The invention relates to the technical field of power devices, in particular to a
diagonal through-flow square-
cell IGBT (
Insulated Gate Bipolar Transistor) and a manufacturing method thereof, aims tosolve certain problems existing in the short-circuit capability of devices in the prior art, and is technically characterized by comprising the following steps: S1, selecting a
wafer substrate, depositing an initial
oxide layer on the surface of the
wafer substrate, opening an area needing to be etched, and forming a
protection ring region; S2, removing the
oxide layer to open the
cell region; S3, forming a deep groove structure on the surface of the substrate; S4, forming a
gate oxide layer on the surface of the substrate, depositing Polysilicon, and forming a Pw region on the surface of thesubstrate; S5, forming an Nplus region in the deep groove of the substrate; S6, forming an ILD
dielectric layer on the surface of the substrate, and
etching the
dielectric layer to form a
contact hole; S7, leading out a
metal Emitter
electrode; S8, forming a FieldStop layer and a Colletor layer on the back surface of the
wafer substrate, and depositing a
metal layer to lead out a Colletor
electrode. Under the condition that conductive channels are not reduced, the distribution of the conductive channels is controlled, and at most two conductive channels are controlled to be connected, so thatthe generation of current wires is reduced.