Leadfree SnZn-base alloy solder containing rare-earth elements

A technology of lead-free solder and rare earth elements, which is applied in the field of electronic packaging brazing materials and metal material engineering, can solve the problems of affecting application, poor wettability and corrosion resistance of alloys, etc., and achieve improved corrosion resistance, suitable melting point, The effect of superior mechanical properties

Inactive Publication Date: 2003-01-15
DALIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the relatively active Zn element, the wettability and corrosion resistance of the alloy are poor, which affects the application.

Method used

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  • Leadfree SnZn-base alloy solder containing rare-earth elements
  • Leadfree SnZn-base alloy solder containing rare-earth elements
  • Leadfree SnZn-base alloy solder containing rare-earth elements

Examples

Experimental program
Comparison scheme
Effect test

Embodiment approach

[0034] The following chemical composition (%) is selected: (7-9) Zn; (0.05-0.15) RE; (0.5-3) Bi; (0.2-0.5) Al, and the balance is Sn. The above-mentioned raw materials prepared according to the composition are put into an industrial vacuum induction furnace for smelting, and the vacuum degree is 10 -3 Pa. Under normal pressure, keep the temperature at 500°C for 4 to 6 hours, pour to get solder alloy, prepare solder powder by spraying, add flux to get solder paste. Can be used for reflow soldering.

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Abstract

A lead-free alloy as solder contains Zn (5-10 wt.%), the rare-earth elements chosen from La, Ce, Pr and Nd (0.05-1), one or more of Bi (0.1-6), Cu (0.1-3), In (0.5-3), Al (0.1-1), Ni (0.01-1) and P (0.001-1), and Sn (rest). Its advantages are better wettability, fine structure, excellent mechanical performance, low cost and no poison and pollution.

Description

technical field [0001] The invention belongs to the technical field of metal material engineering, relates to the technical field of electronic packaging brazing materials, and in particular relates to a low-cost lead-free solder alloy suitable for the electronic industry, especially for household appliances. Background technique [0002] Since the traditional tin-lead solder contains lead element which is extremely harmful to the human body and the environment, the development of lead-free solder has become an urgent task for current materials scientists. The United States, Japan and other countries are actively enacting laws to prohibit the use of lead. According to the European Union’s directive on waste of electrical and electronic products and machinery, it will completely prohibit the use of toxic and harmful elements such as lead and cadmium in the electronics industry from January 1, 2008. use in . Therefore, in order to eliminate lead pollution, there is an urgent ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26C22C13/00
Inventor 赵杰黄明亮于大全王来
Owner DALIAN UNIV OF TECH
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