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3results about How to "Solve peeling" patented technology

Film coating processing method for glasses frame with waterproof and sunscreen capabilities

The invention relates to the technical field of mirror frame processing, and discloses a mirror frame coating processing method with waterproof and sunscreen capabilities, which comprises the following steps: S1, cleaning and plasma treatment are carried out on a mirror frame base material; s2, coating a silicon dioxide bottom film by adopting a magnetron sputtering method; s3, coating a waterproof and sunscreen composite film formed by mixing nano titanium dioxide and an organic silicon waterproof agent by adopting a spraying method; s4, coating a silicon dioxide-aluminum oxide composite protective layer by adopting a sol-gel method; and S5, carrying out natural aging treatment on the coated mirror frame. By adopting the plasma pretreatment and multi-layer coating film structure design, the bonding force of the coating film and the mirror frame base material is remarkably improved, the problem of coating film stripping is effectively solved, and the mirror frame has excellent waterproof and sunscreen performance through the synergistic effect of the nano titanium dioxide and the organic silicon waterproof agent.
Owner:TAIYU (XIAMEN) OPTICAL CO LTD

Aqueous iron-based ceramic anticorrosive coating

The application discloses an aqueous iron-based ceramic antirust paint, and relates to the technical field of paint, which comprises a primer and a topcoat; the primer is composed of 52-60wt% of primer ceramic precursors, 16-20wt% of primer film-forming resins, 22-26wt% of primer functional fillers and 1.8-2.0wt% of primer auxiliaries; the topcoat is composed of 66-72wt% of topcoat ceramic precursors, 28-32wt% of topcoat film-forming resins and 1.5-2wt% of topcoat auxiliaries; wherein the primer ceramic precursors comprise primer base sol, glacial acetic acid, amino silane, MTMS, organic titanate chelating agent and deionized water; the primer film-forming resins are organic silicon-acrylic acid graft emulsion with a core-shell structure; the topcoat ceramic precursors comprise topcoat base sol, glacial acetic acid, GPTMS, MTMS, hydroxyl-terminated organic silicon oligomer, structure regulator and deionized water; and the topcoat film-forming resins are aqueous hydroxyl / amino bifunctional organic silicon resin compounds. The application has the effect of improving film-forming protection performance.
Owner:CIXI ZHONGYI COATING CO LTD

A method for back-side film application before Taiko wafer plating

ActiveCN116153838BSolve peelingReduced risk of flakingFinal product manufacture
This invention provides a method for back-side film application on a Taiko ring wafer before electroplating. The method includes fixing the back-side-film-applied wafer on a base, pre-cutting a long section of square protective film and placing it at the edge of the Taiko ring on the wafer; moving a three-segment film application roller to the edge of the Taiko ring on the wafer for application, the three-segment film application roller comprising film application roller one, film application roller two, and film application roller three, with both ends of film application roller two movably connected to film application roller one and film application roller three respectively; rotating the base one full turn to remove excess protective film; opening the bottom air curtain, with the bottom air curtain facing the side of the wafer, to support the unapplied protective film; rotating the base while simultaneously moving the three-segment film application roller to roll and apply the film along the edge of the Taiko ring; continuing to move the three-segment film application roller to roll and apply the film along the side of the Taiko ring; closing the bottom air curtain and removing the three-segment film application roller. This invention, by employing a segmented film application method, ensures that protective film is also applied to the edge and side of the Taiko ring on the wafer, reducing the risk of metal plating peeling off the wafer edge during electroplating.
Owner:HUA HONG SEMICON WUXI LTD +1