Transition metal chalcogenide homojunction, homojunction diode and preparation of homojunction
A technology of transition metal chalcogenides and compounds, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve problems such as dopant shedding, affecting doping stability, and affecting the life of homojunctions, achieving high Softness and the effect of improving photoelectric conversion efficiency
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Embodiment 1
[0032] A preparation method of transition metal chalcogenide homojunction, specifically comprising the following steps:
[0033] (1) Clean the silica substrate: put the 2.5*2.5cm silica substrate into acetone, ethanol, and deionized water successively, and after ultrasonic cleaning for 10 minutes in each solution, take it out and dry it with nitrogen;
[0034] (2) Chemical vapor deposition grows a single layer of molybdenum disulfide, using sulfur powder and molybdenum trioxide as reactants, preparing and depositing it on the surface of silicon dioxide cleaned in step (1) at 860°C to obtain molybdenum disulfide with a substrate Nanosheets; the formed monolayer molybdenum disulfide is a regular triangle, and the side length of the regular triangle is about 100 microns;
[0035] (3) Build a protective layer: Spin-coat PMMA glue (protective layer) on top of the molybdenum disulfide nanosheets with the substrate, and then expose half of the molybdenum disulfide nanosheets (unprote...
Embodiment 2
[0043] A preparation method of transition metal chalcogenide homojunction, specifically comprising the following steps:
[0044] (1) Clean the silicon dioxide substrate: put the molybdenum diselenide substrate into acetone, ethanol, and deionized water successively, and after ultrasonic cleaning in each solution for 10 minutes, take it out and dry it with nitrogen;
[0045] (2) Growth of monolayer molybdenum diselenide by chemical vapor deposition: after chemical vapor deposition onto the silicon dioxide surface cleaned in step (1), molybdenum diselenide nanosheets with a substrate are obtained;
[0046] (3) Suspending a part of the molybdenum diselenide nanosheet area, soaking the unsuspended area of the transition metal chalcogenide nanosheet in formic acid solution for 20-30min, and then cleaning it with deionized water to prepare Transition metal chalcogenide homojunctions.
Embodiment 3
[0048] A preparation method of a transition metal chalcogenide homojunction diode, specifically comprising the following steps:
[0049] (1) On a silicon dioxide substrate, pattern poly-3,4-ethylenedioxythiophene / polystyrenesulfonic acid (PEDOT:PSS) by suitable means; the patterning technique can be UV exposure or laser interference.
[0050] (2) Using traditional PMMA wet transfer method to transfer molybdenum disulfide nanosheets to the target substrate, during this process, dry and heat at 60°C to remove deionized water; assist in the realization of acid treatment repair;
[0051] (3) Using electron beam exposure technology, ultraviolet exposure ultraviolet or gold wire method, combined with electron beam evaporation and thermal evaporation deposition electrodes, to prepare transition metal chalcogenide homojunction diodes.
[0052] A transition metal chalcogenide homojunction diode, obtained by the above preparation method, the structure of the transition metal chalcogeni...
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