and a preparing method thereof. The halogen-free high-activity low-splatter solder wire soldering flux comprises, by mass, 2-10 percent of alcohol or alcohol ether high-boiling-point solvent, 0.08-1.5 percent of high-activity iodate, 2-10 percent of compound binary organic acid, 0.5-5 percent of halogen-free activity enhancer, 2-15 percent of viscosity modifier, 0.04-0.2 percent of efficient surface active agent and the balance modified rosin and rosin derivatives. The preparing method includes the steps that the compound rosin and the viscosity modifier are added into a container to be heated and stirred until the compound rosin and the viscosity modifier are completely melted down, the organic acid, the novel high-activity iodate, the efficient surface active agent and the high-boiling-point solvent are added to be stirred continuously, and therefore the soldering flux is prepared. The prepared halogen-free soldering flux for solder wires is free of halogen compounds, tin is easy to apply in the soldering process, splatter is little, smells are light, soldering spots are bright and full, damage to the health and the environment is avoided, and the post-soldering reliability effect of an electronic product is ensured.

Description

technical field

[0001] The present invention relates to a solder wire flux, in particular to a novel halogen-free high-activity low-splash solder wire flux and a preparation method thereof, which is a novel halogen-free flux for lead-free solder wire and is used for electronic and electrical products. Soldering. Background technique

[0002] In recent years, due to the increasing awareness of human environmental protection and the successive promulgation of lead prohibition laws, electronic packaging soft soldering materials have gradually transitioned from traditional lead-containing solder alloys to lead-free solders, among which Sn-Cu series and Sn-Ag- Cu-based solder is recognized in the industry as a better and commercialized lead-free solder, which has the characteristics of high melting point and easy oxidation. The tin wire flux currently used basically follows the original flux system. The active agents used in traditional solder wire are mainly halogen-containing...

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