Serially connected type perovskite/homojunction silicon laminated solar cell and preparation method thereof
A technology of solar cells and perovskite, applied in the field of solar cells, can solve the problem of high preparation cost
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[0053] The invention provides a method for preparing a tandem perovskite / homojunction silicon laminated solar cell comprising the following steps:
[0054] Step 1: Texturing the surface of n-type silicon 4 with but not limited to alkaline solution.
[0055] Step 2: using but not limited to phosphorous compound to partially or fully diffuse phosphorous on the back of the silicon to form a heavily doped junction to form a partial or all n-type heavily doped layer 3 .
[0056] Step 3: Using but not limited to tubular boron diffusion or chain boron diffusion to expand boron on the front of the battery to form a p-type heavily doped emitter 5 .
[0057] Step 4: using but not limited to thermal growth, atomic deposition (ALD) or plasma enhanced chemical vapor deposition (PECVD) to prepare a bottom electrode passivation layer on the silicon backside.
[0058] Step 5: using but not limited to the method of opening holes by laser etching to make holes in the bottom electrode to prepar...
Embodiment 1
[0071] In this embodiment, silver electrode / n+ / SiO 2 / n-type silicon / p+ / SnO 2 / Perovskite light-absorbing layer / Spiro-OMeTAD / Ultra-thin Cu / Ag metal electrode structure to prepare tandem perovskite / homojunction silicon tandem solar cells.
[0072] The specific preparation process is as follows: adopt the n-type silicon wafer 4 with a resistivity of 5 ohm-cm prepared by the suspension zone melting method; use alkali to make texture on the back of the n-type silicon wafer; Type heavily doped layer 3; positive boron expansion to form pn homojunction to form p-type heavily doped emitter 5, junction depth 2μm; silicon cell surface prepared by thermal growth method SiO 2 After the ultra-thin passivation layer, local opening is performed to prepare the bottom electrode opening passivation layer 2; finally, a 1-micron silver electrode is evaporated to prepare the metal bottom electrode 1; the front surface of the silicon wafer is directly treated with ozone to obtain ultra-thin SiO 2...
Embodiment 2
[0074] In this embodiment, silver electrode / n+ / SiO 2 / n-type silicon / p+ / SiO 2 / SnO 2 / Perovskite Light Absorbing Layer / Spiro-OMeTAD / MoO x / ITO / Ag gate electrode / MgF 2 Structure preparation of tandem perovskite / homojunction silicon tandem solar cells.
[0075]The specific preparation process is as follows: adopt the n-type silicon wafer 4 with a resistivity of 5 ohm-cm prepared by the suspension zone melting method; use alkali to make texture on the back of the n-type silicon wafer; type heavily doped layer 3; the front side is expanded with boron to form a pn homojunction to form a p-type heavily doped emitter 5 with a junction depth of 3 μm; the silicon cell surface is prepared by thermal growth of SiO 2 After the ultra-thin passivation layer, local opening is performed to prepare the bottom electrode opening passivation layer 2; finally, a 1-micron silver electrode is evaporated to prepare the metal bottom electrode 1; the front surface of the silicon wafer is directly t...
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