2results about How to "Moderate density" patented technology

The present application relates to the field of aquaculture, and particularly relates to a device and method for vertical seedling and bottom sowing and propagation of sessile shellfishes, comprising a culture frame and a culture tray, wherein the culture tray comprises a side plate, a shelf, a seedling attachment device and a connector, the side plate forms a rectangular frame, the top and bottom of the rectangular frame are open, a plurality of water-permeable holes are arranged on the side plate, the shelf is arranged in parallel on the outer side of the side plate, the seedling attachment device is arranged to block the opening at the bottom of the rectangular frame, the seedling attachment device is connected to the opening at the bottom through the connector, the culture frame comprises a three-dimensional frame and a shelf frame, the shelf frame is arranged in parallel inside the three-dimensional frame, and the shelf is arranged on the shelf frame. By using the device, the density of the seedlings during attachment can be adjusted, the density of the seedlings is made to be reasonable, and the suitable density for the growth of the seedlings is obtained.

This invention discloses a chip transfer mechanism and a chip transfer method. The chip transfer mechanism includes a transfer substrate with a through-groove extending from the upper surface to the lower surface. The shape of the through-groove is adapted to the shape of the chip, allowing the chip to be accommodated within it. The sides of the through-groove form a frame along the chip's edge. A fixing film is also included, positioned along the junction of the frame and the chip. Part of the fixing film is adhered to the chip, and another part is adhered to the frame, allowing the chip to be transferred synchronously while the frame is being transferred. By providing a through-groove on the transfer substrate, the chip is directly accommodated within the groove, eliminating the need for edge clamping. This significantly improves the utilization rate of chip material, increasing it by more than 10%. This transfer mechanism is particularly suitable for chip manufacturing and transfer scenarios requiring high material utilization.