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Modular packaging method for led chips

A technology of LED chip and packaging method, which is applied in the field of microelectronics, can solve the problems of difficult to guarantee the lamp surface, poor reliability, short life, etc., and achieve the effects of poor wire bonding, improved connection efficiency, and high price

Active Publication Date: 2018-12-18
SHANGHAI INTEGRATED CIRCUIT RES & DEV CENT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in terms of technology, COB packaging still has shortcomings such as light decay, short life, and poor reliability. This is because COB products are sealed first. When the lamp surface is processed by reflow soldering, the high temperature of 240 degrees in the furnace will not cause damage to the lamp

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  • Modular packaging method for led chips
  • Modular packaging method for led chips
  • Modular packaging method for led chips

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Embodiment Construction

[0027] In order to make the content of the present invention clearer and easier to understand, the content of the present invention will be further described below in conjunction with the accompanying drawings. Of course, the present invention is not limited to this specific embodiment, and general replacements known to those skilled in the art are also covered within the protection scope of the present invention.

[0028] The following is attached Figure 1-11 The present invention will be described in further detail with specific examples. It should be noted that the drawings are all in a very simplified form, using imprecise scales, and are only used to facilitate and clearly achieve the purpose of assisting in describing the present embodiment.

[0029] see figure 1 , the modular packaging method of the LED chip of this embodiment includes:

[0030] Step 01: providing a packaging substrate, and insulating the surface of the packaging substrate;

[0031] Specifically, s...

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Abstract

The invention provides a modular packaging method for LED chips, comprising: providing a packaging substrate, and insulating the surface of the packaging substrate; forming a hole for placing the chip in the packaging substrate; Plating the reflective layer on the wall; coating the crystal-bonding glue at the bottom of the hole; installing the chip on the crystal-bonding glue at the bottom of the hole; coating the silica gel on the packaging substrate, and covering the copper plate on the silica gel to flatten the copper plate ; Form lead holes in the silica gel and copper plates corresponding to the top of the chip; fill the lead holes with conductive metal, and remove excess conductive metal on the surface of the copper plate; form soldering openings in the copper plate through photolithography and etching processes; Welding balls are formed in the welding holes; the invention avoids the damage to the chip caused by the high temperature of the traditional reflow soldering process, solves the problem of weak wire bonding caused by the soldering process, reduces the cost, and is suitable for large-scale production.

Description

technical field [0001] The invention relates to the technical field of microelectronics, in particular to a modular packaging method for LED chips. Background technique [0002] Packaging process technology plays a vital role in LED performance. The selection of LED packaging method, material, structure and process is mainly determined by factors such as chip structure, photoelectric / mechanical characteristics, specific application and cost. With the increase of power, especially the demand for the development of solid-state lighting technology, new and higher requirements are put forward for the optical, thermal, electrical and mechanical structures of LED packages. Traditional LED packaging uses gold wires to lead out the electrodes of the LED light-emitting chip, and at the same time uses a variety of materials to protect the light-emitting chip and gold wires, and at the same time completes the process of outputting electrical signals, protecting the normal operation of...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/00H01L33/52H01L33/62
CPCH01L33/005H01L33/52H01L33/62H01L2224/73267H01L2224/92244H01L2924/15153H01L2224/19H01L2224/32225H01L2224/32245H01L2224/18
Inventor 彭娟胡少坚陈寿面
Owner SHANGHAI INTEGRATED CIRCUIT RES & DEV CENT
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