Chip transfer mechanism and chip transfer method

Abstract

This invention discloses a chip transfer mechanism and a chip transfer method. The chip transfer mechanism includes a transfer substrate with a through-groove extending from the upper surface to the lower surface. The shape of the through-groove is adapted to the shape of the chip, allowing the chip to be accommodated within it. The sides of the through-groove form a frame along the chip's edge. A fixing film is also included, positioned along the junction of the frame and the chip. Part of the fixing film is adhered to the chip, and another part is adhered to the frame, allowing the chip to be transferred synchronously while the frame is being transferred. By providing a through-groove on the transfer substrate, the chip is directly accommodated within the groove, eliminating the need for edge clamping. This significantly improves the utilization rate of chip material, increasing it by more than 10%. This transfer mechanism is particularly suitable for chip manufacturing and transfer scenarios requiring high material utilization.

Description

Technical Field

[0001] This invention relates to the field of chip manufacturing, and more specifically to a chip transfer mechanism and a chip transfer method. Background Technology

[0002] Chip transfer and clamping technology is a critical step in the chip manufacturing process. During transfer, the chip's edges need to be clamped to prevent the clamping process from affecting the chip's performance. Current technology reserves blank areas around the chip specifically for clamping and transfer. These blank areas prevent the clamping device from directly contacting the chip's functional circuitry. This edge protection technology is crucial for chip yield and reliability, but it typically requires sacrificing 5%-10% of the chip area to achieve comprehensive edge protection. How to increase the usable area of ​​the chip to improve the utilization rate of chip materials remains a pressing technical problem that needs to be solved. Summary of the Invention

[0003] To address the aforementioned problems in the prior art, this invention proposes a chip transfer mechanism, comprising:

[0004] A transfer substrate is provided with a through groove extending from the upper surface to the lower surface of the transfer substrate. The shape of the through groove is adapted to the shape of the chip, and the chip can be accommodated in the through groove. The side of the through groove is a border set along the edge of the chip. A fixing film is provided along the junction of the frame and the chip. The fixing film 3 has a portion of its area adhered to the chip and a portion of its area adhered to the frame. When the frame is transferred, the chip can be transferred synchronously.

[0005] Furthermore, a gap is left between the chip and the frame, with a gap width of ≤1mm.

[0006] Furthermore, the material of the frame is selected from one or two of glass fiber reinforced epoxy resin sheets and polymethyl methacrylate.

[0007] Furthermore, the frame is made of glass fiber reinforced epoxy resin sheet.

[0008] Furthermore, the thickness of the frame is adapted to the thickness of the chip.

[0009] Furthermore, the thickness of the frame is 0.013-0.015mm, and the parallelism error is ≤0.005mm.

[0010] Furthermore, the shape of the fixing film is adapted to the shape of the chip edge, the fixing film is disposed along the chip edge, the inner end of the fixing film is adhered to the chip, and the outer end is adhered to the frame.

[0011] Furthermore, the adhesion of the fixing film to the frame is ≥1500g / in, and the adhesion of the fixing film to the chip is 800-1000g / in.

[0012] Furthermore, the fixing film is a polyimide tape, the fixing film includes a coating and an adhesive film, the adhesive film is disposed on one side of the coating, the coating is used to fix the adhesive film, the adhesive film is used to stick the frame and the chip, the thickness of the coating is 0.045~0.055mm, and the thickness of the adhesive film is 0.025~0.035mm.

[0013] A chip transfer method, using a chip transfer mechanism as described above, includes the following steps: S1. Place the transfer substrate onto the chip, and house the chip in the through slot. The edge of the transfer substrate is located at the edge of the chip, and a gap is left between the edge and the chip. S2. Apply the fixing film, aligning the adhesive film of the fixing film with the chip and the frame, so that part of the fixing film is connected to the chip and part of the film is connected to the frame. S3. The transfer mechanism clamps the frame, transfers the frame, and synchronously transfers the chip. S4. Remove the fixing film and frame to complete the chip transfer.

[0014] The beneficial effects of this invention are: 1) Material utilization rate increased by more than 10%: By setting through slots on the transfer substrate, the chip is directly accommodated in the through slots, eliminating the need to leave blanks at the edges for clamping, which significantly improves the utilization rate of chip materials by more than 10%. This transfer mechanism is particularly suitable for chip manufacturing and transfer scenarios that require high material utilization. 2) Simple structure: A through slot is set on the transfer substrate, and the side of the slot naturally forms a frame, eliminating the need for a complex structure; 3) Easy to operate: The chip can be transferred simply by clamping the frame, simplifying the operation steps; 4) Low manufacturing cost: FR4 glass fiber reinforced epoxy resin board is used, with moderate hardness and density, resulting in high cost-effectiveness. Attached Figure Description

[0015] The accompanying drawings, which form part of this application, are used to provide a further understanding of the invention. The illustrative embodiments of the invention and their descriptions are used to explain the invention and do not constitute an improper limitation of the invention.

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of a transfer substrate according to an embodiment of the present invention; Figure 2 This is a schematic diagram showing the positional relationship between the transfer substrate and the chip according to an embodiment of the present invention; Figure 3 This is a schematic diagram of a transfer mechanism according to an embodiment of the present invention; Figure 4 This is a schematic diagram of a transfer substrate according to another embodiment of the present invention; Figure 5 This is a schematic diagram showing the positional relationship between the transfer substrate and the chip in another embodiment of the present invention; Figure 6 This is a schematic diagram of a transfer mechanism according to another embodiment of the present invention; Figure 7 This is a schematic diagram showing the positional relationship between the transfer substrate and the chip according to another embodiment of the present invention; Figure 8 This is a schematic diagram of a transfer mechanism according to another embodiment of the present invention.

[0018] In the figure: 1. Transfer substrate; 11. Through groove; 12. Frame; 2. Gap; 3. Fixing film; 31. Inner end; 32. Outer end; 4. Chip. Detailed Implementation

[0019] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of the present invention. However, the present invention can be practiced in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0020] Furthermore, the term "and / or" in this article is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. Additionally, the character " / " in this article, unless otherwise specified, generally indicates that the preceding and following related objects have an "or" relationship.

[0021] It is understood that the mutual perpendicularity in this application is not absolute perpendicularity. Approximate perpendicularity due to processing errors and assembly errors (e.g., the included angle between two structural features is 89.9°) is also within the scope of mutual perpendicularity in this application.

[0022] See appendix Figure 1-3As shown, a chip transfer mechanism in this embodiment includes a transfer substrate 1. A through groove 11 extending from the upper surface to the lower surface of the transfer substrate 1 is provided on the transfer substrate 1. The chip 4 can be accommodated in the through groove 11. The transfer substrate located on the side of the through groove 11 naturally forms a frame 12 arranged along the edge of the chip 4. When the chip 4 is accommodated in the through groove 11, the frame 12 is located at the edge of the chip 4. During the transfer of the chip 4, it is only necessary to clamp the frame 12, without clamping the chip 4. At this time, the chip 4 does not need to leave a blank for transfer clamping at the edge, which improves the utilization rate of the chip 4 material.

[0023] The shape of the through-slot 11 is adapted to the shape of the transferred chip 4, and the cross-sectional area of ​​the through-slot 11 is larger than the area of ​​the front side of the chip 4. If the chip 4 is a cuboid, then the front and back sides of the chip are rectangular, and the cross-sectional shape of the through-slot is also rectangular. See Appendix. Figure 2 and attached Figure 5 As shown. If chip 4 is cylindrical, and both its front and back sides are circular, then the cross-sectional shape of the through slot 11 will also be circular, see Appendix. Figure 7 As shown. Other examples follow the same pattern, but will not be listed here.

[0024] One or more through slots 1 are provided on the transfer substrate 1, as shown in the attached figure. Figure 2 As shown, when a single through-slot is provided on the transfer substrate, only one chip can be transferred per transfer of the substrate. When multiple through-slots are provided on the transfer substrate, each through-slot can accommodate one chip, allowing multiple chips to be transferred simultaneously per transfer of the substrate. The number of through-slots provided on the transfer substrate can be 1, 2, 3, 4, 5, 6, etc., preferably 2. See Appendix. Figure 1-3 As shown.

[0025] See appendix Figure 2 , 5 and attached Figure 7 As shown, chip 4 is housed within slot 11, with a gap 2 between chip 4 and the sidewall of slot 11. The width of gap 2 is ≤1mm. When the width of gap 2 is 0, the cross-sectional area of ​​slot 2 is approximately equal to the front or back of the chip, making it difficult to precisely fit slot 11 onto chip 4, thus increasing operational difficulty. When the width of gap 2 is greater than 1mm, the larger gap increases the stability of the fixing film 3 in simultaneously fixing chip 4 and frame 12 (transfer substrate 1). For the same area of ​​fixing film, the larger gap reduces the area of ​​the fixing film used to fix the chip and frame, requiring a larger area of ​​fixing film; otherwise, chip 4 will be difficult to stably fix within slot 11. Research has found that a gap width of 0.1-1mm balances the convenience of fitting the frame onto the chip with the stability of fixing chip 4 and slot 11. The preferred width of gap 2 is 0.5mm.

[0026] In some embodiments, the transfer substrate 1 is made of FR4, a common glass fiber reinforced epoxy resin board widely used in the electronics, electrical, and mechanical fields. It possesses good insulation properties, mechanical strength, and heat resistance. During the transfer of chip 4, only the transfer mechanism needs to clamp the frame 12, transfer the transfer substrate 1, and move the chip 4. Therefore, the hardness of the transfer substrate must meet the requirements for support, and its density must be similar to that of chip 4. PET (polyethylene terephthalate) has too low a hardness (no hardness value can be measured using a Shore hardness tester), making it unsuitable for successful clamping. While stainless steel meets the hardness requirements, its density is too high (stainless steel density 7.93 g / cm³, FR4 density 1.70-1.90 g / cm³). For the same volume of transfer base, a stainless steel transfer base is heavier, making it inconvenient for transfer. Considering various factors, research has found that the transfer base is made of FR4 abrasive board, which meets both the required hardness and density, allowing for successful transfer of chip 4 by clamping the frame 12 through the transfer mechanism.

[0027] Poly(methyl methacrylate) (PMMA) can also be used as a substrate transfer material, and its hardness and density can meet the requirements. However, the price of PMMA is about 3-4 times that of FR4. Therefore, FR4 is the preferred material for transfer substrate 1.

[0028] In some embodiments, the thickness of the transfer substrate 1 is adapted to the thickness of the chip 4. The present invention is applicable to chips 4 with a thickness of 0.013-0.015 mm, in which case the thickness of the transfer substrate 1 is 0.013-0.015 mm. Furthermore, the parallelism error of the transfer substrate 1 is within 0.005 mm to ensure that the transfer substrate 1 and the chip 4 are on the same horizontal plane, facilitating the fixing film 3 to fix the frame 12 and the chip 4. When transferring chips of other thicknesses, the thickness of the transfer substrate 1 is adjusted according to the thickness of the chip 4; this is not limited here.

[0029] The transfer mechanism also includes a fixing film 3, which is disposed along the gap 22 between the frame 12 and the chip 4. Part of the fixing film 3 is adhered to the chip 4, and part of the fixing film 3 is adhered to the frame 12. By simultaneously attaching the fixing film 3 to the surfaces of the frame 12 and the chip 4, the frame 12 and the chip 4 are connected, making the frame 12 and the chip 4 a whole. When the transfer mechanism clamps the frame 12 for transfer, the chip 4 and the frame 12 are transferred synchronously.

[0030] In some embodiments, see Appendix Figure 3 , 6As shown in Figure 8, the shape of the fixing film 3 is adapted to the shape of the edge of the chip 4, and it is set along the edge of the chip 4. The inner end 31 of the fixing film 3 is adhered to the chip 4, and the outer end 32 is adhered to the frame 12. The edges of the chip 4 are connected to the frame 12 through the fixing film 3, making the connection more secure.

[0031] In some embodiments, the fixing film 3 is elongated and multiple such films are provided, distributed along the edge of the chip 4. One end of the fixing film 3 is connected to the chip 4, and the other end is connected to the frame 12. The number of fixing films 3 depends on the actual situation, such as 4, 6, 8, 10, etc., and is not limited here.

[0032] The adhesion of the fixing film 3 to the frame 12 is ≥1500g / in to ensure the strong adhesion. The adhesion of the fixing film 3 to the chip 4 needs to be 800-1000g / in. If it is less than 800g / in, the strong adhesion cannot be guaranteed. If it is greater than 1000g / in, there is a risk of damaging the chip 4 during rework.

[0033] Fixing film 3 is polyimide tape (PI tape). Polyimide tape uses polyimide film as the base material and a modified acrylic thermosetting adhesive. PI tape possesses properties such as high and low temperature resistance, acid and alkali resistance, solvent resistance, electrical insulation (H-class), and radiation protection. It is suitable for shielding wave soldering on electronic circuit boards, protecting gold fingers, insulating high-end electrical appliances and motors, and fixing the positive and negative tabs of lithium batteries.

[0034] The fixing film 3 includes a coating and an adhesive film. The adhesive film is coated on one side of the coating and is used to fix the adhesive film. The adhesive film is used to adhere the frame 12 and the chip 4. The thickness of the coating is 0.045~0.055mm, and the thickness of the adhesive film is 0.025~0.035mm, which can meet the requirements for the adhesion of the frame 12 and the chip 4. Preferably, the thickness of the coating is 0.05mm, the thickness of the adhesive film is 0.03mm, and the total thickness of the fixing film 3 is 0.08mm.

[0035] The chip 4 transfer method includes the following steps: S1. The transfer substrate 1 is placed on the chip 4, the chip 4 is accommodated in the through slot, the frame 12 of the transfer substrate 1 is located at the edge of the chip 4, and a gap 2 is left between the frame 12 and the chip 4. S2. Attach the fixing film 3. Align the adhesive film of the fixing film 3 with the chip 4 and the frame 12, so that part of the fixing film 3 is connected to the chip 4 and part of the frame 12. S3, transfer mechanism clamping frame 12, transfer frame 12, synchronous transfer chip 4; S4. Remove the fixing film 3 and the border 12.

[0036] The transfer mechanism of chip 4 completes the transfer of chip 4. During the transfer process, it is not necessary to clamp the edge of chip 4. In other words, during the preparation of chip 4, it is not necessary to leave blanks at the edge of chip 4 for clamping, which improves the utilization rate of chip 4 material.

[0037] With 76 Taking the 113mm chip 4 as an example, when a blank space is required at the edge, the actual material usage area is 74mm². 105 = 7770mm 2 When using the transfer mechanism of this invention for transfer, without needing to leave blank areas at the edges, the actual material usage area is 76 mm². 113mm = 8588mm 2 The utilization rate of materials has been improved (8588 / 7770-1). 100% = 10.5%. The transfer mechanism disclosed in this invention has a simple structure, is easy to operate, and improves the utilization rate of chip 4 material.

[0038] In the description of this invention, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0039] It should be noted that when an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. When an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0040] The above embodiments are only for illustrating the technical concept and features of the present invention. Their purpose is to enable those skilled in the art to understand the content of the present invention and implement it. They should not be used to limit the scope of protection of the present invention. All equivalent changes or modifications made in accordance with the spirit and essence of the present invention should be covered within the scope of protection of the present invention.

Claims

1. A die transfer mechanism characterized by, The chip transfer mechanism comprises: a transfer substrate (1) provided with a through slot (11) penetrating from the upper surface to the lower surface of the transfer substrate (1), the shape of the through slot (11) being matched with the shape of a chip (4), the chip (4) being accommodated in the through slot (11), and the side of the through slot (11) being a frame (12) arranged along the edge of the chip (4); a fixing film (3) arranged along the joint of the frame (12) and the chip (4), the fixing film (3) being adhesively connected to the chip (4) at some areas and adhesively connected to the frame (12) at some other areas, so that the chip (4) is synchronously transferred when the frame (12) is transferred.

2. The die transfer mechanism of claim 1, wherein, A gap (2) is left between the chip (4) and the frame (12), and the width of the gap (2) is less than or equal to 1 mm.

3. The die transfer mechanism of claim 1, wherein, The material of the frame (12) is selected from one or both of glass fiber reinforced epoxy resin plate and polymethyl methacrylate.

4. The die transfer mechanism of claim 1, wherein, The material of the frame (12) is glass fiber reinforced epoxy resin plate.

5. The die transfer mechanism of claim 1, wherein, The thickness of the frame (12) is matched with the thickness of the chip (4).

6. The die transfer mechanism of claim 1, wherein, The thickness of the frame (12) is 0.013-0.015 mm, and the parallelism error is less than or equal to 0.005 mm.

7. The die transfer mechanism of claim 1, wherein The shape of the fixing film (3) is matched with the shape of the edge of the chip (4), the fixing film (3) is arranged along the edge of the chip (4), the inner side end (31) of the fixing film (3) is adhesively connected to the chip (4), and the outer side end (32) is adhesively connected to the frame (12).

8. The die transfer mechanism of claim 1, wherein, The adhesion of the fixing film (3) to the frame (12) is greater than or equal to 1500 g / in, and the adhesion of the fixing film (3) to the chip (4) is 800-1000 g / in.

9. The die transfer mechanism of claim 1, wherein, The fixing film (3) is a polyimide adhesive tape, which comprises a coating and an adhesive film arranged on one side of the coating, the coating is used for fixing the adhesive film, the adhesive film is used for adhering the frame (12) and the chip (4), the thickness of the coating is 0.045-0.055 mm, and the thickness of the adhesive film is 0.025-0.035 mm.

10. A chip transfer method characterized by comprising: The chip is transferred by using the chip transfer mechanism according to any one of claims 1-9, comprising the following steps: S1, the transfer substrate (1) is sleeved on the chip (4), the chip (4) is accommodated in the through slot (11), the frame (12) of the transfer substrate (1) is located at the edge position of the chip (4), and a gap (2) is left between the frame (12) and the chip (4); S2, the fixing film (3) is attached, the adhesive film of the fixing film (3) is aligned with the chip (4) and the frame (12), the fixing film (3) is connected to the chip (4) at some areas and connected to the frame (12) at some other areas; S3, the transfer mechanism clamps the frame (12), the frame (12) is transferred, and the chip (4) is synchronously transferred; S4, the fixing film (3) and the frame (12) are removed, and the transfer of the chip (4) is completed.

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