The invention relates to a
photoresist for the production of nanostructures, a method using this
photoresist for multi-
photon 3D
lithography for the production of nanostructures with a high
refractive index, in particular for the production of a
semiconductor structure on a substrate. The object of the invention, to provide an optimized
photoresist for the production of nanostructures, and a method using this photoresist for the direct 3D
laser structuring of nanostructures on a substrate, wherein the optimized photoresist exhibits good adhesion, increased lifetime, and increased
laser light sensitivity, is achieved by providing the photoresist in the form of butyldithiocarbamic acid or
carbon disulfide and n-
butylamine, as well as at least one
metal oxide or
metal hydroxide and
ethanol, with the addition of the components
antimony(III)
oxide, amorphous or crystalline
antimony(III) trisulfide, n-
nonane, isooctane,
hexanol,
polyethylene glycol 200, 300, or 400,
polyethylene glycol,
octanol,n-
Propylamine,
chloroform, and water are provided, and all components are heated with stirring at a speed of 50 to 1500 rpm and at temperatures in the range of 25-100°C for a time in the range of 60 to 720 min, and then cooled to
room temperature, and that this photoresist is used as a negative
resist in a multi-3D
lithography process for the fabrication of nanostructures by
etching metal chalcogenide nanostructures with high
refractive index and
high resolution.