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Resin composition having laser direct-structuring function and its preparation method and use

A technology of laser direct structuring and resin composition, applied in the field of resin composition, can solve problems such as poor heat dissipation efficiency

Inactive Publication Date: 2013-12-18
KINGFA SCI & TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existence of this interface thermal resistance makes the overall heat dissipation performance not good

Method used

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  • Resin composition having laser direct-structuring function and its preparation method and use
  • Resin composition having laser direct-structuring function and its preparation method and use
  • Resin composition having laser direct-structuring function and its preparation method and use

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0088] The resin matrix is ​​made of polydecanediamide, 28wt%, the thermally conductive filler is made of boron nitride 30wt% and magnesium oxide 20wt%, the copper-manganese laser sensitive additive is 12wt%, other additives are made of nano-alumina 2wt%, glass fiber 8wt%.

Embodiment 2

[0090] Polydecanediamide 40wt% is used as the resin matrix, 30wt% boron nitride and 20wt% magnesium oxide are used as thermal conductive fillers, 0wt% copper-manganese laser sensitive additives are used, 2wt% nano-alumina is used as other additives, and 8wt% glass fiber %.

Embodiment 5

[0103] The test results show that the thermal conductivity of this material is 3.36 W / mK, the thickness of the metal film is 7.68um, and the shedding area of ​​the metal film is less than 5% in the Baige test.

[0104] Example 6

[0105] Thermotropic liquid crystal polymer (from Kingfa Science and Technology Co., Ltd.) 58wt%, aluminum nitride 10wt%, zinc oxide 10wt%, copper-chromium laser sensitive additive 12wt%, carbon fiber 10wt%.

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Abstract

The invention provides a resin composition having a laser direct-structuring function and its preparation method and use. The resin composition comprises 15-60wt% of a resin matrix, 30-70wt% of a heat-conduction filler, 5-12wt% of a laser-sensitive additive and 0-15wt% of other additives. The laser-sensitive additive has a general chemical formula of XY2O4, belongs to an isometric system and has axial length a=b=c and axial angle alpha=beta=gamma=90 degrees, wherein X and Y represent metal elements belonging to an IIIA group, an IB group, an IIB group, a VIB group, a VIIB group and a VIII group of the periodic table of elements. The resin composition has high temperature resistance and good thermal conductivity, realizes optional sedimentation of metals such as Cu, Ni and Au in a laser-scanned area and can be used for surface mounting technology (SMT) products.

Description

technical field [0001] The invention relates to a resin composition, in particular to a thermally conductive resin composition with the function of Laser Direct Structuring, a preparation method thereof and an application of the resin composition. [0002] Background technique [0003] Laser direct structuring (LDS) technology refers to the use of computer to control the laser scanning area, irradiate the laser light on the workpiece containing laser sensitive additives, activate the circuit pattern, and the activated area on the workpiece can be electroless electroless plating Deposit metals such as copper, nickel, gold, etc., so as to realize the manufacture of conductive patterns on three-dimensional plastic parts. [0004] With the rapid development of Laser Direct Structuring (LDS) technology, the production speed of Molded Interconnect Device (Moulded Interconnect Device) is faster, the process is more simplified, the cost is more controllable, and the application fie...

Claims

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Application Information

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IPC IPC(8): C08L77/06C08L81/02C08L77/02C08L23/12C08L63/02C08K13/04C08K13/02C08K3/38C08K3/22C08K3/28C08K3/04C08K5/5313C08K3/34C08K7/14C08K7/06C23C18/20F21V29/00F21Y101/02
CPCC08L71/00C08G2650/40C08K7/14C08K2003/2217C08L71/12C08L77/02C08L77/06C08L79/08
Inventor 严峡蔡彤旻宁凯军姜苏俊蒋智强宁方林叶南飚
Owner KINGFA SCI & TECH CO LTD
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