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Copper-based solder and preparation method thereof

A technology of copper-based brazing material and blank, which is applied in the direction of manufacturing tools, welding equipment, metal processing equipment, etc., can solve problems such as difficulty in adapting to assembly-type precision brazing, limiting the application range of brazing material, and weakening the mechanical properties of joints, etc., to achieve overall Inexpensive, improved oxidation resistance, wettability and gap filling effects

Active Publication Date: 2013-10-23
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the high brazing temperature of nickel-based solder, the amount of dissolution of the base metal is large, and in the matrix diffusion layer area, there are particle oxides and holes that gather and grow near both sides of the interface, so that the mechanical properties of the butt joint produce a certain weakening effect
Moreover, the nickel-based solder is extremely brittle and is generally supplied in powder form, which limits the application range of the solder, and is especially difficult to meet the requirements of assembled precision brazing
In addition, my country's nickel resources are scarce and expensive

Method used

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  • Copper-based solder and preparation method thereof
  • Copper-based solder and preparation method thereof
  • Copper-based solder and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0027] The preparation method of the copper-based solder of the present embodiment may further comprise the steps:

[0028] (1) Ingredients: Copper, manganese, nickel, cobalt, silicon, copper-iron master alloy, copper-boron master alloy, copper-mixed rare earth master alloy are used as raw materials, and the mass percentage of iron in the copper-iron master alloy is 4.95%, and the balance is copper; the mass percentage of boron in the copper-boron master alloy is 4.95%, and the balance is copper; the mass percentage of the misch metal in the copper-boron master alloy is 5.00%, The balance is copper; the mixed rare earth is composed of cerium and lanthanum in any proportion.

[0029] Prepare the charge according to the mass percentage of the following elements:

[0030]

[0031] The balance is copper;

[0032] (2) Melting and casting: put the prepared charge into the corundum crucible in order of manganese, copper, nickel, cobalt, silicon, copper-boron master alloy, copper...

Embodiment 2

[0036] The preparation method of the copper-based solder of the present embodiment may further comprise the steps:

[0037] (1) Ingredients: Copper, manganese, nickel, cobalt, silicon, copper-iron master alloy, copper-boron master alloy, copper-mixed rare earth master alloy are used as raw materials, and the mass percentage of iron in the copper-iron master alloy is is 5.00%, and the balance is copper; the mass percentage of boron in the copper-boron master alloy is 5.00%, and the balance is copper; is copper; the mixed rare earth is composed of cerium and lanthanum in any proportion.

[0038] Prepare the charge according to the mass percentage of the following elements:

[0039]

[0040] The balance is copper;

[0041] (2) Melting and casting: put the prepared charge into the corundum crucible in order of manganese, copper, nickel, cobalt, silicon, copper-boron master alloy, copper-mixed rare earth master alloy, copper-iron master alloy, and use medium frequency inductio...

Embodiment 3

[0045] The preparation method of the copper-based solder of the present embodiment may further comprise the steps:

[0046] (1) Ingredients: Copper, manganese, nickel, cobalt, silicon, copper-iron master alloy, copper-boron master alloy, copper-mixed rare earth master alloy are used as raw materials, and the mass percentage of iron in the copper-iron master alloy is is 5.00%, and the balance is copper; the mass percentage of boron in the copper-boron master alloy is 5.00%, and the balance is copper; is copper; the mixed rare earth is composed of cerium and lanthanum in any proportion.

[0047] Prepare the charge according to the mass percentage of the following elements:

[0048]

[0049]

[0050] The balance is copper;

[0051] (2) Melting and casting: put the prepared charge into the corundum crucible in order of manganese, copper, nickel, cobalt, silicon, copper-boron master alloy, copper-mixed rare earth master alloy, copper-iron master alloy, and use medium freque...

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Abstract

The invention discloses a method for preparing a copper-based solder. The method comprises the following steps: (1) burdening: preparing a furnace burden from copper, manganese, nickel, cobalt, silicon, a copper-ferrous intermediate alloy, a copper-boron intermediate alloy and a copper-mixed rare earth intermediate alloy serving as raw materials; (2) casting: putting the prepared furnace burden into the a corundum crucible according to the sequence of manganese, copper, nickel, cobalt, silicon, copper-boron intermediate alloy, copper-mixed rare earth intermediate alloy and copper-ferrous intermediate alloy, smelting by adopting medium-frequency induction, and cooling along with the furnace to obtain an alloy blank, wherein the smelting process is performed under the protection of argon gas; and (3) rolling: rolling the alloy blank with a cold-rolling mill to obtain the copper-based solder. The copper-based solder provided by the invention can be applied to an ODS (Oxide Dispersion Strengthened) high-temperature alloy welding joint, has high brazing process performance, heat resistance, corrosion resistance and machining process, and is low in cost.

Description

technical field [0001] The invention relates to soldering solder, in particular to a copper-based solder and a preparation method thereof. Background technique [0002] Oxide Dispersion Strengthened (ODS for short) superalloy is a new type of superalloy containing ultrafine oxide point dispersion strengthening. It is different from the strengthening phase in conventional superalloys that dissolves in the matrix at high temperatures. 2 o 3 、Al 2 o 3 , ThO 2 Oxide particles have good thermal and chemical stability, do not dissolve in the matrix at high temperature and are uniformly dispersed, making this kind of material have a comprehensive combination of good high-temperature mechanical properties, high-temperature oxidation resistance and corrosion resistance. Advantage. Therefore, it has broad application prospects in the fields of aviation, spaceflight and energy. As a new structural material, ODS superalloy needs to solve its welding problem in order to expand its ...

Claims

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Application Information

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IPC IPC(8): B23K35/30B23K35/40
Inventor 李小强敖敬培屈盛官杨超肖晴
Owner SOUTH CHINA UNIV OF TECH
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