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High-melting-point lead free brazing filler metal used for electronic packaging and preparation method thereof

A technology for electronic packaging and lead-free solder, applied in manufacturing tools, welding equipment, metal processing equipment, etc., can solve problems such as under-recognized, and achieve the advantages of mechanical properties, good economy, and easy access.

Active Publication Date: 2013-05-08
CHONGQING UNIVERSITY OF SCIENCE AND TECHNOLOGY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Relevant foreign research institutions have invested a lot of manpower and material resources in research in this area, but domestic research in this area has not yet received attention

Method used

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  • High-melting-point lead free brazing filler metal used for electronic packaging and preparation method thereof
  • High-melting-point lead free brazing filler metal used for electronic packaging and preparation method thereof
  • High-melting-point lead free brazing filler metal used for electronic packaging and preparation method thereof

Examples

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Effect test

Embodiment 1

[0043] A high melting point lead-free solder for electronic packaging, the chemical composition of the solder is: 88wt% Bi, 10wt% Ag, 2wt% Cu, figure 1 It is the metallographic structure diagram of embodiment 1.

Embodiment 2

[0045] A high melting point lead-free solder for electronic packaging, the chemical composition of the solder is: 89wt% Bi, 10wt% Ag, 1wt% Cu, figure 2 It is the metallographic structure diagram of embodiment 2.

Embodiment 3

[0047] A high melting point lead-free solder for electronic packaging, the chemical composition of the solder is: 89.5wt% Bi, 10wt% Ag, 0.5wt% Cu, image 3 It is the metallographic structure diagram of embodiment 3.

[0048] from Figure 1-3 It can be seen that the microstructure of Bi-10Ag-0.5Cu, Bi-10Ag-1Cu, Bi-10Ag-2Cu solder consists of Bi phase, Bi-Ag eutectic structure, bright white dendritic primary crystal Ag and lath-like Cu phase composition. After adding a small amount of Cu, the biggest change in the microstructure of Bi-Ag-Cu and Bi-Ag is the formation of lath-like Cu phases in the structure, which are dispersed in the alloy system, and a small part sometimes gathers into a scallop shape. The morphology of the hypereutectic structure has a great influence.

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Abstract

The invention relates to a high-melting-point lead free brazing filler metal used for electronic packaging. The high-melting-point lead free brazing filler metal used for electronic packaging is characterized in that the chemical composition of the brazing filler metal comprises, by weight, 88% to 89.5% of bismuth (Bi), 10% of silver (Ag) and 0.5% to 2% of copper(Cu). The melting temperature of the brazing filler metal is 260 DEG C to 270 DEG C. The shearing strength of the brazing filler metal is from 28 Mpa to 29.5 Mpa. Due to the fact that the brazing filler metal has an appropriate metlting temperature, the high-melting-point lead free brazing filler metal used for electronic packaging is large in potential to be a substituted brazing filler metal for a high-lead brazing filler metal.

Description

technical field [0001] The invention relates to a lead-free solder for electronic packaging and a preparation method thereof. Background technique [0002] With the continuous development of modern electronic products in the direction of miniaturization and multi-function, the density of electronic packaging is getting higher and higher, and the service environment (high temperature, high heat, high humidity, etc.) of new semiconductor chips and other electronic components is becoming increasingly severe. Therefore, the demand for high-temperature interconnect materials for electronic packaging will increase. In addition, the exemption period for high-lead solder is coming soon, and the development of suitable lead-free solder that can replace high-lead and high-melting-point solder has attracted much attention and needs to be solved urgently. Relevant foreign research institutions have invested a lot of manpower and material resources in this area of ​​research, but domest...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26B23K35/40
Inventor 尹立孟尹建国夏文堂姚宗湘
Owner CHONGQING UNIVERSITY OF SCIENCE AND TECHNOLOGY
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