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472 results about "Zone melting" patented technology

Zone melting (or zone refining or floating zone process or travelling melting zone) is a group of similar methods of purifying crystals, in which a narrow region of a crystal is melted, and this molten zone is moved along the crystal. The molten region melts impure solid at its forward edge and leaves a wake of purer material solidified behind it as it moves through the ingot. The impurities concentrate in the melt, and are moved to one end of the ingot. Zone refining was invented by John Desmond Bernal and further developed by William Gardner Pfann in Bell Labs as a method to prepare high purity materials, mainly semiconductors, for manufacturing transistors. Its first commercial use was in germanium, refined to one atom of impurity per ten billion, but the process can be extended to virtually any solute-solvent system having an appreciable concentration difference between solid and liquid phases at equilibrium. This process is also known as the float zone process, particularly in semiconductor materials processing.

Method for preparing vacuum zone melting high resistant silicon single crystal

The invention discloses a method for preparing vacuum zone melting high resistant silicon single crystal, comprising the two sequential major processes: polysilicon purification and crystal forming of silicon single crystal, wherein, the process of polysilicon purification comprises the steps of cleaning fire, charging, evacuating, preheating, melting materials heat sealing, growing narrow necks, shouldering, shoulder circuiting, equating diameter, ending and repeating; the process of crystal forming of silicon single crystal comprises the steps of cleaning fire, charging, evacuating, preheating, processing of chemicals, crystal seeding, shouldering, shoulder circuiting, equating diameter, ending and blowing out. With the method of the invention adopted to prepare silicon single crystal, electric resistivity, ultra-high purity, resistivity profile, uniformity of cross-section electric resistivity and minority carrier lifetime are greatly improved; purity of the silicon single crystal is above 11N, electric resistivity reaches 8000 omega/cm-30000omega/cm, uniformity of cross-section electric resistivity is less than 15%, and minority carrier lifetime is more than 600-1000Mus, thus greatly improving performance, stability and safety of the devices while realizing mass production of vacuum zone melting high resistant silicon single crystal.
Owner:峨嵋半导体材料研究所

Method and system for controlling automatic growth of zone-melt crystal by adopting diameter process

The invention relates to a method and system for controlling automatic growth of zone-melt crystal by adopting a diameter process. The method comprises the steps of: setting a growing interval and inputting control parameters; opening a control program when the diameter is more than 50 mm; judging the growing interval by the program according to the detected single crystal diameter and dispatching and calculating the interval parameters; controlling according to the parameters and the calculated value; running the program in the next interval after finishing growing until entering the isometrical growing step; and controlling according to a preset value of a keeping power. The system for controlling automatic growth of zone-melt crystal by adopting the diameter process comprises a PLC controller, a PC, a camera, a generator, a touch screen, an upper-rotating servo motor, a lower-rotating servo motor, a speed-increasing servo motor and a speed-reducing servo motor, a polycrystal rotating motor and a monocrystal rotating motor, a polycrystal descending motor and a monocrystal descending motor, an electromagnetic valve, a flowmeter and a sensor. According to the method and the systemin the invention, the capacity of a zone-melting process for producing large-diameter monocrystals is improved greatly; the artificial error and loss in the zone-melting process are reduced; the working intensity of growing the monocrystals in the zone-melting process is reduced; and the consistency of the monocrystals can be improved effectively.
Owner:ZHONGHUAN ADVANCED SEMICON MATERIALS CO LTD +1

10<5> K/cm temperature gradient directional solidification device and directional solidification method

The invention relates to a 10<5> K / cm temperature gradient directional solidification device and a directional solidification method. The 100000 K / cm temperature gradient directional solidification device is characterized in that laser light generated by a laser horizontally passes through a plate lens to enter a vacuum chamber, intersects vertically the axis of a drawing system, and is used for heating a preform; and liquid gallium-indium-tin alloy serves as cooling medium. The distance between the lower surface of a melting zone and the liquid level of the liquid gallium-indium-tin alloy is 1mm to 5 mm. When directional solidification is performed to the preform, the power of the laser is increased to 200 w to 1400 w. After the preform is zone-melted, a drawing mechanism is started to enable the preform to move at the speed of 1 to 300 microns per second and to be cooled, so that directional solidification of the preform is accomplished. In the invention, laser floating zone melting is combined with liquid metal cooling, so that the obtained oxide eutectic in-situ composite is uniform in structure, fine and compact, has good directing property, and is remarkably improved in mechanical property and other functions, the sizes and the shapes of produced function materials can satisfy the application of various photoelectric components.
Owner:NORTHWESTERN POLYTECHNICAL UNIV

Preparation method of tungsten carbide particle enhanced steel-base surface layer composite bar

The invention discloses a preparation method of a tungsten carbide particle enhanced steel-base surface layer composite bar. The method comprises the following steps of: coating recarbonizer on the cavity surface of a sand mould; acid-washing the tungsten filament to be used as a strengthening phase and making into a spiral shape; placing the spiral-shaped tungsten filament in the cavity, and pouring, wherein after the metal liquid is solidified to room temperature, a metal steel bar is obtained; removing rust of the surface of the metal bar; then coating a support film on the outer surface of the metal bar; after the support film is dried, performing surface rapid zone melting through a zone melting sensor, and performing rapid solidification, wherein the heating temperature for the surface rapid zone melting is controlled to be 20-30 DEG C higher than the melting point of the base material; after the zone melting, performing thermal treatment on the metal bar; and then performing cutting, mechanical straightening and the like to achieve the required size to finally obtain the tungsten carbide particle enhanced steel-base surface layer composite bar. The tungsten carbide particleenhanced steel-base surface layer composite bar not only maintains the characteristics of good toughness and plasticity of metal materials, but also has strong wear resistance. The thickness of a WC composite layer can reach 10-15 mm, and the hardness HRC can reach 50-56. The invention is easy to realize large-scale industrial production.
Owner:XI'AN UNIVERSITY OF ARCHITECTURE AND TECHNOLOGY

Short-flow high-efficiency preparation method of thin high-silicon electrical steel strip

ActiveCN101886215AImprove organizational structureImprove the shape of the precipitated phaseMetal rolling arrangementsSurface oxidationWhole body
The invention discloses a short-flow high-efficiency preparation method of a thin high-silicon electrical steel strip, which belongs to the field of metal material preparation and processing. The short-flow high-efficiency preparation method of the thin high-silicon electrical steel strip is characterized by comprising the following steps of: preparing a column-shaped crystal rod blank or plate blank, which contains more than 80 percent (100) of silk texture, from a Fe-(6.5 wt percent) Si alloy blank and by using zone melting directional solidification technology; keeping the rod blank or the plate blank at the temperature of between 700 and 1,000 DEG C in an argon protective atmosphere for 1 to 5 hours and then performing quenching treatment, and removing the oxide skin on the surface of the quenched rod blank or the quenched plate blank by a mechanical method or manual grinding; wrapping the rod blank or the plate blank by using stainless steel, common carbon steel or pure iron as a wrapping material, heating the whole body after the wrapping and performing middle-temperature rolling; and peeling the wrapped sheath, washing the high-silicon electrical steel with acid and then performing room-temperature rolling to obtain the thin high-silicon electrical strip with a splendid surface. The short-flow high-efficiency preparation method of the thin high-silicon electrical steel string has the advantages that: the yield of the thin strip prepared by the process approaches 100 percent; the prepared thin high-silicon electrical steel strip has a splendid surface and a uniform texture, the minimal bending radius is less than 2.5 millimeters, and the thin high-silicon electrical steel strip can be directly coiled to form an annular core of a transformer or an inductor and also can be prepared into high-silicon electrical steel through subsequent treatment.
Owner:UNIV OF SCI & TECH BEIJING

Thermal system and process for controlling 8-inch zone melting silicon monocrystals

The invention relates to a thermal system and a process for controlling 8-inch zone melting silicon monocrystals. The thermal system comprises a coil and a heat insulating bucket; two sides outside a furnace with the same height of the coil 1 are provided with magnetic field generators for generating transverse magnetic fields; and a reflector for reflecting heat of a melting zone is arranged between the coil and the heat insulating bucket. The process comprises the following steps of: when the shoulder expanding diameter reaches 100mm, extending the reflector to form a heat insulating circle at the peripheries of the silicon monocrystals, opening the magnetic field generators, ensuring that the height of the melting area above the silicon monocrystals is 3-5mm in the shoulder expanding process; and when the diameter of the silicon monocrystals reaches 205mm, rotating an arm, wherein the furnace pressure is 4-8bar in the equal diameter keeping process. Because the newly designed zone melting silicon monocrystal thermal system is adopted and process parameters are adjusted, 8-inch zone melting silicon monocrystals are drawn successfully, the problems of temperature fluctuation and fusion flow fluctuation in large-diameter silicon monocrystal forming difficulties are solved, dislocation is avoided and reduced, and the requirement of the market on the 8-inch zone melting silicon monocrystals is met.
Owner:ZHONGHUAN ADVANCED SEMICON MATERIALS CO LTD +1

Method for preparing aluminum oxide-based eutectic ceramic through laser powder feeding method

ActiveCN102557596ASolve the bottleneck problem of engineering applicationReduce thermal stressZone meltingCrystal growth
The invention relates to a method for preparing aluminum oxide-based eutectic ceramic through a laser powder feeding method. By the method, the thermal stress in the zone-melting process is reduced by heating the eutectic ceramic, so that crack generated in the powder melting process is reduced. The powder is conveyed to be in front of a layer molten pool, laser zone-melting orienting solidification is finished when the powder falls off a substrate, power is conveyed continuously by using a powder feeding device on the eutectic ceramic surface, the powder on a second layer is molten through laser zone-melting, and the power and the laser zone-melting eutectic ceramic are molten and combined into a whole. Repeatedly, the large-volume eutectic ceramic material is prepared by a laser quick forming method. In the heating and forming process, the powder feeding quantity laser power, the scanning speed and the facula are controlled and high-purity inert gas is introduced, so that air in thefurnace body can be escaped completely, air holes in the forming material are eliminated and stable growth of the crystal is realized. Powder is repeatedly molten into a matrix the method of repeatedaccumulation and multi-time cladding, so that the large-volume eutectic ceramic can be prepared.
Owner:NORTHWESTERN POLYTECHNICAL UNIV

Bismuth telluride based N type thermoelectric material and preparation method thereof

The invention discloses a preparation method of a bismuth telluride based N type thermoelectric material Bi2(Te<1-x>Se<x>)3. A melt mixing step and a zone melting step are used for synthesis. The synthesis method comprises that single-substance raw materials can be selected and weighed according to a chemical formula Bi2(Te<1-x>Se<x>)3 in which x is greater than or equivalent to 0.02 and lower than or equivalent to 0.1, metal antimony (Sb) in the weight percentage of 0.01% to 0.03% and nonmetal iodine (I) in the weight percentage of 0.03% to 0.06% are added on the basis of the weight obtained by weighing, and the purities of all the single-substance raw materials are greater than 4N; the materials are filled into a quartz tube whose bottom is relatively flat by sintering to implement vacuum-pumped tube sealing, and then filled into a rocking furnace of resistance heating, and the quartz tube is placed in a vertical position and then sintered by melt mixing synthesis. The quartz tube is cooled naturally to the room temperature after sintering, and then removed and placed in a melting furnace in a vertical zone for pulse zone melting. The bismuth telluride based N type thermoelectric material and the preparation method thereof have the advantages that the preparation method is simple, a high-density body material of a monocrystalline similar structure and including a few of inlaid nanometer crystal grains can be obtained, via measurement, the ZT value of the thermoelectric material Bi2(Te<1-x>Se<x>)3 can reach 1.33 during 340K, and the material can be applied to fields including waste heat recovery and space exploration.
Owner:SUZHOU UNIV OF SCI & TECH +1

Zone melting furnace for purifying crystalline silicon and method for purifying crystalline silicon

The invention provides a method for purifying crystalline silicon, comprising a furnace body and an induction heating device which is arranged in the furnace body. The induction heating device comprises a multi-loop induction coil and an induction short circuit ring; the induction short circuit ring comprises an induction short circuit upper ring which is arranged above the multi-loop induction coil and an induction short circuit lower ring which is arranged below the multi-loop induction coil. The multi-loop induction coil can provide larger power so as to increase a melting area of a crystalline silicon rod and obtain the crystalline silicon with high purity. In order to prevent the melting area from dropping off after the melting area is increased, the upper part and lower part of the multi-loop induction coil are provided with two induction short circuit rings so that a part of a leakage magnetic field generated by the multi-loop induction coil generates high-frequency current on the two induction short circuit rings; the high-frequency current respectively generates an induction magnetic field; the tension of the liquid surface of the melting area is increased by action force generated by the induction magnetic field on the induction short circuit ring and a melting area magnetic field of the crystalline silicon rod, thereby preventing the melting area from dropping off.
Owner:YINGLI GRP
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