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A kind of preparation method of lead-free solder for high-lead high-temperature replacement

A technology of solder and high temperature, which is applied in the field of lead-free solder for high-lead and high-temperature replacement and its preparation, can solve problems that have not been paid attention to, and achieve the effects of good economy, easy raw materials, and low cost

Active Publication Date: 2016-04-20
CHONGQING UNIVERSITY OF SCIENCE AND TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In addition, high-lead solders cannot be exempted for a long time. The development of suitable lead-free solders that can replace high-lead high-temperature solders will receive more and more attention. Relevant foreign research institutions have invested a lot of manpower and material resources in this area. research, but domestic research in this area has not received much attention

Method used

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  • A kind of preparation method of lead-free solder for high-lead high-temperature replacement
  • A kind of preparation method of lead-free solder for high-lead high-temperature replacement
  • A kind of preparation method of lead-free solder for high-lead high-temperature replacement

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Embodiment 1

[0049] A lead-free solder for high-lead high temperature replacement, the chemical composition of the solder is: 80wt% Zn, 20wt% Sn, hereinafter referred to as 80Zn-20Sn, figure 1 It is the metallographic structure diagram of embodiment 1.

Embodiment 2

[0051] A lead-free solder for high-lead high temperature replacement, the chemical composition of the solder is: 70wt% Zn, 30wt% Sn, hereinafter referred to as 70Zn-30Sn, figure 2 It is the metallographic structure diagram of embodiment 2.

Embodiment 3

[0053] A lead-free solder for high-lead high-temperature replacement, the chemical composition of the solder is: 60wt% Zn, 40wt% Sn, hereinafter referred to as 60Zn-40Sn, image 3 It is the metallographic structure diagram of embodiment 3.

[0054] from Figure 1-3 It can be seen that the microstructures of 80Zn-20Sn, 70Zn-30Sn and 60Zn-40Sn are all composed of primary crystal Zn phase, eutectic SnZn phase and Sn phase, all of which are coarse dendritic and fine eutectic SnZn particles scattered in bright The white Sn phase is on. With the increase of Zn content, the number of primary crystal Zn phases increases, and the shape becomes coarser, changing from block to lath. It is due to the increase of the primary crystal Zn phase that the liquid phase composition of the solder at 250 ° C also decreases with the decrease of the Sn content.

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Abstract

The invention discloses lead-free brazing filler metal for replacing high-lead high-temperature brazing filler metal, which is characterized in that the lead-free brazing filler metal comprises the following chemical compositions: 60-80wt% of Zn and 20-40wt% of Sn, wherein the melting temperature of the lead-free brazing filler metal is 199-390 DEG C, and the shear strength is 34-39 MPa. The melting temperature of the lead-free brazing filler metal is relatively appropriate, and the potentiality of the lead-free brazing filler metal for replacing the high-lead high-temperature brazing filler metal is great.

Description

technical field [0001] The invention relates to a lead-free solder for high-lead and high-temperature replacement and a preparation method thereof. Background technique [0002] With the continuous development of modern electronic products in the direction of miniaturization and multi-function, the density of electronic packaging is getting higher and higher, and the service environment (high temperature, high heat, high humidity, etc.) of new semiconductor chips and other electronic components is becoming increasingly severe. Therefore, the demand for high-temperature interconnect materials for electronic packaging will increase. In addition, high-lead solders cannot be exempted for a long time. The development of suitable lead-free solders that can replace high-lead high-temperature solders will receive more and more attention. Relevant foreign research institutions have invested a lot of manpower and material resources in this area. However, domestic research in this are...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/28B23K35/40
Inventor 尹立孟尹建国夏文堂王刚
Owner CHONGQING UNIVERSITY OF SCIENCE AND TECHNOLOGY
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