1results about How to "Moderate melting temperature" patented technology

The present application relates to a kind of TR assembly package high thermal conductive eutectic medium temperature solder and foil strip preparation method, belong to microelectronic system packaging field.The solder composition: Sb 10.5~12.5wt%, Sn 0.5~2.0wt%, Ag 0.1~0.5wt%, Cu 0.1~0.5wt%, Pd 0.05~0.2wt%, Ni 0.05~0.2wt%, In 0.01~0.1wt%, P0.002~0.01wt%, the balance is Pb.Its foil strip preparation method includes raw material selection and intermediate alloy preparation, non-vacuum medium frequency induction melting, fast cooling horizontal casting and isothermal rolling step.The alloy melting point is moderate, has high strength, high thermal fatigue and high thermal conductivity etc.;Alloy foil composition is uniform, IMC is small, surface is clean, and the yield is high, satisfies the multistage packaging demand of TR assembly in microelectronic system.