High-temperature solder for brazing TiAl-based alloy and preparation method thereof

A high-temperature brazing filler metal and base alloy technology, used in welding equipment, metal processing equipment, welding/cutting media/materials, etc. Low cost, suitable melting point, good room temperature and high temperature strength

Active Publication Date: 2011-09-28
HARBIN INST OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0009] The purpose of the present invention is to solve the problems of low service temperature of TiAl-based alloy brazing joints obtained by using traditional brazing filler metals, poor joint performance under high-temperature e

Method used

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  • High-temperature solder for brazing TiAl-based alloy and preparation method thereof
  • High-temperature solder for brazing TiAl-based alloy and preparation method thereof
  • High-temperature solder for brazing TiAl-based alloy and preparation method thereof

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specific Embodiment approach 1

[0015] Embodiment 1: In this embodiment, the high-temperature solder used for brazing TiAl-based alloys is made of 32%-36% Ti, 40%-44% Ni, and 20%-28% V by weight percentage.

[0016] In this embodiment, Ti, Ni and V are all composed of simple metals, and the mass purity is 99.9%-99.95%.

specific Embodiment approach 2

[0017] Embodiment 2: The difference between this embodiment and Embodiment 1 is that the high-temperature brazing filler metal used for TiAl-based alloy brazing is made of 32% Ti, 44% Ni and 24% V according to weight percentage. Others are the same as in the first embodiment.

specific Embodiment approach 3

[0018] Embodiment 3: The difference between this embodiment and Embodiment 1 is that the high-temperature brazing filler metal used for TiAl-based alloy brazing is made of 36% Ti, 44% Ni and 20% V in weight percentage. Others are the same as in the first embodiment.

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Abstract

The invention discloses a preparation method of a high-temperature solder for brazing a TiAl-based alloy, and relates to the high-temperature solder and the preparation method thereof. The invention solves the problems that a TiAl-based alloy brazing joint obtained by using the conventional solder is low in use temperature and has low performance under a high-temperature environment, the used solder is high in price, and the solder preparation technology is complicated. The solder is made of Ti, Ni and V. The preparation method comprises the following steps of: weighing raw materials; 2, filling the raw materials in arc melting equipment, vacuumizing, filling argon, melting and alloying, and repeatedly melting and cooling. Compared with the conventional solder, the solder prepared by the invention has an appropriate melting point and good wetting property; the solder components are free of noble metals, such as Ag, Zr and the like, so the cost is low; the brazing joint has high strength under the high-temperature environment of 800 DEC, and is applicable to various joints; and the preparation method is simple and convenient.

Description

technical field [0001] The invention relates to a high-temperature brazing material and a preparation method thereof. Background technique [0002] TiAl-based alloys have high specific strength, specific stiffness, and good high-temperature oxidation resistance and creep resistance, and the service temperature is expected to reach above 900 °C. TiAl-based alloys are recognized as ideal materials to replace titanium alloys and nickel-based superalloys. They have broad application prospects and are a light-weight high-temperature material with great development potential. Since the U.S. Air Force Materials Laboratory put forward the first TiAl-based alloy development plan in 1975, TiAl-based alloys have been actively supported and organized by important industrial sectors such as aviation, aerospace, and military industries around the world. After more than 20 years of in-depth and meticulous basic research work by researchers from various countries, the development of TiAl-b...

Claims

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Application Information

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IPC IPC(8): B23K35/30B23K35/40
Inventor 曹健宋晓国蔺晓超冯吉才张丽霞金贵东
Owner HARBIN INST OF TECH
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