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Low-silver copper-based solder free of spillover phenomenon during weld period

A solder, silver-copper technology, applied in welding/cutting medium/material, welding medium, welding equipment, etc., can solve problems such as solder overflow

Active Publication Date: 2013-04-03
浙江信和科技股份有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a controllable fluidity for the existing low-silver copper-based solder that often occurs when the solder overflows during brazing. Low-silver copper-based solder with low-silver copper-based solder overflow phenomenon

Method used

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  • Low-silver copper-based solder free of spillover phenomenon during weld period

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Embodiment Construction

[0022] Manufacture of brazing filler metal: it is manufactured by general-purpose copper-based brazing filler metal induction melting, extrusion, drawing and ring making processes.

[0023] The embodiment of brazing filler metal of the present invention and the performance comparison with existing low-silver copper base brazing filler metal are shown in Table 1. The melting temperature of the solder was measured by a differential thermal analyzer, the heating rate was 15°C / min, and the protective gas was N2. The wettability test of the solder is carried out in a muffle furnace, with 102 flux, and the test temperature is 800±10°C. The seam filling test of the solder is carried out by flame brazing with 102 flux.

[0024] Table 1: The embodiment of brazing filler metal of the present invention and the performance comparison with existing low-silver copper base brazing filler metal

[0025]

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Abstract

The invention discloses a low-silver copper-based solder free of a spillover phenomenon during a weld period. Aiming at the defect that the spillover phenomenon of the solder often occurs when brazing is performed by using traditional low-silver copper-based solder, the invention aims to provide the low-silver copper-based solder which is controllable in flowability and is free of the spillover phenomenon of the traditional low-silver copper-based solder during a process of welding copper and copper alloy. The low-silver copper-based solder disclosed by the invention is realized through the following technical scheme: the low-silver copper-based solder free of the spillover phenomenon during the weld period comprises the following components in weight percent: 6.6-7.8 percent of phosphorus (P), 0.5-2.2 percent of silver (Ag), 0.01-0.4 percent of indium (In), 0.001-0.2 percent of silicon (Si), 0.001-0.1 percent of rare earth and the balance copper (Cu).

Description

technical field [0001] The invention relates to a low-silver copper-based brazing filler metal that has no brazing filler metal spillage during welding, and is particularly suitable for welding copper and copper alloy valve parts, pipe joints and other occasions that require high brazing filler metal spillage. Background technique [0002] Copper and copper alloy valve parts, pipe joints, etc. are widely used in refrigeration, electromechanical and other industries. Since brazing is required in the manufacturing process of such parts, the existing low-silver copper-based brazing filler metal often occurs during brazing. Spillage, the spilled solder will affect the subsequent assembly and connection of such parts, so the spillage of the solder must be strictly controlled to avoid scrapping the parts, and the solder to control the solder spillage during welding is the best economical solution. Contents of the invention [0003] The purpose of the present invention is to pro...

Claims

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Application Information

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IPC IPC(8): B23K35/30
Inventor 张理成董显刘玉章陈晓江郑丽程迎涛陈亦军
Owner 浙江信和科技股份有限公司
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