Solder stripping agent and preparation method thereof

A technology of tin stripping agent and complexing agent, applied in the field of tin stripping agent and its preparation, can solve problems such as a large amount of sludge and scrapping

Inactive Publication Date: 2011-02-02
济南德锡科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] In view of the above-mentioned prior art, in order to solve the defect that the stripping solution in the prior art can produce a large amount of silt and cause scrapping, the present invention provides a kind of tin stripper that basically does not produce silt or the amount of silt is very small, and the stripping speed of this tin stripper is Faster, large stripping area, long life, complete tin stripping and bright bottom layer after stripping, not easy to lose luster

Method used

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  • Solder stripping agent and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0052] Embodiment 1 prepares a kind of tin stripping agent

[0053] The recipe is:

[0054] 70% concentrated nitric acid (volume percentage, the same below) 600g / L

[0055] FeCl 3 ·6H 2 O 8g / L

[0056] 37% hydrochloric acid (volume percentage, the same below) 60g / L

[0057] Methanesulfonic acid 4g / L

[0058] Sulfamic acid 4g / L

[0059] Monoethanolamine 10g / L

[0060] Carboxybenzotriazole 1.5g / L

[0061] Urea 1g / L

[0062] Polyethylene glycol 400 2g / L

[0063] CH 3 OH 0.5g / L

[0064] water balance.

[0065] The preparation method is:

[0066] (1) Accurately weigh monoethanolamine, add a little water, add hydrochloric acid, neutralize it, and place it for later use;

[0067] (2) dissolve ferric chloride in an appropriate amount of water, slowly add 70% concentrated nitric acid to the solution until the solution turns from reddish-brown to light green, and place it for subsequent use;

[0068] (3) Dissolve the remaining 70% concentrated nitric acid into an appropri...

Embodiment 2

[0069] Embodiment 2 prepares a kind of tin stripping agent

[0070] The recipe is:

[0071] 70% concentrated nitric acid 650g / L

[0072] FeCl 3 ·6H 2 O 8.5g / L

[0073] 37% hydrochloric acid 70g / L

[0074] Methanesulfonic acid 4g / L

[0075] Glycine 5g / L

[0076] Triethanolamine 15g / L

[0077] Benzotriazole 1.8g / L

[0078] Urea 1.5g / L

[0079] Isodecanol polyoxyethylene ether 3g / L

[0080] Ethanol 0.2g / L

[0081] water balance.

[0082] The preparation method is the same as in Example 1.

Embodiment 3

[0083] Embodiment 3 prepares a kind of tin stripping agent

[0084] The recipe is:

[0085] 70% concentrated nitric acid 600g / L

[0086] FeCl 3 ·6H 2 O 6.5g / L

[0087] 37% hydrochloric acid 50g / L

[0088] Allyl Carbonic Acid 8g / L

[0089] Sulfamic acid 5g / L

[0090] Tetrahydroxyethylethylenediamine 10g / L

[0091] Pyrrolidone 3g / L

[0092] Thiourea 1.5g / L

[0093] Nonylphenol polyoxyethylene ether 3g / L

[0094] Isopropyl alcohol 0.3g / L

[0095] water balance.

[0096] The preparation method is the same as in Example 1.

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Abstract

The invention discloses a solder stripping agent, which is prepared from the following components: 500 to 650g / L of 70 percent nitric acid, 50 to 70g / L of hydrochloric acid, 4.3 to 8.6g / L of ferric nitrate or 2.9 to 5.8g / L of ferric trichloride or 4.8 to 9.7g / L of ferric chloride hexahydrate, 0.5 to 25g / L of organic acid complexing agent, 1 to 50g / L of water-soluble organic amine, 1 to 10g / L of organic corrosion inhibitor for copper, 1 to 2g / L of stabilizing agent, 1 to 5g / L of surfactant, and 0.1 to 1g / L of small molecular alcohol. The solder stripping agent can quickly strip solder or solder alloy layers thoroughly, basically cannot generate or generates little salt mist containing nitric oxides in the stripping process, and has the advantages of small silt amount, long service life of stripping solution, no strong corrosion on copper at a bottom layer, bright substrate and the like.

Description

technical field [0001] The invention relates to a tin stripping agent and a preparation method thereof, belonging to the field of stripping metal plating. Background technique [0002] Printed circuit board, abbreviated as PCB (printed circuit board) or PWB (printed wiring board), is an important electronic component and a support for electronic components. A typical printed circuit board is not covered by a tin or tin alloy layer by etching. The tin layer or tin alloy layer and the underlying copper covered by the patterned copper layer are retained. Because the tin plating or tin alloy process is like printing graphics on copper foil, it is referred to as printed circuit board for short. Generally, the substrate is fully electroplated and then the blank area of ​​the circuit is protected, and then patterned tin or tin alloy is electroplated on the exposed copper plated circuit, and then the protective film is removed, and the copper layer that is not protected by the tin l...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23F1/44H05K3/06
Inventor 张鸣骆祖文
Owner 济南德锡科技有限公司
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