4results about How to "Moderate melting temperature" patented technology

The invention relates to silver-based multi-element near-eutectic medium-temperature vacuum brazing filler metal and a preparation method thereof, and belongs to the field of non-ferrous metal brazing. The brazing filler metal is prepared from the following components in percentage by weight: 19.5 to 21.0 weight percent of Cu, 9.0 to 10.0 weight percent of In, 4.5 to 5.5 weight percent of Ge, 4.2 to 4.8 weight percent of Sn, 1.8 to 2.2 weight percent of Ni, 1.7 to 2.0 weight percent of Si, 0.05 to 0.2 weight percent of Co and the balance of Ag. The preparation method comprises the steps of intermediate alloy preparation, vacuum medium-frequency induction melting, centrifugal rapid cooling casting, vacuum heat treatment regulation and control, hot rolling cogging, surface treatment and precise cold rolling. The alloy is low in melting point, low in required vacuum brazing temperature, excellent in wetting characteristic for stainless steel, high in joint strength after brazing and capable of meeting the requirements for medium-temperature vacuum brazing packaging, gradient brazing and repair welding of 316L stainless steel base materials in vacuum electronic devices.

The invention relates to the technical field of welding, in particular to high-entropy alloy brazing filler metal for high-nitrogen steel and tungsten alloy brazing and a preparation method and application of the high-entropy alloy brazing filler metal. The high-entropy alloy brazing filler metal for brazing the high-nitrogen steel and the tungsten alloy comprises the following components in atomic percent: 18%-32% of Ag, 12%-24% of Cu, 15%-25% of Mn, 15%-25% of Ni and the balance of Ti. According to the high-entropy alloy brazing filler metal for brazing of the high-nitrogen steel and the tungsten alloy, the phenomenon that intermetallic compounds and nitrogen overflow in a high-nitrogen steel / tungsten alloy brazing joint can be reduced, and the quality of the brazing joint is improved.

The present application relates to a kind of TR assembly package high thermal conductive eutectic medium temperature solder and foil strip preparation method, belong to microelectronic system packaging field.The solder composition: Sb 10.5~12.5wt%, Sn 0.5~2.0wt%, Ag 0.1~0.5wt%, Cu 0.1~0.5wt%, Pd 0.05~0.2wt%, Ni 0.05~0.2wt%, In 0.01~0.1wt%, P0.002~0.01wt%, the balance is Pb.Its foil strip preparation method includes raw material selection and intermediate alloy preparation, non-vacuum medium frequency induction melting, fast cooling horizontal casting and isothermal rolling step.The alloy melting point is moderate, has high strength, high thermal fatigue and high thermal conductivity etc.;Alloy foil composition is uniform, IMC is small, surface is clean, and the yield is high, satisfies the multistage packaging demand of TR assembly in microelectronic system.

The invention discloses a Ti-Zr-Cu-Ni-Mn high-entropy brazing filler metal and a preparation method and a brazing method thereof, relates to a high-entropy brazing filler metal for welding a TiAl alloy and a Ni-based high-temperature alloy and a preparation method and a brazing method thereof, and belongs to the technical field of welding materials. The brazing filler metal is composed of, by atomic percent, 20% of Ti, 20% of Zr, 20% of Cu, 20% of Ni and 20% of Mn. The preparation method comprises the following steps: burdening according to the content of the components, and smelting the raw materials through an electric arc smelting method to obtain a brazing filler metal master alloy ingot; and after the alloy ingot is crushed into small blocks, the Ti-Zr-Cu-Ni-Mn high-entropy brazing filler metal is prepared through a single-roller melt-spinning method. The liquidus temperature of the high-entropy brazing filler metal is 1130 DEG C, and the high-entropy brazing filler metal has the advantages of being low in cost, easy and convenient to assemble, good in wettability with base metal, capable of easily forming a brazing joint with excellent performance with TiAl alloy and Ni-based high-temperature alloy and the like.