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Semiconductor chip and method for producing a semiconductor chip

A semiconductor and chip technology, applied in the field of semiconductor chips, can solve the problems of increased output efficiency, increased manufacturing cost, huge cost, etc., and achieve the effect of increased output efficiency

Active Publication Date: 2009-09-23
OSRAM OPTO SEMICONDUCTORS GMBH & CO OHG
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  • Summary
  • Abstract
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  • Application Information

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Problems solved by technology

[0003] LED semiconductor chip products have a high output efficiency (Auskoppeleffizienz), that is to say, the ratio of the number of photons emitted from the semiconductor chip to the number of photons generated in the semiconductor chip is very large. The manufacturing process of such semiconductor chip products usually costly
Therefore, in most cases, the increase in the output efficiency of LEDs is accompanied by an increase in manufacturing costs

Method used

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  • Semiconductor chip and method for producing a semiconductor chip
  • Semiconductor chip and method for producing a semiconductor chip
  • Semiconductor chip and method for producing a semiconductor chip

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Embodiment Construction

[0084] The drawings are schematic views and therefore not necessarily to scale. Furthermore, relatively small elements, in particular layer thicknesses, may be exaggerated for the sake of clarity.

[0085] Identical, similar and functionally identical elements are shown with the same reference symbols in the figures.

[0086] exist figure 1 In the schematically illustrated first exemplary embodiment of a semiconductor chip according to the invention, the semiconductor chip 1 comprises a semiconductor body 2 with a semiconductor layer sequence having an active region 21 provided for generating radiation. The semiconductor chip 2 is preferably embodied as an LED chip and serves to generate incoherent radiation. The semiconductor body 2 is fastened to the carrier 3 in a materially bonded manner by means of the connecting layer 4 . The carrier 3 has a first carrier surface 31 facing the semiconductor body and a second carrier surface 32 facing away from the semiconductor body. ...

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Abstract

A semiconductor chip (1) is specified comprising a carrier (3) and comprising a semiconductor body (2), which comprises a semiconductor layer sequence having an active region (21) provided for generating radiation, wherein: the carrier has a first carrier area (31) facing the semiconductor body (2) and a second carrier area (32) remote from the semiconductor body (2), the semiconductor body (2) is cohesively fixed to the carrier (3) by means of a connecting layer (4), and plurality of reflective or scattering elements (40, 7) are formed between the second carrier area (32) and the active region (21). A method for producing a semiconductor chip is furthermore specified.

Description

technical field [0001] The present invention relates to a semiconductor chip and a method of manufacturing the semiconductor chip. Background technique [0002] The present invention claims priority from German patent applications 10 2006 046 677.2 and 10 2007 004 302.5, the disclosures of which are hereby incorporated by reference in their entirety. [0003] LED semiconductor chip products have a high output efficiency (Auskoppeleffizienz), that is to say, the ratio of the number of photons emitted from the semiconductor chip to the number of photons generated in the semiconductor chip is very large. The manufacturing process of such semiconductor chip products Usually costly. Therefore, in most cases, an increase in the output efficiency of LEDs is accompanied by an increase in manufacturing costs. Contents of the invention [0004] The object of the present invention is to provide a semiconductor chip, in particular a semiconductor chip for LEDs, which can be produced...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/00H01L33/22
CPCH01L33/22H01L33/0079H01L33/0093
Inventor U·斯特劳斯
Owner OSRAM OPTO SEMICONDUCTORS GMBH & CO OHG
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