Overmolded electronic module with an integrated electromagnetic shield using SMT shield wall components

a technology of electromagnetic shielding and electronic modules, applied in the direction of final product manufacturing, sustainable manufacturing/processing, semiconductor/solid-state device details, etc., can solve the problems of adversely affecting the circuitry of the electronic module, exceeding the regulatory limit, and affecting other electronic devices, etc., to achieve mechanical stability, withstand subsequent overmolding processes, and facilitate manufacturing
US20080112151A1Inactive Publication Date: 2008-05-15SKYWORKS SOLUTIONS INC
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Patent Information

Authority / Receiving Office
US · United States
Current Assignee / Owner
SKYWORKS SOLUTIONS INC
Publication Date
2008-05-15
Estimated Expiration
Not applicable · inactive patent

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Abstract

An electronic module with an integrated electromagnetic shield using surface mount shield wall components has been disclosed. Each surface mount shield wall component provides side shielding of circuitry within the overmolded electronic module and provides an exposed conductive shield wall section to which a top conductive shield can be applied. By including the shield structure as part of the overmolded electronic module, the need for a separate shield and separate process steps for installing the separate shield can be eliminated. Each surface mount shield wall component comprises a non-conductive portion that provides stability during a reflow soldering process, but at least a sacrificial portion of the non-conductive portion can be removed to reduce the amount of area occupied by the overmoldable shield structure.
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Description

[0001] This application is a continuation in part of, and claims benefit of the filing date of, and hereby incorporates fully by reference, the pending parent application entitled “Overmolded Semiconductor Package with an Integrated EMI and RFI Shield” Ser. No. 10 / 793,618, filed Mar. 4, 2004, and assigned to the assignee of the present application.BACKGROUND OF THE INVENTION

[0002] 1. Field of the Invention

[0003] The invention relates generally to electronic device manufacturing and more particularly to techniques for providing shielding for electronic components.

[0004] 2. Related Art

[0005] Portable electronic devices such as cell phones typically utilize electronic modules to provide a high level of functionality in a small package. The electronic module can include, for example, any combination of one or more integrated circuits and one or more passive devices such as resistors, capacitors, and inductors mounted on a module circuit board. The components of the electronic module can be e...

Claims

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