Encapsulating cover plate and application thereof in organic electroluminescence device
A technology of encapsulation cover plate and photoextraction, which is applied in the directions of organic light-emitting devices, organic light-emitting device structures, and organic light-emitting device manufacturing/processing, etc., can solve the problems of low light extraction, restrict beam emission, etc., to improve the viewing angle and the output efficiency. , the effect of simple structure and preparation process
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Publication Date
- 2015-03-11
Smart Images
Figure 1 Figure 2 Figure 3
Abstract
Description
technical field
[0001] The invention relates to a package cover plate of an organic electroluminescent device, in particular to a package cover plate of a top-emitting organic electroluminescent device, and belongs to the technical field of flat panel display. Background technique
[0002] With the development of multimedia technology and the advent of the information society, the performance requirements of flat panel displays are getting higher and higher. Organic Light Emitting Devices (OLEDs) are active light-emitting devices. Compared with the current mainstream thin-film transistor liquid crystal display (TFT-LCD), it has high contrast, wide viewing angle, low power consumption, fast response, and compact size. Thinner and other advantages have broad application prospects, such as OLED lighting, and are also regarded as one of the highly competitive future flat panel display technologies.
[0003] The basic structure of organic light emitting devices (Organic Light Em...
Examples
Embodiment 1
[0037] see figure 2 , the organic electroluminescent device described in this embodiment includes a substrate 1, and the substrate 1 and the packaging cover plate 4 are hermetically connected through a sealing medium 3, and the packaging cover plate 4 and the substrate The device 2 is accommodated in the closed space formed by 1. Wherein the packaging cover plate 4 includes a high refractive index region 5 and a low refractive index region 6 , and the high refractive index region 5 and the low refractive index region 6 are mixed and distributed. The sealing medium 3 is made of UV colloid and / or Frit packaging material, and the substrate 1 and the packaging cover plate 4 are connected together by ultraviolet light and laser melting respectively.
[0038] In this embodiment, the package cover plate 4 is a photosensitive glass whose refractive index changes due to light, and the photosensitive glass exhibits a mixed distribution of high refractive index regions 5 and low refrac...
Embodiment 2
[0043] Such as image 3 As shown, the organic electroluminescence device described in this embodiment includes a substrate 1, and the substrate 1 and the packaging cover plate 4 are hermetically connected through a sealing medium 3, and the packaging cover plate 4 and the The device 2 is accommodated in the closed space formed by the substrate 1 . Wherein, the packaging cover plate 4 is a transparent substrate 8 with a photosensitive material layer 7 on the lower surface, and the photosensitive material layer 7 exhibits a mixed distribution of high refractive index regions 5 and low refractive index regions 6 through interference pattern irradiation. The photosensitive material layer 7 is a lithium niobate layer.
[0044] As a variable embodiment of the present invention, the photosensitive material layer 7 can also be an ultraviolet photorefractive crystal material layer such as lithium niobate, magnesium or zinc doped lithium niobate, lithium borate, etc., an acrylamide-bas...
Embodiment 3
[0048] Such as Figure 4 As shown, the organic electroluminescence device described in this embodiment includes a substrate 1, and the substrate 1 and the packaging cover plate 4 are hermetically connected through a sealing medium 3, and the packaging cover plate 4 and the The device 2 is accommodated in the closed space formed by the substrate 1 . Wherein, the packaging cover plate 4 is a transparent substrate 8 with a photosensitive material layer 7 disposed on its upper surface. The photosensitive material layer 7 presents high refractive index regions 5 and low refractive index regions 6 in a mixed distribution through the interference pattern irradiation. The photosensitive material layer 7 is an acrylamide-based photopolymer layer.
[0049] Such as Figure 10 As shown, the high-refractive-index regions 5 and low-refractive-index regions 6 described in this embodiment are distributed in a regular array. The low-refractive-index region 6 includes several lateral low-re...