The application belongs to the technical field of
semiconductor devices, and particularly relates to a van der Waals
homojunction microspectrometer based on material thickness gradient change, which comprises a
Si substrate, a SiO2 substrate, a gate, a BN substrate, a source, a drain, and a van der Waals
homojunction. The SiO2 substrate is arranged at the top end of the
Si substrate, the gate is arranged at the top end of the SiO2 substrate, and the BN substrate is arranged at the top end of the gate. The van der Waals
homojunction is arranged at the top end of the BN substrate, and the thickness of the van der Waals homojunction changes from thick to thin in a gradient manner from one side to the other side. The source is arranged at the thicker side of the van der Waals homojunction, and the drain is arranged at the thinner side of the van der Waals homojunction. By controlling the thickness change of the homojunction, the energy band structure of the homojunction can be effectively regulated, and the efficient separation and transmission of interlayer carriers can be induced. In combination with an optimized spectrum
reconstruction algorithm, high-dimensional photoelectric response data collected based on the homojunction can be quickly analyzed, and high-precision reconstruction of incident spectrum can be realized.